Optical detector

Patent metadata

Field	Value
Publication number	US-11060922-B2
Application number	US-201816500113-A
Country	US
Kind code	B2
Filing date	Apr 19, 2018
Priority date	Apr 20, 2017
Publication date	Jul 13, 2021
Grant date	Jul 13, 2021

Abstract

The invention relates to a detector (110) for optical detection comprising a circuit carrier (130) designed to carry at least one layer, wherein the circuit carrier (130) is or comprises a printed circuit board (132); a reflective layer (138), the reflective layer (138) being placed on a partition of the circuit carrier (130), wherein the reflective layer (138) is designed to reflect the incident light beam (120), thereby generating at least one reflected light beam (124); a substrate layer (114), the substrate layer (114) being directly or indirectly adjacent to the reflective layer (138), wherein the substrate layer (114) is at least partially transparent with respect to the incident light beam (120); a sensor layer (122), the sensor layer (122) being placed on the substrate layer (114), wherein the sensor layer (122) is designed to generate at least one sensor signal in a manner dependent on an illumination of the sensor layer (122) by the incident light beam and the reflected light beam (124); and an evaluation device (150) designed to generate at least one item of information by evaluating the sensor signal; and at least two individual electrical contacts (148, 148′) contacting the sensor layer (122), wherein the electrical contacts (148, 148′) are designed to transmit the sensor signal via the circuit carrier (130) to the evaluation device (150). The detector (110) constitutes a detector for detecting optical radiation, especially within the infrared spectral range, specifically with regard to sensing at least one of transmissivity, absorption, emission and reflectivity, being capable of avoiding a loss of incident light.

First claim

The invention claimed is:

1. A detector, comprising:
a circuit carrier designed to carry at least one layer, wherein the circuit carrier is or comprises a printed circuit board;
a reflective layer, the reflective layer being disposed on a portion of the circuit carrier, wherein the reflective layer is designed to reflect an incident light beam, thereby generating at least one reflected light beam;
a substrate layer, the substrate layer being directly or indirectly adjacent to the reflective layer, wherein the substrate layer is at least partially transparent with respect to the incident light beam and the at least one reflected light beam;
a sensor layer, the sensor layer being disposed on the substrate layer, wherein the sensor layer is designed to generate at least one sensor signal in a manner dependent on an illumination of the sensor layer by the incident light beam and the at least one reflected light beam;
an evaluation device designed to generate at least one item of information by evaluating the at least one sensor signal; and
an adhesive layer disposed between the substrate layer and the reflective layer, wherein the adhesive layer is or comprises an adhesive substance, wherein the adhesive substance is designed to assemble the substrate layer and the reflective layer.

2. The detector of claim 1 , wherein the detector is designed to detect at least one wavelength in at least a portion of an infrared spectral range of 760 nm to 1000 μm.

3. The detector of claim 1 , wherein the reflective layer is designed to reflect the incident light beam in a manner that the incident light beam is reflected back into the sensor layer after the incident light beam has, at least partially, transmitted the sensor layer before.

4. The detector of claim 1 , wherein the reflective layer is designed to provide a diffuse reflection to the incident light beam.

5. The detector of claim 4 , wherein the reflective layer comprises a rough surface, wherein the rough surface has an Ra value of at least 0.01 μm.

6. The detector of claim 1 , wherein the reflective layer is at least one of a gold layer, a silver layer, a nickel layer, a tin layer, a lead layer, a palladium layer, a platinum layer, an aluminum layer, a copper layer, or a layer of an alloy thereof.

7. The detector of claim 1 , wherein the adhesive layer is at least partially transparent with respect to the incident light beam and the at least one reflected light beam, or wherein the adhesive layer is at least partially reflective with respect to the incident light beam.

8. The detector of claim 1 , wherein the adhesive substance is an organic adhesive comprising diffusively or specularly reflecting particles.

