Method for manufacturing diamond substrate
US-2017247814-A1 · Aug 31, 2017 · US
Diamond substrate and freestanding diamond substrate
US11066757B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11066757-B2 |
| Application number | US-201816179363-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 2, 2018 |
| Priority date | Feb 29, 2016 |
| Publication date | Jul 20, 2021 |
| Grant date | Jul 20, 2021 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A method for manufacturing a diamond substrate, including: a first step of preparing patterned diamond on a foundation surface, a second step of growing diamond from the patterned diamond prepared in the first step to form the diamond in a pattern gap of the patterned diamond prepared in the first step, a third step of removing the patterned diamond prepared in the first step to form a patterned diamond composed of the diamond formed in the second step, and a fourth step of growing diamond from the patterned diamond formed in the third step to form the diamond in a pattern gap of the patterned diamond formed in the third step. There can be provided a method for manufacturing a diamond substrate which can sufficiently suppress dislocation defects, a high-quality diamond substrate, and a freestanding diamond substrate.
First claim
Opening claim text (preview).
The invention claimed is: 1. A substrate comprising at least one surface composed of diamond, wherein the substrate is composed of a foundation and a diamond layer formed on a surface of the foundation, and contains a void on a boundary between the foundation and the diamond layer, and wherein the surface of the foundation is composed of a different kind of material other than diamond. 2. A substrate comprising a foundation and a diamond layer formed on a surface of the foundation, wherein a back surface of the foundation has an opening. 3. The substrate according to claim 2 , wherein the surface of the foundation is composed of a different kind of material other than diamond. 4. A substrate comprising at least one surface being composed of diamond, wherein the whole surface of the at least one surface is composed of at least one of lateral grown diamond and diamond grown from the lateral grown diamond.
Assignees
Inventors
Classifications
Cleaning of diamond · CPC title
Cleaning during device manufacture · CPC title
characterised by the process involved to create the mask, e.g. lift-off masks or sidewalls or to modify the mask · CPC title
of Group IV materials · CPC title
- H10P14/3406Primary
Carbon, e.g. diamond-like carbon · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11066757B2 cover?
- A method for manufacturing a diamond substrate, including: a first step of preparing patterned diamond on a foundation surface, a second step of growing diamond from the patterned diamond prepared in the first step to form the diamond in a pattern gap of the patterned diamond prepared in the first step, a third step of removing the patterned diamond prepared in the first step to form a patterne…
- Who is the assignee on this patent?
- Shinetsu Chemical Co, Aist, Univ Nat Corp Kanazawa
- What technology area does this patent fall under?
- Primary CPC classification H10P14/3406. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 20 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).