Honeycomb structure

US11066336B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11066336-B2
Application numberUS-201916289989-A
CountryUS
Kind codeB2
Filing dateMar 1, 2019
Priority dateMar 27, 2018
Publication dateJul 20, 2021
Grant dateJul 20, 2021

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A honeycomb structure includes honeycomb segments, bonding layers and a circumferential wall. The bonding layers include bottomed-hollow voids which extend toward an internal side in an axial direction from an end face of the honeycomb structure and which are formed at at least one of intersections, and a ratio of a depth of each void in the axial direction to a length of each honeycomb segment in the axial direction is 5% or more.

First claim

Opening claim text (preview).

What is claimed is: 1. A honeycomb structure comprising: a plurality of prismatic columnar honeycomb segments; bonding layers that bond side faces of the plurality of honeycomb segments with respect to each other; and a circumferential wall that is disposed to surround the plurality of honeycomb segments bonded with the bonding layers in a state where the plurality of honeycomb segments are arrayed in a grid pattern, wherein each of the honeycomb segments includes porous partition walls disposed to surround a plurality of cells extending from an inflow end face to an outflow end face in an axial direction and a segmented outer wall disposed to surround the partition walls, an end of each of the cells in each of the honeycomb segments is plugged by a plugging portion at any one of the inflow end face and the outflow end face, the bonding layers include bottomed-hollow voids which extend toward an internal side in the axial direction from the inflow end face or the outflow end face and which are formed only at intersections that bond the honeycomb segments in the grid pattern, and a ratio of a depth of each void in the axial direction to a length of each honeycomb segment in the axial direction is 5% or more. 2. The honeycomb structure according to claim 1 , wherein a width of each bonding layer on the inflow end face or the outflow end face of the honeycomb structure is 0.5 to 2.0 mm. 3. The honeycomb structure according to claim 1 , wherein a ratio of a size of an open end of each void to a width of each bonding layer on the inflow end face or the outflow end face of the honeycomb structure is 10 to 140%. 4. The honeycomb structure according to claim 3 , wherein a width of each bonding layer on the inflow end face or the outflow end face of the honeycomb structure is 0.5 to 2.0 mm. 5. The honeycomb structure according to claim 1 , wherein the voids are formed at at least one of the intersections which are located at radially outermost circumference on the inflow end face or the outflow end face of the honeycomb structure. 6. The honeycomb structure according to claim 5 , wherein a ratio of a size of an open end of each void to a width of each bonding layer on the inflow end face or the outflow end face of the honeycomb structure is 10 to 140%. 7. The honeycomb structure according to claim 5 , wherein a width of each bonding layer on the inflow end face or the outflow end face of the honeycomb structure is 0.5 to 2.0 mm. 8. The honeycomb structure according to claim 5 , wherein the voids are formed at all of the intersections on extended lines that linearly extend along the bonding layers from the intersections that are the closest to the centroid of the inflow end face or the outflow end face of the honeycomb structure. 9. The honeycomb structure according to claim 8 , wherein a ratio of a size of an open end of each void to a width of each bonding layer on the inflow end face or the outflow end face of the honeycomb structure is 10 to 140%. 10. The honeycomb structure according to claim 8 , wherein a width of each bonding layer on the inflow end face or the outflow end face of the honeycomb structure is 0.5 to 2.0 mm. 11. The honeycomb structure according to claim 1 , wherein a remaining portion of each bonding layer at each intersection in which each void is formed, other than each void, has a length of 1.5 mm or more in the axial direction. 12. The honeycomb structure according to claim 11 , wherein a ratio of a size of an open end of each void to a width of each bonding layer on the inflow end face or the outflow end face of the honeycomb structure is 10 to 140%. 13. The honeycomb structure according to claim 11 , wherein a width of each bonding layer on the inflow end face or the outflow end face of the honeycomb structure is 0.5 to 2.0 mm. 14. The honeycomb structure according to claim 11 , wherein the voids are formed at at least one of the intersections which are located at radially outermost circumference on the inflow end face or the outflow end face of the honeycomb structure. 15. The honeycomb structure according to claim 14 , wherein a ratio of a size of an open end of each void to a width of each bonding layer on the inflow end face or the outflow end face of the honeycomb structure is 10 to 140%. 16. The honeycomb structure according to claim 14 , wherein a width of each bonding layer on the inflow end face or the outflow end face of the honeycomb structure is 0.5 to 2.0 mm. 17. The honeycomb structure according to claim 14 , wherein the voids are formed at all of the intersections on extended lines that linearly extend along the bonding layers from the intersections that are the closest to the centroid of the inflow end face or the outflow end face of the honeycomb structure. 18. The honeycomb structure according to claim 17 , wherein a width of each bonding layer on the inflow end face or the outflow end face of the honeycomb structure is 0.5 to 2.0 mm. 19. The honeycomb structure according to claim 17 , wherein a ratio of a size of an open end of each void to a width of each bonding layer on the inflow end face or the outflow end face of the honeycomb structure is 10 to 140%. 20. The honeycomb structure according to claim 19 , wherein a width of each bonding layer on the inflow end face or the outflow end face of the honeycomb structure is 0.5 to 2.0 mm.

Assignees

Inventors

Classifications

  • F01N3/0222Primary

    the structure being monolithic, e.g. honeycombs · CPC title

  • of the adhesive layers, i.e. joints between segments · CPC title

  • Thickness, height, width, length or diameter · CPC title

  • Structures comprising honeycomb segments · CPC title

  • Drying, e.g. freeze-drying, spray-drying, microwave or supercritical drying · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11066336B2 cover?
A honeycomb structure includes honeycomb segments, bonding layers and a circumferential wall. The bonding layers include bottomed-hollow voids which extend toward an internal side in an axial direction from an end face of the honeycomb structure and which are formed at at least one of intersections, and a ratio of a depth of each void in the axial direction to a length of each honeycomb segment…
Who is the assignee on this patent?
Ngk Insulators Ltd
What technology area does this patent fall under?
Primary CPC classification F01N3/0222. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Jul 20 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).