Liquid epoxy resin composition for sealing, and electronic component device

Patent metadata

Field	Value
Publication number	US-11059966-B2
Application number	US-201716096333-A
Country	US
Kind code	B2
Filing date	Apr 25, 2017
Priority date	Apr 28, 2016
Publication date	Jul 13, 2021
Grant date	Jul 13, 2021

Abstract

A liquid epoxy resin composition for sealing includes an epoxy resin, a curing agent, and a particle having a core-shell structure. In the composition, the particle having a core-shell structure includes a core including a cross-linked polysiloxane and a shell including a polymer in which the content of a structural unit having an epoxy group is 10% by mass or more.

First claim

What is claimed is:

1. A liquid epoxy resin composition for sealing, the composition comprising:
an epoxy resin comprising one or more of a liquid diglycidyl ether epoxy resin and a liquid glycidyl amine epoxy resin, the content of the epoxy resin being 15% by mass or more, with respect to the total mass of the liquid epoxy resin composition for sealing;
a curing agent comprising a liquid aromatic amine component, the ratio of the number of active hydrogens in the curing agent to the number of epoxy groups in the epoxy resin being in a range of from 0.5 to 2; and
a particle having a core-shell structure,
wherein the particle having a core-shell structure comprises: a core comprising a cross-linked polysiloxane; and a shell comprising a polymer comprising a copolymer of methyl methacrylate and glycidyl methacrylate, a content of glycidyl methacrylate ranging from 20 to 35% by mass of the copolymer; and
the content of the particle having a core-shell structure ranges from 0.1% by mass to 10% by mass, with respect to the total mass of the liquid epoxy resin composition for sealing.

2. The liquid epoxy resin composition for sealing according to claim 1 , wherein a content of the cross-linked polysiloxane is from 50% by mass to 70% by mass with respect to a total mass of the core and the shell of the particle having a core-shell structure.

3. The liquid epoxy resin composition for sealing according to claim 2 , further comprising a silane coupling agent.

4. An electronic component device, comprising an element sealed with the liquid epoxy resin composition for sealing according to claim 1 .

5. The liquid epoxy resin composition for sealing according to claim 1 , wherein the content of the epoxy resin is 20% by mass or more, with respect to the total mass of the liquid epoxy resin composition for sealing.

6. The liquid epoxy resin composition for sealing according to claim 1 , wherein the content of the epoxy resin is 25% by mass or more, with respect to the total mass of the liquid epoxy resin composition for sealing.

7. The liquid epoxy resin composition for sealing according to claim 1 , wherein the ratio of the number of active hydrogens in the curing agent to the number of epoxy groups in the epoxy resin is in a range of from 0.6 to 1.3.

8. The liquid epoxy resin composition for sealing according to claim 1 , wherein the ratio of the number of active hydrogens in the curing agent to the number of epoxy groups in the epoxy resin is in a range of from 0.8 to 1.2.

9. The liquid epoxy resin composition for sealing according to claim 1 , wherein the content of the particle having a core-shell structure ranges from 0.1% by mass to 7.5% by mass, with respect to the total mass of the liquid epoxy resin composition for sealing.

10. The liquid epoxy resin composition for sealing according to claim 1 , wherein the liquid aromatic amine component comprises one or more of diethyltoluenediamine, 1-methyl-3,5-diethyl-2,4-diaminobenzene, 1-methyl-3,5-diethyl-2,6-diaminobenzene, 1,3,5-triethyl-2,6-diaminobenzene, 3,3′-diethyl-4,4′-diaminodiphenylmethane, and 3,5,3′,5′-tetramethyl-4,4′-diaminodiphenylmethane.

11. The liquid epoxy resin composition for sealing according to claim 10 , wherein a content of the cross-linked polysiloxane is from 50% by mass to 70% by mass with respect to a total mass of the core and the shell of the particle having a core-shell structure.

12. The liquid epoxy resin composition for sealing according to claim 11 , further comprising a silane coupling agent.

13. The liquid epoxy resin composition for sealing according to claim 10 , wherein the content of the epoxy resin is 20% by mass or more, with respect to the total mass of the liquid epoxy resin composition for sealing.

14. The liquid epoxy resin composition for sealing according to claim 10 , wherein the content of the epoxy resin is 25% by mass or more, with respect to the total mass of the liquid epoxy resin composition for sealing.

15. The liquid epoxy resin composition for sealing according to claim 10 , wherein the content of the particle having a core-shell structure ranges from 0.1% by mass to 7.5% by mass, with respect to the total mass of the liquid epoxy resin composition for sealing.

Assignees

• Hitachi Chemical Co Ltd
• Showa Denko Materials Co Ltd

Inventors

• Nojiri Naoyuki
• Takahashi Hisato
• Kunimi Makoto
• Hori Kohji

Classifications

• C08L2207/53

  Core-shell polymer · CPC title

• C08L2203/206

  use in coating or encapsulating of electronic parts · CPC title

• C08G59/5033 Primary

  aromatic · CPC title

• C08L63/00 Primary

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• H10W74/476

  Organic materials comprising silicon · CPC title