Vapor chamber structure

Patent metadata

Field	Value
Publication number	US-11060799-B1
Application number	US-202016828919-A
Country	US
Kind code	B1
Filing date	Mar 24, 2020
Priority date	Mar 24, 2020
Publication date	Jul 13, 2021
Grant date	Jul 13, 2021

Abstract

A vapor chamber structure includes a thin-sheet housing with a hollow interior and a composite capillary layer installed in the thin-sheet housing. The composite capillary layer is a metal woven mesh formed by weaving plural metal filaments, and each metal filament of the composite capillary layer is a steel wire having a coating layer on the exterior of the steel wire. By pulling and drawing the steel into a linear shape, a smaller wire diameter is obtained, so that the composite capillary layer will not be broken easily and can be used for making a finer woven mesh which can be installed in a thinner vapor chamber.

First claim

What is claimed is:

1. A vapor chamber structure, comprising:
a housing, with an interior substantially in a hollow form and comprising a first plate and a second plate, the first plate comprising a plurality of first support portions and the second plate comprising a plurality of second support portions, wherein the first support portions and the first plate are in a single piece form, and the second support portions and the second plate are in a single piece form; and
a composite capillary layer, disposed on the first plate, and the second plate being free from the composite capillary layer;
wherein, the composite capillary layer is a metal woven mesh and formed by weaving a plurality of metal filaments, and each metal filament of the composite capillary layer is a steel wire having a coating layer disposed on the external surface thereof, each of the first support portions comprises a first upper surface and a plurality of first upper surfaces are coplanar, and each of the second support portions comprises a second upper surface and a plurality of second upper surfaces are coplanar, and the first upper surfaces and the second upper surfaces are coplanar, and the coating layer is made of titanium.

2. The vapor chamber structure as claimed in claim 1 , wherein the housing is made of copper or aluminum.

3. The vapor chamber structure as claimed in claim 1 , wherein the first plate has a first recessed space continuously formed around the periphery of the first sealing edge and enclosed by the first plate and the first sealing edge, and the second plate is covered onto the first sealing edge to seal the first recessed space.

4. The vapor chamber structure as claimed in claim 3 , wherein the first recessed space is formed by an etching method.

5. The vapor chamber structure as claimed in claim 3 , wherein the second plate has a second recessed space continuously formed around the periphery of the second sealing edge and enclosed by the second plate and the second sealing edge.

6. The vapor chamber structure as claimed in claim 1 , wherein the coating layer is formed by a coating method.

Assignees

• Taiwan Microloops Corp

Inventors

• Lin Chun-Hung

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• F28F3/022

  the means being wires or pins · CPC title

• F28F19/06

  of metal · CPC title

• F28F2225/00

  Reinforcing means · CPC title