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Encapsulating method and encapsulating structure of OLED display substrate and display device
US11069875B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11069875-B2 |
| Application number | US-201815988384-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 24, 2018 |
| Priority date | Sep 22, 2017 |
| Publication date | Jul 20, 2021 |
| Grant date | Jul 20, 2021 |
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- Title
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Abstract
Official abstract text for this publication.
An encapsulating method and an encapsulating structure of an organic light-emitting diode (OLED) display substrate and a display device are provided. The encapsulating method of the OLED display substrate includes: encapsulating together the OLED display substrate and a encapsulating cover having a deformation functional layer, in which the deformation functional layer is disposed in an encapsulating chamber formed between the OLED substrate and the encapsulating cover; there are gaps between a display functional layer on the OLED display substrate and the deformation functional layer; the deformation functional layer can be deformed under the action of electric field; and controlling the electric field applied to the deformation functional layer, and allowing the deformation functional layer to fill the entire encapsulating chamber.
First claim
Opening claim text (preview).
What is claimed is: 1. An encapsulating method of an organic light-emitting diode (OLED) display substrate, comprising: encapsulating together an OLED display substrate and an encapsulating cover having a deformation functional layer provided on the encapsulating cover so that an encapsulating chamber is formed between the OLED substrate and the encapsulating cover, and the deformation functional layer is disposed in the encapsulating chamber; there is a gap between a display functional layer on the OLED display substrate and the deformation functional layer, and the deformation functional layer is capable of being deformed under an action of electric field; and controlling the electric filed applied to the deformation functional layer to allow the deformation functional layer to entirely fill the encapsulating chamber. 2. The encapsulating method of the OLED display substrate according to claim 1 , wherein encapsulating together the OLED display substrate and the encapsulating cover having the deformation functional layer provided on the encapsulating cover comprises: coating a sealant on encapsulating areas of the OLED display substrate and/or the encapsulating cover, and encapsulating together the OLED display substrate and the encapsulating cover through the sealant. 3. The encapsulating method of the OLED display substrate according to claim 2 , further comprising: after controlling the electric filed applied to the deformation functional layer to allow the deformation functional layer to entirely fill the encapsulating chamber, curing the sealant. 4. The encapsulating method of the OLED display substrate according to claim 3 , wherein after curing the sealant, the method further comprises: controlling the electric field applied to the deformation functional layer to minify the deformation functional layer to only fill part of the encapsulating chamber. 5. The encapsulating method of the OLED display substrate according to claim 3 , wherein the curing is thermocuring or UV curing. 6. The encapsulating method of the OLED display substrate according to claim 2 , wherein before controlling the electric field applied to the deformation functional layer to allow the deformation functional layer to entirely fill the encapsulating chamber, the method further comprises: removing part of gas in the encapsulating chamber by a vacuum-pumping way.
Assignees
Inventors
Classifications
including getter material or desiccant · CPC title
Encapsulations · CPC title
Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title
- H10K59/8722Primary
Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title
- H01L51/5246Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US11069875B2 cover?
- An encapsulating method and an encapsulating structure of an organic light-emitting diode (OLED) display substrate and a display device are provided. The encapsulating method of the OLED display substrate includes: encapsulating together the OLED display substrate and a encapsulating cover having a deformation functional layer, in which the deformation functional layer is disposed in an encapsu…
- Who is the assignee on this patent?
- Boe Technology Group Co Ltd, Beijing Boe Optoelectronics Tech Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10K59/8722. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 20 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).