Multi-card subsystem for embedded computing systems

Patent metadata

Field	Value
Publication number	US-11071221-B2
Application number	US-201816232391-A
Country	US
Kind code	B2
Filing date	Dec 26, 2018
Priority date	Dec 26, 2018
Publication date	Jul 20, 2021
Grant date	Jul 20, 2021

Abstract

A mounting frame apparatus is provided for embedding cards within an electronics system and includes a multi-card swappable subsystem. The apparatus further includes a chassis for containing the multi-card swappable subsystem. One or more heatsinks are used for cooling cards disposed in the four-card swappable subsystem.

First claim

What is claimed is:

1. A mounting frame apparatus for embedding cards within an electronics system, comprising:
a four-card swappable subsystem;
a chassis for containing the four-card swappable subsystem, wherein the chassis includes slots with pairs of grooves in a spaced facing relationship for swapping cards in and out of the chassis for plug and play;
wherein the grooves are U-shaped formed in the outside walls of the chassis for each of the four swappable individual cards;
a cooling structure for supplying cooling air to the four-card swappable subsystem; and
a single heatsink for cooling multiple cards is integrally formed in the four-card swappable subsystem, wherein the single heatsink is attached to the multiple cards and is a common heatsink for the multiple cards.

2. The apparatus of claim 1 , wherein the chassis is a scalable chassis that holds additional cards.

3. The apparatus of claim 2 , wherein the number of additional cards is more than four.

4. The apparatus of claim 1 further comprising an aluminum frame.

5. The apparatus of claim 1 , wherein the four-card swappable system is configured as an application-specific suite.

6. The apparatus of claim 5 , wherein the application-specific suite is a video processing suite, a trusted communications suite, a trusted storage suite, or an imaging suite.

7. The apparatus of claim 1 , wherein the chassis is configured to contain additional four-card swappable systems for providing multiple application suites.

8. The apparatus of claim 7 , wherein the multiple application suites contain two suites selected from the group that includes a video processing suite, a trusted communications suite, a trusted storage suite, and an imaging suite.

9. The apparatus of claim 1 , wherein the chassis is configured to have a module frame-to-heatsink contact for cooling the cards.

10. The apparatus of claim 1 , wherein the cooling structure supplies cooling air through a single fan or ducted cooling air to be distributed to four 3U sized circuit cards configured around the single heatsink;
wherein the single heatsink is centralized with respect to the four-card swappable subsystem;
wherein the chassis is an extruded chassis of conductive material.

11. A mounting frame apparatus for embedding cards within an electronics system, comprising:
a four-card swappable subsystem;
a chassis for containing the four-card swappable subsystem, wherein the chassis includes slots with pairs of grooves in a spaced facing relationship for swapping cards in and out of the chassis for plug and play;
wherein the grooves are U-shaped formed in the outside walls of the chassis for each of the four swappable individual cards;
a cooling structure for supplying a cooling fluid to the four-card swappable subsystem; and
a single heatsink for cooling multiple cards is integrally formed in the four-card swappable subsystem, wherein the single heatsink is attached to the multiple cards and is a common heatsink for the multiple cards;
wherein the cooling structure includes a condenser channel and an evaporator channel so that heat generated during operation of the embedded cards is exhausted into ambient environment.

12. The apparatus of claim 11 , wherein the cooling structure includes internal cavities to the heatsink structure for transporting the heat from rail portions of the chassis.

13. The apparatus of claim 11 , wherein the cooling structure includes an internal heat pipe configuration for conveying heat away from the embedded cards.

14. The apparatus of claim 11 , wherein the fluid is air or a cooling liquid.

15. The apparatus of claim 11 , wherein the cooling structure supplies cooling air through a single fan or ducted cooling air to be distributed to four 3U sized circuit cards configured around the single heatsink.

16. The apparatus of claim 11 , wherein the single heatsink is centralized with respect to the four-card swappable subsystem.

17. The apparatus of claim 11 , wherein the chassis contains a card rail module that includes a pair of card rails arranged in a spaced facing relationship for holding a circuit card therebetween.

18. The apparatus of claim 17 further comprising a power supply electrically coupled to the card rail module and configured to power the embedded cards.

19. The apparatus of claim 17 , wherein the cooling structure is operable to draw a cooling fluid through the card rail module.

20. The apparatus of claim 11 , wherein the chassis is configured to contain additional four-card swappable systems for providing multiple application suites.

Assignees

• General Dynamics Mission Systems Inc

Inventors

• Holahan Michael M
• Bober Nick R

Classifications

• H05K5/0269 Primary

  Card housings therefor, e.g. covers, frames, PCB · CPC title

• G06F1/20 Primary

  Cooling means · CPC title

• H05K7/20163

  the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels · CPC title

• F28D15/0275

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• H05K7/20318

  Condensers · CPC title