Thermal interface materials for immersion cooled data storage devices

Patent metadata

Field	Value
Publication number	US-11069383-B1
Application number	US-202016841284-A
Country	US
Kind code	B1
Filing date	Apr 6, 2020
Priority date	Apr 6, 2020
Publication date	Jul 20, 2021
Grant date	Jul 20, 2021

Abstract

A data storage device includes a base deck coupled to a top cover. The data storage device includes a printed circuit board coupled to and spaced from the base deck. The data storage device also includes a thermal interface material positioned between the printed circuit board and the base deck and comprising a porous material.

First claim

We claim:

1. A system comprising:
a data storage device including:
a base deck coupled to a top cover, a printed circuit board coupled to and spaced from the base deck, and a thermal interface material (TIM) positioned between the printed circuit board and the base deck and comprising a porous material.

2. The system of claim 1 , wherein the TIM has a porosity that allows a liquid to flow through the TIM.

3. The system of claim 1 , wherein the TIM has a porosity that allows a liquid, having a density of 2000 kg/m 3 or less, to flow through the TIM.

4. The system of claim 1 , wherein the TIM comprises a polymer.

5. The system of claim 4 , wherein the polymer is impregnated with a metal.

6. The system of claim 5 , wherein the metal comprises silver, copper, gold, aluminum, zinc, and/or tungsten.

7. The system of claim 1 , wherein an integrated circuit is coupled to the printed circuit board, wherein the TIM is positioned between the integrated circuit and the base deck.

8. The system of claim 7 , wherein the TIM is attached to the integrated circuit.

9. The system of claim 8 , wherein the TIM is adhered to the integrated circuit.

10. The system of claim 7 , wherein the TIM is compressed between the integrated circuit and the base deck.

11. The system of claim 7 , wherein the TIM is positioned such that heat generated from the integrated circuit passes to the TIM and then to either the base deck or a liquid passing through the TIM.

12. The system of claim 1 , wherein the data storage device is hermetically sealed.

13. The system of claim 1 , wherein pores of the TIM include channels extending therethrough.

14. The system of claim 1 , further comprising:
a data storage system including an enclosure, wherein the data storage device is positioned within the enclosure; and
a cooling system including a tank, wherein the data storage system is positioned within the tank.

15. The system of claim 14 , further comprising multiple additional data storage devices positioned within the enclosure.

16. The system of claim 14 , wherein the tank is at least partially filled with a coolant.

17. The system of claim 16 , wherein the data storage system is at least partially immersed in the coolant.

18. The system of claim 16 , wherein the TIM has a porosity that allows the coolant to flow through the TIM.

19. The system of claim 18 , wherein the density of the coolant is 2000 kg/m 3 or less.

Assignees

• Seagate Technology Llc

Inventors

• Tsoukatos Antonia
• Dykes John W

Classifications

• H10W40/30

  wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/70

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title

• H10W40/257 Primary

  having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence) · CPC title

• G11B33/1413 Primary

  by fluid cooling · CPC title