Plating bath and method
US-8980077-B2 · Mar 17, 2015 · US
Tin alloy plating solution
US11060200B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11060200-B2 |
| Application number | US-201917051570-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 28, 2019 |
| Priority date | Jul 27, 2018 |
| Publication date | Jul 13, 2021 |
| Grant date | Jul 13, 2021 |
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Abstract
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A tin alloy plating solution includes a soluble tin salt, a soluble salt of a metal more noble than tin, and a sulfide compound represented by General Formula (1). In the General Formula (1), (A) is a hydrocarbon group including no oxygen atom and having 1 to 2 carbon atoms, or (A) is a hydrocarbon group including one or more oxygen atoms and having 2 to 6 carbon atoms. The metal which is more noble than tin is preferably silver, copper, gold or bismuth.
First claim
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What is claimed is: 1. A tin alloy plating solution comprising: a soluble tin salt; a soluble salt of a metal which is more noble than tin; and a sulfide compound represented by General Formula (3), here, in the General Formula (3), n is 1 to 5 2. The tin alloy plating solution according to claim 1 , wherein the metal which is more noble than tin is at least one or more metals selected from silver, copper, gold, and bismuth. 3. The tin alloy plating solution according to claim 2 , further comprising at least one or more types of auxiliary complexing agent selected from a gluconic acid or a salt thereof, a citric acid or a salt thereof, a pyrophosphoric acid or a salt thereof, an ethylenediamine, a thiourea, a mercaptothiazole, a mercaptotriazole, a mercaptotetrazole, and a hydroxyalkylphosphine. 4. The tin alloy plating solution according to claim 2 , further comprising at least one or more types of surfactant selected from an anionic surfactant, a cationic surfactant, a non-ionic surfactant, and an amphoteric surfactant. 5. The tin alloy plating solution according to claim 2 , further comprising an antioxidant. 6. The tin alloy plating solution according to claim 2 , further comprising a complexing agent for tin. 7. The tin alloy plating solution according to claim 1 , further comprising at least one or more types of auxiliary complexing agent selected from a gluconic acid or a salt thereof, a citric acid or a salt thereof, a pyrophosphoric acid or a salt thereof, an ethylenediamine, a thiourea, a mercaptothiazole, a mercaptotriazole, a mercaptotetrazole, and a hydroxyalkylphosphine. 8. The tin alloy plating solution according to claim 7 , further comprising at least one or more types of surfactant selected from an anionic surfactant, a cationic surfactant, a non-ionic surfactant, and an amphoteric surfactant. 9. The tin alloy plating solution according to claim 7 , further comprising an antioxidant. 10. The tin alloy plating solution according to claim 7 , further comprising a complexing agent for tin. 11. The tin alloy plating solution according to claim 1 , further comprising at least one or more types of surfactant selected from an anionic surfactant, a cationic surfactant, a non-ionic surfactant, and an amphoteric surfactant. 12. The tin alloy plating solution according to claim 11 , further comprising an antioxidant. 13. The tin alloy plating solution according to claim 11 , further comprising a complexing agent for tin. 14. The tin alloy plating solution according to claim 1 , further comprising an antioxidant. 15. The tin alloy plating solution according to claim 14 , further comprising a complexing agent for tin. 16. The tin alloy plating solution according to claim 1 , further comprising a complexing agent for tin. 17. The tin alloy plating solution according to claim 1 , further comprising a pH adjusting agent. 18. The tin alloy plating solution according to claim 1 , further comprising a brightening agent.
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- What does patent US11060200B2 cover?
- A tin alloy plating solution includes a soluble tin salt, a soluble salt of a metal more noble than tin, and a sulfide compound represented by General Formula (1). In the General Formula (1), (A) is a hydrocarbon group including no oxygen atom and having 1 to 2 carbon atoms, or (A) is a hydrocarbon group including one or more oxygen atoms and having 2 to 6 carbon atoms. The metal which is more …
- Who is the assignee on this patent?
- Mitsubishi Materials Corp
- What technology area does this patent fall under?
- Primary CPC classification C25D3/60. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jul 13 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).