Thermal interface material system

Patent metadata

Field	Value
Publication number	US-11060805-B2
Application number	US-201514967087-A
Country	US
Kind code	B2
Filing date	Dec 11, 2015
Priority date	Dec 12, 2014
Publication date	Jul 13, 2021
Grant date	Jul 13, 2021

Abstract

A thermal interface material system includes a thermally conductive porous matrix, the thermally conductive porous matrix having a plurality of interstitial voids, and a thermally conductive colloidal suspension disposed on each side of the thermally conductive porous matrix to inhibit thermal pump-out of the thermally conductive colloidal suspension so that the thermally conductive porous matrix and thermally conductive colloidal suspension collectively form a thermally conductive porous pad.

First claim

What is claimed is:

1. A thermal interface material system, comprising:
a thermally conductive porous matrix comprising a plurality of thermally conductive particles coupled together to define a plurality of particle formed interstitial voids, wherein the plurality of interstitial voids has an average pore size of 0.1 to 20 microns and the thermally conductive particles have a diameter of 1 to 50 microns; and
a thermally conductive colloidal suspension disposed on a first side of the thermally conductive porous matrix to form a first layer of colloidal suspension, on a second side of the thermally conductive porous matrix to form a second layer of colloidal suspension, and within at least some of the plurality of interstitial voids to inhibit migration of the thermally conductive colloidal suspension; and
wherein the thermally conductive porous matrix and thermally conductive colloidal suspension collectively form a thermally conductive porous pad.

2. A thermal interface material system, comprising:
a smooth, flat porous matrix infiltrated with a thermally conductive colloidal suspension, thereby inhibiting the migration of the thermally conductive colloidal suspension;
wherein the porous matrix comprises a plurality of thermally conductive particles coupled together to define a plurality of particle formed interstitial voids, wherein the plurality of interstitial voids has an average pore size of 0.1 to 20 microns and the thermally conductive particles have a diameter of 1 to 50 microns;
the thermally conductive colloidal suspension disposed on a first side of the thermally conductive porous matrix to form a first layer of colloidal suspension and on a second side of the thermally conductive porous matrix to form a second layer of colloidal suspension.

3. The system of claim 1 , wherein the plurality of interstitial voids has an average pore size of 1 to 10 microns.

4. The system of claim 1 , wherein the porous matrix has a uniform thickness of between 10 and 100 microns.

5. The system of claim 2 , wherein the plurality of interstitial voids has an average pore size of 1 to 10 microns.

6. The system of claim 2 , wherein the porous matrix has a uniform thickness of between 10 and 100 microns.

7. The system of claim 4 , wherein each of the first layer and second layer is 5 to 30 microns thick.

8. The system of claim 7 , wherein the porous matrix has a uniform thickness of between 20 and 80 microns.

9. The system of claim 6 wherein each of the first layer and the second layer is 5 to 30 microns thick.

10. The system of claim 9 , wherein the porous matrix has a uniform thickness of between 20 and 80 microns.

11. The system of claim 2 , wherein the first side and the second side have a surface roughness of less than 10 microns.

12. A thermal interface material system, comprising:
a thermally conductive porous pad comprising:
a planar thermally conductive porous matrix comprising thermally conductive particles coupled together to define interstitial voids, wherein the interstitial voids have an average pore size of 1 to 10 microns, the thermally conductive particles have a diameter of 1 to 50 microns, and the thermally conductive porous matrix has a uniform thickness of between 10 and 100 microns; and
a thermally conductive colloidal suspension disposed on a first side of the thermally conductive porous matrix to form a first layer of colloidal suspension, on a second side of the thermally conductive porous matrix to form a second layer of colloidal suspension, and within at least some of the plurality of interstitial voids.

13. The system of claim 12 , wherein each of the first layer and the second layer is 5 to 30 microns thick.

14. The system of claim 13 , wherein the porous matrix has a uniform thickness of between 20 and 80 microns.

15. The system of claim 13 , wherein the first side and the second side have a surface roughness of less than 10 microns.

16. The system of claim 1 , wherein the thermally conductive porous matrix is formed by layering or stacking the plurality of thermally conductive particles.

Assignees

• Teledyne Scient & Imaging Llc

Inventors

• Semenic Tadej
• Gould Kyle D
• Bhunia Avijit

Classifications

• H10W40/259

  Ceramics or glasses (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/25

  characterised by their materials · CPC title

• H10W40/257

  having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence) · CPC title

• H10W40/251

  Organics · CPC title