Mounting electronics and monitoring strain of electronics

Patent metadata

Field	Value
Publication number	US-11066922-B2
Application number	US-201615759529-A
Country	US
Kind code	B2
Filing date	Aug 31, 2016
Priority date	Sep 15, 2015
Publication date	Jul 20, 2021
Grant date	Jul 20, 2021

Abstract

A system for mounting electronics is disclosed. The system may include a tool and a chassis having a mounting surface. The system may also include an electronics assembly coupled to the chassis. A low modulus spacer may be coupled to the chassis between the mounting surface of the chassis and the electronics assembly. A fastener may couple the electronics assembly and the low modulus spacer to the chassis.

First claim

The invention claimed is:

1. A system for mounting electronics to a downhole tool, comprising:
a chassis, the chassis having a mounting surface;
an electronics assembly including a printed circuit board coupled to the chassis;
a low modulus spacer coupled to the chassis between the mounting surface of the chassis and the electronics assembly;
an aperture passing through the electronics assembly and the low modulus spacer and into the chassis, wherein the aperture includes:
a chassis diameter at the chassis; and
an electronics assembly diameter at the printed circuit board and the low modulus spacer, at least a portion of the electronics assembly diameter being greater than the chassis diameter; and

a fastener passing through the aperture to couple the low modulus spacer between the electronics assembly and the chassis, the fastener being secured to the chassis at the electronics diameter, the fastener coupling the electronics assembly and the low modulus spacer to the chassis, the fastener including a head, a head diameter of the head being greater than the electronics assembly diameter.

2. The system of claim 1 , further comprising:
a frame coupled to the chassis, the aperture passing through the frame, the electronics assembly and the low modulus spacer being between the frame and the mounting surface of the chassis.

3. The system of claim 1 , further comprising:
a gap formed between an outer surface of a shank of the fastener and a surface of the aperture formed through the electronics assembly and the low modulus spacer.

4. The system of claim 1 , wherein the fastener is a bolt having a shank with a shank outer diameter; and
the shank outer diameter being smaller than the electronics assembly diameter of the aperture at the printed circuit board and the low modulus spacer.

5. The system of claim 1 wherein the chassis includes a material with a first modulus of elasticity and the low modulus spacer includes a material of a second modulus of elasticity, the second modulus of elasticity of the low modulus spacer being lower than the first modulus of elasticity of the chassis.

6. The system of claim 5 , wherein the second modulus of elasticity is 10 times less than the first modulus of elasticity.

7. The system of claim 1 , wherein the low modulus spacer includes one or more of polymers, elastomers, fibers, and composite material.

8. The system of claim 1 , further comprising:
a circuit board included in the electronic assembly; and
a strain gage mounted to the circuit board to aid in measuring strain and fatigue of the circuit board.

9. The system of claim 1 , wherein the aperture includes a spacer diameter, the spacer diameter being greater than the chassis diameter.

10. The system of claim 1 , wherein the aperture is a blind aperture into the chassis.

11. A method of mounting electronics to a downhole tool, comprising:
mounting a low modulus spacer onto a surface of a chassis, the low modulus spacer including opposing first and second surfaces, the first surface of the spacer being in contact with the surface of the chassis;
mounting an electronics assembly including a printed circuit board to the low modulus spacer, the electronics assembly including opposing third and fourth surfaces, the third surface of the electronics assembly being in contact with the second surface of the low modulus spacer;
inserting a fastener into an aperture through the electronics assembly, the low modulus spacer, and the chassis, the aperture including a chassis diameter at the chassis and an electronics assembly diameter at the printed circuit board and the low modulus spacer, the electronics assembly diameter being larger than the chassis diameter, the fastener including a head, a head diameter of the head being greater than the electronics assembly diameter; and
coupling the electronics assembly and the low modulus spacer to the chassis with a fastener
bending the downhole tool, wherein bending the downhole tool includes:
applying a first stress to the chassis; and
applying a second stress to the printed circuit board, the printed circuit board diameter being larger than the chassis diameter resulting in the second stress being lower than the first stress.

12. The method of claim 11 , further comprising:
coupling a frame to the chassis, the electronics assembly and the low modulus spacer being coupled to the chassis, between the frame and a mounting surface of the chassis.

13. The method of claim 12 , wherein the aperture is formed through the frame, and
coupling the frame to the chassis includes passing the fastener through the aperture formed through the frame, the electronics assembly, and the low modulus spacer.

14. The method of claim 13 , further comprising:
forming a gap between an outer surface of a shank of the fastener and a surface of the aperture formed through the electronics assembly and the low modulus spacer.

15. The method of claim 11 , further comprising:
measuring strain on the electronics assembly and the chassis while bending the chassis, an electronics assembly strain being less than a chassis strain.

16. The method of claim 11 , further comprising:
bending the chassis, wherein the fastener does not contact an aperture wall of the aperture at the electronics assembly when the chassis is bent.

17. A system for mounting electronics to a downhole tool, comprising:
a chassis including a first modulus of elasticity;
a frame;
an electronics assembly including a printed circuit board located between the frame and the chassis;
a spacer including a second modulus of elasticity, the second modulus of elasticity being lower than the first modulus of elasticity, the spacer being located between the electronics assembly and the chassis;
an aperture passing through the frame, the electronics assembly, the spacer, and into the chassis, the aperture including:
a frame diameter and shoulder at the frame;
an electronics assembly diameter at the printed circuit board and the spacer; and
a chassis diameter and threads at the chassis; and

a fastener securing the frame, the electronics assembly, and the spacer to the chassis, the fastener being threaded into the chassis at the threads, a head of the fastener engaging with the shoulder, the fastener including a head, a head diameter of the head being greater than the electronics assembly diameter.

18. The system of claim 17 , the fastener including a shank above the threads, a shank diameter being less than the electronics assembly diameter.

19. The system of claim 18 , the shank diameter being less than the electronics assembly diameter when the chassis is in a bent configuration.

20. The system of claim 19 , wherein the shank does not contact a wall of the aperture at the electronics assembly in the bent configuration.

Assignees

• Schlumberger Technology Corp

Inventors

• Moriarty Keith

Classifications

• E21B47/017 Primary

  Protecting measuring instruments · CPC title

• E21B47/01 Primary

  Devices for supporting measuring instruments on drill bits, pipes, rods or wirelines; Protecting measuring instruments in boreholes against heat, shock, pressure or the like · CPC title