Electromagnetic relay
US-2019103240-A1 · Apr 4, 2019 · US
Electromagnetic relay
US11062868B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11062868-B2 |
| Application number | US-201816227298-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 20, 2018 |
| Priority date | Jan 17, 2018 |
| Publication date | Jul 13, 2021 |
| Grant date | Jul 13, 2021 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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- CPC / IPC classifications
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- Citations and related patents
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Abstract
Official abstract text for this publication.
An electromagnetic relay includes a fixed contact module including a fixed contact, a movable contact module including a movable contact disposed to face the fixed contact, an armature formed of a magnetic material and configured to move the movable contact module to bring the movable contact into and out of contact with the fixed contact, and an electromagnet configured to generate a magnetic field to move the armature. At least one of the fixed contact module and the movable contact module includes a joint at which different components are joined by riveting, and a film with a thermal conductivity higher than, the thermal conductivity of the fixed contact module and the movable contact module is formed on at least one of the fixed contact module and the movable contact module including the joint.
First claim
Opening claim text (preview).
What is claimed is: 1. An electromagnetic relay, comprising: a fixed contact module including a fixed contact; a movable contact module including a movable contact disposed to face the fixed contact; an armature formed of a magnetic material and configured to move the movable contact module to bring the movable contact into and out of contact with the fixed contact; and an electromagnet configured to generate a magnetic field to move the armature, wherein at least one of the fixed contact module and the movable contact module includes at least one joint at which different components are joined by riveting; and a film with a thermal conductivity higher than a thermal conductivity of the at least one of the fixed contact module and the movable contact module is formed on the at least one of the fixed contact module and the movable contact module including the joint. 2. The electromagnetic relay as claimed in claim 1 , wherein the fixed contact module further includes a fixed terminal connected to the fixed contact; the movable contact module further includes a movable spring connected to the movable contact and a movable spring terminal connected to the movable spring; and the at least one joint includes at least one of a joint between the fixed contact and the fixed terminal, a joint between the movable spring terminal and the movable spring, and a joint between the movable contact and the movable spring. 3. The electromagnetic relay as claimed in claim 1 , wherein the film contains silver. 4. The electromagnetic relay as claimed in claim 1 , further comprising: a card formed of a resin and attached to the armature, the card including a contact part configured to contact the movable contact module, wherein a thermal conductive film is formed on a surface of the card including the contact part.
Assignees
Inventors
Classifications
one layer being formed of a noble metal or a noble metal alloy · CPC title
Laminated contacts with divided contact surface · CPC title
- H01H50/28Primary
Parts movable due to bending of a blade spring or reed · CPC title
Contact spring sets · CPC title
characterised by the material, e.g. plating, or coating materials · CPC title
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Frequently asked questions
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- What does patent US11062868B2 cover?
- An electromagnetic relay includes a fixed contact module including a fixed contact, a movable contact module including a movable contact disposed to face the fixed contact, an armature formed of a magnetic material and configured to move the movable contact module to bring the movable contact into and out of contact with the fixed contact, and an electromagnet configured to generate a magnetic …
- Who is the assignee on this patent?
- Fujitsu Component Ltd
- What technology area does this patent fall under?
- Primary CPC classification H01H50/28. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 13 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).