Electronic module for power control and method for manufacturing an electronic module power control

Patent metadata

Field	Value
Publication number	US-11062972-B2
Application number	US-201916378225-A
Country	US
Kind code	B2
Filing date	Apr 8, 2019
Priority date	Apr 9, 2018
Publication date	Jul 13, 2021
Grant date	Jul 13, 2021

Abstract

The invention relates to an electronics module ( 100 ) for power control. The electronics module ( 100 ) comprises a carrier element ( 102 ), which has at least a first power switch element ( 104 ) with a first cooling surface ( 106 ) and a second power switch element ( 108 ) with a second cooling surface ( 110 ), a heat sink ( 126 ), and a cooling plate ( 122 ), which connects the first cooling surface ( 105 ) and the second cooling surface ( 110 ) to one another as well as to the heat sink ( 126 ) in a thermally conductive manner, when the electronics module ( 100 ) is installed.

First claim

The invention claimed is:

1. An electronics module for power control, wherein the electronics module comprises the following features:
a carrier element;
a first power switch element electrically coupled to the carrier element, the first power switch element having a first cooling surface facing away from the carrier element;
a second power switch element electrically coupled to the carrier element, the second power switch element having a second cooling surface facing away from the carrier element;
a heat sink; and
a cooling plate that connects the first cooling surface and the second cooling surface to one another as well as to the heat sink in a thermally conductive manner, wherein the cooling plate is electrically conductive between a location where the cooling plate connects to the first cooling surface and a location where the cooling plate connects to the second cooling surface.

2. The electronics module according to claim 1 , wherein the first power switch element and the second power switch element each comprise at least one of a MOSFET, IGBT or thyristor.

3. The electronics module according claim 1 , wherein the cooling plate at least one of comprises mostly copper or comprises copper as a main component.

4. The electronics module according to claim 1 , further comprising:
a connecting element comprising a filler material with a predefined thermal resistance, wherein the connecting element connects the cooling plate and the heat sink to one another in a thermally conductive manner.

5. The electronics module according to claim 4 , further comprising:
an electrically insulating layer that connects the connecting element and the heat sink to one another in a thermally conductive manner.

6. The electronics module according to claim 4 , wherein the connecting element has a predetermined elasticity and is compressed by a pressure between the cooling plate and the heat sink.

7. The electronics module according to claim 1 , wherein the cooling plate is materially bonded to the first cooling surface and the second cooling surface by at least one of soldering or an adhesive.

8. The electronics module according to claim 1 , further comprising:
a housing for accommodating the electronics module.

9. The electronics module according to claim 8 , wherein the heat sink is part of the housing.

10. The electronics module according to claim 8 , wherein the housing is formed of a housing material that is sprayed onto the electronics module.

11. The electronics module according claim 2 , wherein the cooling plate at least one of comprises mostly copper or comprises copper as a main component.

12. The electronics module according to claim 2 , further comprising:
a connecting element comprising a filler material with a predefined thermal resistance, wherein the connecting element connects the cooling plate and the heat sink to one another in a thermally conductive manner.

13. The electronics module according to claim 3 , further comprising:
a connecting element comprising a filler material with a predefined thermal resistance, wherein the connecting element connects the cooling plate and the heat sink to one another in a thermally conductive manner.

14. The electronics module according to claim 4 , wherein the connecting element is electrically conductive.

15. The electronics module according to claim 3 , wherein the cooling plate is materially bonded to the first cooling surface and the second cooling surface by at least one of soldering or an adhesive.

16. The electronics module according to claim 3 , further comprising:
a housing for accommodating the electronics module.

17. The electronics module according to claim 8 , wherein a surface section of the heat sink facing away from the carrier element is exposed through an exterior surface of the housing.

18. The electronics module according to claim 17 , wherein the housing is formed of a housing material that is sprayed onto the electronics module.

19. The electronics module according to claim 5 , wherein the insulating layer comprises a metallic oxide layer.

20. The electronics module according to claim 1 , wherein the carrier element comprises a printed circuit board (PCB).

Assignees

• Zahnradfabrik Friedrichshafen

Inventors

• Maier Thomas

Classifications

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/865

  Die-attach connectors and bond wires · CPC title