Tft substrate manufacturing method and tft substrate
US-2017040462-A1 · Feb 9, 2017 · US
US11063155B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11063155-B2 |
| Application number | US-201916414266-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 16, 2019 |
| Priority date | Dec 6, 2018 |
| Publication date | Jul 13, 2021 |
| Grant date | Jul 13, 2021 |
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A thin film transistor includes an active layer including a first portion having a first thickness and a second portion having a second thickness greater than the first thickness, a capping layer filling a thickness difference between the first portion and the second portion and arranged on the first portion, a gate insulating layer arranged on the capping layer, a gate electrode on the active layer, wherein the gate insulating layer and the capping layer are disposed between the gate electrode and the active layer, and a source electrode and a drain electrode connected to the active layer.
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What is claimed is: 1. A thin film transistor comprising: an active layer including a first portion having a first thickness, a second portion having a second thickness greater than the first thickness, and a third portion disposed therebetween, wherein the third portion of the active layer has a sloped upper surface which connects an upper surface of the first portion and an upper surface of the second portion to each other; a capping layer filling a thickness difference between the first portion and the second portion and arranged on the first portion; a gate insulating layer arranged on the capping layer; a gate electrode on the active layer, wherein the gate insulating layer and a portion of the capping layer are vertically interposed between the gate electrode and the active layer, and wherein the portion of the capping layer is in contact with the sloped upper surface of the third portion; and a source electrode and a drain electrode connected to the active layer, wherein the portion of the capping layer is horizontally interposed between the source electrode and the drain electrode, and the sloped upper surface of the third portion, and wherein the first portion is integral with the second portion. 2. The thin film transistor of claim 1 , wherein the active layer has an entire flat bottom surface, wherein the capping layer covers a top surface of the first portion, and wherein the capping layer is disposed between the top surface of the first portion and a bottom surface of the gate insulating layer. 3. The thin film transistor of claim 2 , wherein the capping layer further covers a lateral surface of an end portion of the first portion. 4. The thin film transistor of claim 1 , wherein the gate insulating layer directly contacts the second portion. 5. The thin film transistor of claim 1 , wherein the capping layer includes silicon oxide. 6. A display device comprising: a substrate; a thin film transistor on the substrate; and a light-emitting element connected to the thin film transistor, wherein the thin film transistor comprises: an active layer including a first portion having a first thickness, a second portion having a second thickness greater than the first thickness, and a third portion disposed therebetween, wherein the third portion of the active layer has a sloped upper surface which connects an upper surface of the first portion and an upper surface of the second portion to each other; a capping layer filling a thickness difference between the first portion and the second portion and arranged on the first portion; a gate insulating layer arranged on the capping layer; a gate electrode on the active layer, wherein the gate insulating layer and the capping layer are disposed between the gate electrode and the active layer; and a source electrode and a drain electrode connected to the active layer, wherein the portion of the capping layer is horizontally interposed between the source electrode and the drain electrode, and the sloped upper surface of the third portion, and wherein the first portion is integral with the second portion. 7. The display device of claim 6 , wherein the active layer has an entire flat bottom surface, wherein the capping layer covers a top surface of the first portion, and wherein the capping layer is disposed between the top surface of the first portion and a bottom surface of the gate insulating layer. 8. The display device of claim 6 , wherein the capping layer further covers a lateral surface of an end portion of the first portion. 9. The display device of claim 6 , wherein the gate insulating layer directly contacts the second portion. 10. The display device of claim 6 , wherein the capping layer includes silicon oxide.
of semiconductor materials · CPC title
the material being a silicon oxide, e.g. SiO2 · CPC title
using laser beams · CPC title
using crystallisation-enhancing elements · CPC title
Amorphous · CPC title
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