Diamond-coated composite heat sinks for high-power laser systems

Patent metadata

Field	Value
Publication number	US-11070023-B2
Application number	US-201816223339-A
Country	US
Kind code	B2
Filing date	Dec 18, 2018
Priority date	Dec 19, 2017
Publication date	Jul 20, 2021
Grant date	Jul 20, 2021

Abstract

In various embodiments, laser systems feature beam emitters thermally coupled to heat sinks comprising, consisting essentially of, or consisting of a metal-matrix composite of a thermally conductive metal and a refractory metal. At least a portion of the surface of the heat sink is treated to form a depleted region, and a diamond coating is deposited within and/or over the depleted region. The depleted region is substantially free of the thermally conductive metal or contains the thermally conductive metal at a concentration less than that of the body of the heat sink.

First claim

The invention claimed is:

1. A method of heat sink preparation, the method comprising:
providing a heat sink comprising a metal-matrix composite of a thermally conductive metal and a refractory metal, the heat sink containing the thermally conductive metal at a first concentration;
etching at least a portion of a surface of the heat sink to deplete at least a portion of the thermally conductive metal therefrom, thereby forming on the at least a portion of the surface a depleted region comprising the refractory metal; and
depositing a coating comprising diamond over the depleted region,
wherein (i) the heat sink comprises a fluid inlet and a fluid outlet, (ii) the at least a portion of the surface of the heat sink is disposed in a portion of the heat sink fluidly coupled to the fluid inlet and the fluid outlet, and (iii) a thickness of the coating ranges from approximately 2 μm to approximately 5 μm.

2. The method of claim 1 , wherein the depleted region comprises the thermally conductive metal at a second concentration lower than the first concentration.

3. The method of claim 2 , wherein a concentration of the thermally conductive metal in the depleted region increases in a direction away from the surface of the heat sink.

4. The method of claim 1 , wherein the depleted region is substantially free of the thermally conductive metal.

5. The method of claim 1 , wherein the thermally conductive metal comprises at least one of Cu or Ag.

6. The method of claim 1 , wherein the refractory metal comprises at least one of W, Mo, or Ti.

7. The method of claim 1 , wherein (i) the thermally conductive metal comprises Cu and (ii) the refractory metal comprises W.

8. The method of claim 1 , wherein the coating is deposited by chemical vapor deposition.

9. The method of claim 1 , wherein a thickness of the depleted region ranges from approximately 1 μm to approximately 10 μm.

10. The method of claim 1 , wherein the at least a portion of the surface of the heat sink is etched using a solution comprising (i) ferric chloride, (ii) acetic acid and hydrogen peroxide, or (iii) hydrochloric acid and hydrogen peroxide.

11. The method of claim 1 , wherein at least part of the at least a portion of the surface of the heat sink is disposed within a conduit internal to the heat sink.

12. The method of claim 1 , further comprising thermally coupling a beam emitter to the heat sink.

13. The method of claim 1 , wherein the thermally conductive metal comprises at least one of Ag, Al, or Au.

14. The method of claim 1 , wherein the refractory metal comprises at least one of Ti, Nb, Ta, Re, Zr, Hf, Ru, Os, Ir, or Rh.

15. The method of claim 1 , wherein the at least a portion of the surface of the heat sink is etched using a solution comprising (i) ferric chloride, or (ii) acetic acid and hydrogen peroxide.

16. A method of heat sink preparation, the method comprising:
providing a heat sink comprising a metal-matrix composite of a thermally conductive metal and a refractory metal, the heat sink containing the thermally conductive metal at a first concentration;
etching a first portion of a surface of the heat sink to deplete at least a portion of the thermally conductive metal therefrom, thereby forming on the first portion of the surface a depleted region comprising the refractory metal;
prior to etching the first portion of the surface of the heat sink, masking a second portion of the surface of the heat sink to prevent etching thereof; and
depositing a coating comprising diamond over the depleted region,
wherein a thickness of the coating ranges from approximately 2 μm to approximately 5 μm.

17. The method of claim 1 , further comprising roughening at least a portion of the depleted region prior to deposition of the coating.

18. The method of claim 16 , wherein the depleted region comprises the thermally conductive metal at a second concentration lower than the first concentration.

19. The method of claim 18 , wherein a concentration of the thermally conductive metal in the depleted region increases in a direction away from the surface of the heat sink.

20. The method of claim 16 , wherein the depleted region is substantially free of the thermally conductive metal.

21. The method of claim 16 , wherein the thermally conductive metal comprises at least one of Cu or Ag.

22. The method of claim 16 , wherein the refractory metal comprises at least one of W, Mo, or Ti.

23. The method of claim 16 , wherein (i) the thermally conductive metal comprises Cu and (ii) the refractory metal comprises W.

24. The method of claim 16 , wherein the coating is deposited by chemical vapor deposition.

25. The method of claim 16 , wherein a thickness of the depleted region ranges from approximately 1 μm to approximately 10 μm.

26. The method of claim 16 , wherein the first portion of the surface of the heat sink is etched using a solution comprising (i) ferric chloride, (ii) acetic acid and hydrogen peroxide, or (iii) hydrochloric acid and hydrogen peroxide.

27. The method of claim 16 , wherein at least part of the first portion of the surface of the heat sink is disposed within a conduit internal to the heat sink.

28. The method of claim 16 , wherein (i) the heat sink comprises a fluid inlet and a fluid outlet, and (ii) at least part of the first portion of the surface of the heat sink is fluidly coupled to the fluid inlet and the fluid outlet.

29. The method of claim 16 , further comprising thermally coupling a beam emitter to the heat sink.

30. The method of claim 16 , further comprising roughening at least a portion of the depleted region prior to deposition of the coating.

31. The method of claim 16 , wherein the thermally conductive metal comprises at least one of Ag, Al, or Au.

32. The method of claim 16 , wherein the refractory metal comprises at least one of Ti, Nb, Ta, Re, Zr, Hf, Ru, Os, Ir, or Rh.

33. The method of claim 16 , wherein the first portion of the surface of the heat sink is etched using a solution comprising (i) ferric chloride, or (ii) acetic acid and hydrogen peroxide.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Tayebati Parviz
• Reyes Myrna
• Wu Xiuying

Classifications

• C23F1/02 Primary

  Local etching · CPC title

• H01S5/4062

  with an external cavity or using internal filters, e.g. Talbot filters · CPC title

• B21D53/02

  heat exchangers {or parts thereof}, e.g. radiators, condensers {fins, headers}(making finned or ribbed tubes by fixing strip material or the like to tubes B21C37/22) · CPC title

• H01S5/02345

  Wire-bonding · CPC title

• H01S5/02423

  Liquid cooling, e.g. a liquid cools a mount of the laser · CPC title