Substrate processing method and substrate processing system
US-2024173742-A1 · May 30, 2024 · US
US11069542B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11069542-B2 |
| Application number | US-201816603444-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 20, 2018 |
| Priority date | Apr 14, 2017 |
| Publication date | Jul 20, 2021 |
| Grant date | Jul 20, 2021 |
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A cleaning water supply device includes an ultrapure water line through which ultrapure water flows by a fixed amount, a production unit that produces cleaning water by adding a solute to the ultrapure water line by a fixed amount, a storage tank for the cleaning water, cleaning machines to which the cleaning water is supplied from the storage tank, and a controller that controls the cleaning water production unit so that a water level in the storage tank is in a predetermined range.
Opening claim text (preview).
The invention claimed is: 1. A cleaning water supply device, comprising: a cleaning water production unit that produces cleaning water at a certain concentration by adding a pH adjuster and/or an oxidation-reduction potential adjuster to ultrapure water; a storage tank that stores the cleaning water from the cleaning water production unit therein; and a plurality of supply means for supplying the cleaning water in the storage tank to cleaning machines, each supply means including a branching piping directly connected to the storage tank, a pump attached to the branching piping, a pipe connecting the branching piping to one of the cleaning machines through the pump, and a return piping extending from the pipe to the storage tank to return part of the cleaning water to the storage tank. 2. The cleaning water supply device according to claim 1 , further comprising controlling means for controlling the cleaning water production unit so that a cleaning water level in the storage tank is in a predetermined range. 3. The cleaning water supply device according to claim 2 , further comprising switching means for guiding the cleaning water from the cleaning water production unit to a discharge line when a water quality of the cleaning water from the cleaning water production unit is out of a specified range. 4. The cleaning water supply device according to claim 3 , further comprising a removal unit for removing a solute from discharged water from the discharge line. 5. The cleaning water supply device according to claim 3 , wherein the controlling means causes the ultrapure water to flow to the cleaning water production unit at a low flow rate while the cleaning water production unit is suspended. 6. The cleaning water supply device according to claim 2 , wherein the controlling means sets two stages for a production flow rate of the cleaning water in the cleaning water production unit, switches the production flow rate from a high flow rate to a low flow rate when the water level in the storage tank becomes equal to or more than a first predetermined water level, and switches the production flow rate from the low flow rate to the high flow rate when the water level becomes equal to or less than a second predetermined water level. 7. The cleaning water supply device according to claim 1 , wherein the cleaning water production unit comprises a chemical solution tank containing the pH adjuster and/or the oxidation-reduction potential adjuster, to which an inert gas is supplied to provide the pH adjuster and/or the oxidation-reduction potential adjuster to the ultrapure water. 8. The cleaning water supply device according to claim 7 , further comprising a hydrogen peroxide removal device to remove hydrogen peroxide from the ultrapure water before providing the pH adjuster and/or the oxidation-reduction potential adjuster to the ultrapure water. 9. The cleaning water supply device according to claim 8 , further comprising a deaeration device after providing the pH adjuster and/or the oxidation-reduction potential adjuster to the ultrapure water to remove gas from the ultrapure water. 10. The cleaning water supply device according to claim 7 , further comprising an inert gas supplying piping attached to the storage tank for supplying an inert gas to purge oxygen in the storage tank, and a mechanism so that the inert gas is filled constantly in the storage tank.
using mainly spraying means, e.g. nozzles · CPC title
Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title
Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title
Control or steering systems not provided for elsewhere in subclass C02F · CPC title
Oxidation reduction potential [ORP] · CPC title
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