Resist composition, method of forming resist pattern, polymeric compound, and compound

Patent metadata

Field	Value
Publication number	US-11061329-B2
Application number	US-201816173326-A
Country	US
Kind code	B2
Filing date	Oct 29, 2018
Priority date	Nov 29, 2017
Publication date	Jul 13, 2021
Grant date	Jul 13, 2021

Abstract

A resist composition including a resin component having a structural unit derived form a compound represented by formula (a0-1) (in the formula, W represents a polymerizable group-containing group; Ra01 is a group which is bonded to Ra03 to form an aliphatic cyclic group, or bonded to Ra04 to form an aliphatic cyclic group;Ra02 represents a hydrocarbon group which may have a substituent; Ra03 is a hydrogen atom or a monovalent organic group in the case where Ra01 is not bonded thereto; Ra04 is a hydrogen atom or a monovalent organic group in the case where Ra01 is not bonded thereto; and Ra05 to Ra07 each independently represents a hydrogen atom or a monovalent organic group).

First claim

What is claimed is:

1. A compound represented by general formula (a0-1-1) or (a0-1-2) shown below:

wherein, in formula (a0-1-1), R α represents a hydrogen atom, a methyl group or a trifluoromethyl group; Va 0 represents a linear or branched alkylene group which may have an ether bond;
n a0 represents an integer of 0 to 2; n a011 represents an integer of 1 to 4; Ra 02 represents a hydrocarbon group which may have a substituent; Ra 030 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms; Ra 050 to Ra 070 each independently represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms; in formula (a0-1-2), R α represents a hydrogen atom, a methyl group or a trifluoromethyl group; Va 0 represents a linear or branched alkylene group which may have an ether bond; n a0 represents an integer of 0 to 2; n a012 represents an integer of 1 to 4; Ra 02 represents a hydrocarbon group which may have a substituent;
Ra 040 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms; and Ra 050 to Ra 070 each independently represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms; provided that Ra 02 , Ra 030 , Ra 060 and Ra 070 are not bonded to each other.

2. A polymeric compound comprising a structural unit (a0) derived from the compound represented by general formula (a0-1-1) or (a0-1-2) according to claim 1 .

3. A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, the resist composition comprising:
a resin component (A1) which exhibits changed solubility in a developing solution under action of acid,
the resin component (A1) comprising a structural unit (a0) derived from the compound represented by general formula (a0-1-1) or (a0-1-2) according to claim 1 .

4. A method of forming a resist pattern, comprising:
forming a resist film using the resist composition according to claim 3 ;
exposing the resist film, and
developing the exposed resist film to form a resist pattern.

Assignees

• Tokyo Ohka Kogyo Co Ltd

Inventors

• Ikeda Takuya
• Arai Masatoshi

Classifications

• G03F7/0382 Primary

  the macromolecular compound being present in a chemically amplified negative photoresist composition · CPC title

• C07C323/62

  having the sulfur atom of at least one of the thio groups bound to a carbon atom of a six-membered aromatic ring of the carbon skeleton · CPC title

• G03F7/0392

  the macromolecular compound being present in a chemically amplified positive photoresist composition · CPC title

• G03F7/26

  Processing photosensitive materials; Apparatus therefor (G03F7/12 - G03F7/24 take precedence) · CPC title

• G03F7/20

  Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) · CPC title