Manufacturing method of carrier for double-side polishing apparatus and method of double-side polishing wafer

Patent metadata

Field	Value
Publication number	US-11065735-B2
Application number	US-201716078327-A
Country	US
Kind code	B2
Filing date	Feb 17, 2017
Priority date	Mar 18, 2016
Publication date	Jul 20, 2021
Grant date	Jul 20, 2021

Abstract

A manufacturing method of a carrier for a double-side polishing apparatus, including: preparing a carrier base material and insert thicker than the carrier base material, inserting the insert into a holding hole so as to protrude the insert from both sides of the front surface and back surface of the carrier base material, measuring each of a front protruding amount of the insert protruded from front surface of the carrier base material and a back protruding amount of the insert protruded from back surface of the carrier base material, setting each rotational speed of the upper turn table and lower turn table in starting-up polishing of the carrier so as to decrease the difference between the front protruding amount and back protruding amount, and a starting-up polishing step to subject the carrier to starting-up polishing at each set rotational speed of the upper turn table and the lower turn table.

First claim

The invention claimed is:

1. A manufacturing method of a carrier for a double-side polishing apparatus, the double-side polishing apparatus including an upper turn table and a lower turn table to which polishing pads are attached, and the carrier including a carrier base material having a holding hole formed therein to hold a wafer, and an insert disposed along the inner circumference of the holding hole and having an inner circumferential portion configured to be in contact with an outer circumferential portion of the wafer, the method comprising:
a preparation step of preparing the carrier base material and the insert thicker than the carrier base material;
a step of inserting the insert into the holding hole so as to protrude the insert from both sides of the front surface and the back surface of the carrier base material;
a measuring step to measure each of a front protruding amount of the insert protruded from the front surface of the carrier base material and a back protruding amount of the insert protruded from the back surface of the carrier base material;
a setting step to set each rotational speed of the upper turn table and the lower turn table in starting-up polishing of the carrier so as to decrease a difference between the front protruding amount and the back protruding amount; and
a starting-up polishing step to subject the carrier to starting-up polishing at each set rotational speed of the upper turn table and the lower turn table.

2. The manufacturing method of a carrier for a double-side polishing apparatus according to claim 1 , wherein, in the preparation step,
the insert is prepared in a thickness thicker than the thickness of the carrier base material by 10 μm or more and 40 μm or less.

3. The manufacturing method of a carrier for a double-side polishing apparatus according to claim 1 , wherein, in the setting step,
each rotational speed of the upper turn table and the lower turn table is set to have a relative rotational speed to the carrier in starting-up polishing of the carrier such that the relative rotational speed of one of the upper turn table and the lower turn table is set to 1.5 times or more relative to the relative rotational speed of the other.

4. The manufacturing method of a carrier for a double-side polishing apparatus according to claim 2 , wherein, in the setting step,
each rotational speed of the upper turn table and the lower turn table is set to have a relative rotational speed to the carrier in starting-up polishing of the carrier such that the relative rotational speed of one of the upper turn table and the lower turn table is set to 1.5 times or more relative to the relative rotational speed of the other.

5. The manufacturing method of a carrier for a double-side polishing apparatus according to claim 1 , wherein, in the setting step,
each rotational speed of the upper turn table and the lower turn table is set to have a relative rotational speed to the carrier being 0 rpm or more and 30 rpm or less in starting-up polishing of the carrier.

6. The manufacturing method of a carrier for a double-side polishing apparatus according to claim 2 , wherein, in the setting step,
each rotational speed of the upper turn table and the lower turn table is set to have a relative rotational speed to the carrier being 0 rpm or more and 30 rpm or less in starting-up polishing of the carrier.

7. The manufacturing method of a carrier for a double-side polishing apparatus according to claim 3 , wherein, in the setting step,
each rotational speed of the upper turn table and the lower turn table is set to have a relative rotational speed to the carrier being 0 rpm or more and 30 rpm or less in starting-up polishing of the carrier.

8. The manufacturing method of a carrier for a double-side polishing apparatus according to claim 4 , wherein, in the setting step,
each rotational speed of the upper turn table and the lower turn table is set to have a relative rotational speed to the carrier being 0 rpm or more and 30 rpm or less in starting-up polishing of the carrier.

9. The manufacturing method of a carrier for a double-side polishing apparatus according to claim 1 ,
wherein the starting-up polishing step is performed using an aqueous alkaline solution in which a polishing agent having an average adhesive-grain diameter of 60 nm or more is diluted 2 to 5 times with a solvent.

10. The manufacturing method of a carrier for a double-side polishing apparatus according to claim 2 ,
wherein the starting-up polishing step is performed using an aqueous alkaline solution in which a polishing agent having an average adhesive-grain diameter of 60 nm or more is diluted 2 to 5 times with a solvent.

11. The manufacturing method of a carrier for a double-side polishing apparatus according to claim 3 ,
wherein the starting-up polishing step is performed using an aqueous alkaline solution in which a polishing agent having an average adhesive-grain diameter of 60 nm or more is diluted 2 to 5 times with a solvent.

12. The manufacturing method of a carrier for a double-side polishing apparatus according to claim 4 ,
wherein the starting-up polishing step is performed using an aqueous alkaline solution in which a polishing agent having an average adhesive-grain diameter of 60 nm or more is diluted 2 to 5 times with a solvent.

13. The manufacturing method of a carrier for a double-side polishing apparatus according to claim 5 ,
wherein the starting-up polishing step is performed using an aqueous alkaline solution in which a polishing agent having an average adhesive-grain diameter of 60 nm or more is diluted 2 to 5 times with a solvent.

14. The manufacturing method of a carrier for a double-side polishing apparatus according to claim 6 ,
wherein the starting-up polishing step is performed using an aqueous alkaline solution in which a polishing agent having an average adhesive-grain diameter of 60 nm or more is diluted 2 to 5 times with a solvent.

15. The manufacturing method of a carrier for a double-side polishing apparatus according to claim 7 ,
wherein the starting-up polishing step is performed using an aqueous alkaline solution in which a polishing agent having an average adhesive-grain diameter of 60 nm or more is diluted 2 to 5 times with a solvent.

16. The manufacturing method of a carrier for a double-side polishing apparatus according to claim 8 ,
wherein the starting-up polishing step is performed using an aqueous alkaline solution in which a polishing agent having an average adhesive-grain diameter of 60 nm or more is diluted 2 to 5 times with a solvent.

17. The manufacturing method of a carrier for a double-side polishing apparatus according to claim 1 ,
wherein the measuring step is performed again after the starting-up polishing step, and
the setting step, the starting-up polishing step, and the measuring step are repeated until the difference between the front protruding amount and the back protruding amount measured in the measuring step reaches to 5 μm or less.

18. The manufacturing method of a carrier for a double-side polishing apparatus according to claim 16 ,
wherein the measuring step is performed again after the starting-up polishing step, and
the setting step, the starting-up polishing step, and the measuring step are repeated until the difference between the front protruding amount and the back protruding amount measured in the measuring step reaches to 5 μm or less.

19. A method of double-side polishing a wafer, comprising:
disposing the carrier manufactured by the manufa

Assignees

• Shinetsu Handotai Kk

Inventors

• Kitazume Daichi
• Tanaka Yuki

Classifications

• H10P90/12

  Preparing bulk and homogeneous wafers · CPC title

• B24B37/042

  operating processes therefor · CPC title

• B24B27/0076

  grinding machines comprising two or more grinding tools · CPC title

• B24B7/17

  for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders · CPC title

• B24B37/08 Primary

  for double side lapping · CPC title