9. The detector of claim 1 , wherein the sensor layer comprises a photosensitive material, wherein the photosensitive material is an inorganic photoconductive material comprising one or more of selenium, tellurium, a selenium-tellurium alloy, a metal oxide, a group IV element or compound, a III-V compound, a II-VI compound, a chalcogenide, a pnictogenide, a halide, and solid solutions and/or doped variants thereof.

10. The detector of claim 9 , wherein the chalcogenide is selected from the group consisting of lead sulfide (PbS), copper indium sulfide (CIS), copper indium gallium selenide (CIGS), copper zinc tin sulfide (CZTS), lead selenide (PbSe), copper zinc tin selenide (CZTSe), cadmium telluride (CdTe), mercury cadmium telluride (HgCdTe), mercury zinc telluride (HgZnTe), lead sulfoselenide (PbSSe), copper-zinc-tin sulfur-selenium chalcogenide (CZTSSe), and a solid solution and/or a doped variant thereof.

11. The detector of claim 1 , further comprising at least two individual electrical contacts contacting the sensor layer, wherein the at least two individual electrical contacts are designed to transmit the at least one sensor signal via the circuit carrier to the evaluation device.

12. The detector of claim 11 , wherein, for each of the at least two individual electrical contacts, at least one wire bond contacts the electrical contact with at least one corresponding receiving contact further disposed on the circuit carrier.

13. The detector of claim 1 , further comprising a cover layer disposed at least on the sensor layer, the cover layer being at least partially transparent with respect to the incident light beam.

14. The detector of claim 13 , wherein the cover layer comprises at least one oxide, at least one hydroxide, or a combination thereof of aluminum, titanium, zirconium, hafnium, a mixture and/or a laminate thereof.

15. The detector of claim 1 , wherein the at least one sensor signal is a longitudinal sensor signal, wherein the longitudinal sensor signal, given the same total power of the illumination, is dependent on a beam cross-section of the incident light beam in the sensor layer, wherein the evaluation device is further designed to generate at least one item of information on a longitudinal position of an object by evaluating the longitudinal sensor signal.

16. A method of detecting an incident light beam with the detector of claim 1 , the method comprising:
reflecting an incident light beam with the reflective layer, thereby generating at least one reflected light beam,
generating at least one sensor signal in a manner dependent on an illumination of the sensor layer by the incident light beam and the at least one reflected light beam, and
generating at least one item of information by evaluating the at least one sensor signal.

17. A method for manufacturing a detector, the method comprising:
a) depositing a reflective layer on a portion of a circuit carrier, the reflective layer being designed to at least partially reflect an incident light beam, thereby generating at least one reflected light beam, wherein the circuit carrier is or comprises a printed circuit board;
b) generating a sensor layer by depositing a photosensitive material on an at least partially transparent substrate layer, wherein the sensor layer is designed to generate at least one sensor signal in a manner dependent on an illumination of the sensor layer by the incident light beam and the at least one reflected light beam;
c) disposing the substrate layer carrying the sensor layer on the reflective layer;
d) disposing an adhesive layer between the substrate layer and the reflective layer, wherein the adhesive layer is or comprises an adhesive substance, wherein the adhesive substance is designed to assemble the substrate layer and the reflective layer; and
e) providing an evaluation device, wherein the evaluation device is designed to receive the at least one sensor signal and to generate at least one item of information by evaluating the at least one sensor signal.

Assignees

• Trinamix Gmbh

Inventors

• Altenbeck Timo
• Bechtel Heidi
• Hoeh Regina
• Dittmann Fabian
• Mueller Sebastian
• Hupfauer Thomas
• Kaletta Peter Paul
• Gust Robert
• Feuerstein Bertram
• Hermes Wilfried
• Valouch Sebastian
• Send Robert
• Bruder Ingmar

Classifications

• G01J5/0805 Primary

  Means for chopping radiation · CPC title

• G01J5/20 Primary

  using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices · CPC title

• H10F99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10F77/413

  directly associated or integrated with the devices, e.g. back reflectors (directly associated or integrated with photovoltaic cells H10F77/42) · CPC title

• H10F77/50

  Encapsulations or containers (for photovoltaic modules H10F19/80) · CPC title