Semiconductor device and method of manufacturing the same
US-2018040639-A1 · Feb 8, 2018 · US
US11063103B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11063103-B2 |
| Application number | US-201916666869-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 29, 2019 |
| Priority date | Nov 7, 2018 |
| Publication date | Jul 13, 2021 |
| Grant date | Jul 13, 2021 |
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A display device includes a substrate, a pixel driver on the substrate, and a display element connected to the pixel driver. The pixel driver includes a conductive layer on the substrate, a buffer layer on the conductive layer, a semiconductor layer on the buffer layer, a gate electrode, the gate electrode overlapping the semiconductor layer, and a source electrode and a drain electrode connected to the semiconductor layer. The buffer layer includes a flattened portion overlapping the conductive layer, and a stepped portion overlapping the periphery of the conductive layer. The semiconductor layer includes a first oxide semiconductor layer on the buffer layer, and a second oxide semiconductor layer on the first oxide semiconductor layer. A width of the first oxide semiconductor layer is larger than a width of the second oxide semiconductor layer, and the first oxide semiconductor layer is on the stepped portion of the buffer layer.
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What is claimed is: 1. A display device, comprising: a substrate; a pixel driver on the substrate; and a display element connected to the pixel driver, wherein the pixel driver includes: a conductive layer on the substrate; a buffer layer on the conductive layer; a semiconductor layer on the buffer layer; a gate electrode, at least a part of the gate electrode overlapping at least a part of the semiconductor layer; and a source electrode and a drain electrode respectively connected to the semiconductor layer, wherein the buffer layer includes a flattened portion overlapping the conductive layer, and a stepped portion overlapping the periphery of the conductive layer, wherein the semiconductor layer includes a first oxide semiconductor layer on the buffer layer, and a second oxide semiconductor layer on the first oxide semiconductor layer, wherein a width of the first oxide semiconductor layer is larger than a width of the second oxide semiconductor layer, and wherein at least a portion of the first oxide semiconductor layer is on the stepped portion of the buffer layer. 2. The display device according to claim 1 , wherein the second oxide semiconductor layer is on the flattened portion of the buffer layer. 3. The display device according to claim 1 , wherein the first oxide semiconductor layer extends from the flattened portion of the buffer layer to the stepped portion of the buffer layer. 4. The display device according to claim 1 , wherein the first oxide semiconductor layer includes gallium (Ga), and a concentration of gallium (Ga) in the first oxide semiconductor layer is higher than a concentration of gallium (Ga) in the second oxide semiconductor layer. 5. The display device according to claim 4 , wherein the first oxide semiconductor layer includes gallium (Ga) of 50 atom % or more than 50 atom % based on total metallic element of the first oxide semiconductor layer with respect to number of atoms. 6. The display device according to claim 1 , wherein an etching rate of the first oxide semiconductor layer is lower than an etching rate of the second oxide semiconductor layer under the same etching conditions. 7. The display device according to claim 1 , wherein a width of the first oxide semiconductor layer is relatively larger by 0.2 μm˜5 μm in comparison to a width of the second oxide semiconductor layer. 8. The display device according to claim 1 , wherein a width of the first oxide semiconductor layer is larger than a width of the conductive layer. 9. The display device according to claim 1 , wherein the first oxide semiconductor layer has a thickness of 5 nm˜25 nm. 10. The display device according to claim 1 , wherein the conductive layer is a light blocking layer. 11. The display device according to claim 1 , wherein the conductive layer is a wiring configured to supply a signal to the pixel driver. 12. The display device according to claim 1 , wherein the semiconductor layer, the gate electrode, the source electrode, and the drain electrode constitute a driving thin film transistor configured to control a driving voltage applied to the display element. 13. A method for manufacturing a display device, comprising: forming a conductive layer on a substrate; forming a buffer layer on the conductive layer; forming a first oxide semiconductor material layer and a second oxide semiconductor material layer on the buffer layer; forming a semiconductor layer by patterning the first oxide semiconductor material layer and the second oxide semiconductor material layer; and forming a gate insulating film and a gate electrode on the semiconductor layer, wherein a width of the first oxide semiconductor layer is larger than a width of the second oxide semiconductor layer; and wherein at least a portion of the first oxide semiconductor layer is disposed on a stepped portion of the buffer layer. 14. The method according to claim 13 , wherein the first oxide semiconductor material layer and the second oxide semiconductor material layer are formed by metal-organic chemical vapor deposition (MOCVD). 15. The method according to claim 13 , wherein a concentration of gallium in the first oxide semiconductor material layer is higher than a concentration of gallium in the second oxide semiconductor material layer. 16. The method according to claim 13 , wherein the first oxide semiconductor material layer includes gallium (Ga) of 50 atom % or more than 50 atom % based on total metallic element of the first oxide semiconductor material layer with respect to number of atoms. 17. The method according to claim 13 , wherein the first oxide semiconductor material layer has a thickness of 5 nm˜25 nm.
Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate · CPC title
characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes · CPC title
having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device · CPC title
characterised by multiple TFTs · CPC title
Interconnections, e.g. scanning lines · CPC title
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