Direct printing and writing using undercooled metallic core-shell particles

US11059098B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11059098-B2
Application numberUS-201815932990-A
CountryUS
Kind codeB2
Filing dateJun 6, 2018
Priority dateJun 9, 2017
Publication dateJul 13, 2021
Grant dateJul 13, 2021

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of direct printing or writing of a metallic material involves depositing, with a printing device or writing device, an ink comprising of at least undercooled liquid metallic particles dispersed in a carrier fluid. The ink is deposited on any substrate surface to deposit the undercooled liquid metal particles thereon as one or more layers that can form a desired pattern or layered structure.

First claim

Opening claim text (preview).

We claim: 1. A method of direct printing or writing of a metallic material, comprising: using a printing device or a writing device to deposit an ink comprising undercooled liquid metallic core-shell particles dispersed in a carrier fluid on a substrate surface as one or more layers, the undercooled liquid metallic core-shell particles comprising a liquid metallic core material; wherein the substrate surface comprises a thermoplastic material, a thermoset material, an amorphous material, a porous material, a fibrous material, or a combination thereof, or the carrier fluid comprises a cellulose solution, or a combination thereof. 2. The method of claim 1 including relatively moving the substrate surface and the printing or writing device to deposit the undercooled liquid metallic core-shell particles on the substrate surface. 3. The method of claim 1 including the additional step of releasing the liquid metallic core material of the undercooled liquid metallic core-shell particles and solidifying the released liquid metallic material as one or more metallic layers on the substrate surface. 4. The method of claim 3 wherein the one or more metallic layers is/are electrically conductive. 5. The method of claim 1 wherein the one or more layers is/are thermally conductive. 6. The method of claim 1 where the one or more layers is/are continuous, porous or discontinuous. 7. The method of claim 1 wherein the one or more layers form one or more straight or curvilinear electrically conductive lines. 8. The method of claim 7 wherein the lines are laterally spaced apart on the substrate surface. 9. The method of claim 7 where the lines are orthogonally positioned. 10. The method of claim 7 where the lines intersect at an angle. 11. The method of claim 7 wherein the lines are disposed one atop the other as a 3-D line. 12. The method of claim 1 wherein the writing device comprises a writing pen. 13. The method of claim 1 wherein the writing device comprises a printer. 14. The method of claim 1 where in the writing device is a tube through which the ink flows out. 15. The method of claim 14 where the tube communicates with a pump to provide a microfluidic delivery system. 16. The method of claim 13 where a flow focus nozzle is attached to the tube. 17. The method of claim 3 wherein the liquid metallic core material is released by removing at least part of a particle shell of at least some of the undercooled liquid metallic core-shell particles. 18. The method of claim 17 including using a chemical flux to release the metallic core material from the undercooled liquid metallic core-shell particles by removing at least part of a particle shell of at least some of the undercooled liquid metallic core-shell particles. 19. The method of claim 3 including mechanically fracturing at least some of the particle to release the metallic core material. 20. The method of claim 19 where a fracture force is applied using the printing device or the writing device. 21. The method of claim 19 where the fracture force is applied using a tool that includes at least one of a roller, a press, and a blunt object. 22. The method of claim 3 including using light impingement to at least release the metallic core material from the undercooled liquid metallic core-shell particles by removing at least part of a particle shell of at least some of the undercooled liquid metallic core-shell particles. 23. The method of claim 22 wherein the light is a laser. 24. The method of claim 22 wherein the light is a focused beam. 25. The method of claim 3 including using ultrasound to release the metallic core material from the undercooled liquid metallic core-shell particles by removing at least part of a particle shell of at least some of the undercooled liquid metallic core-shell particles. 26. The method of claim 3 including using vibration to release the metallic core material from the undercooled liquid metallic core-shell particles by removing at least part of a particle shell of at least some of the undercooled liquid metallic core-shell particles. 27. The method of claim 3 including using heat to release the metallic core material from the undercooled liquid metallic core-shell particles by fracturing at least part of a particle shell of at least some of the undercooled liquid metallic core-shell particles. 28. The method of claim 1 wherein the substrate surface comprises a polymer or gel. 29. The method of claim 1 wherein the substrate surface comprises a thermoplastic material. 30. The method of claim 1 wherein the substrate surface comprises a thermoset material. 31. The method of claim 1 wherein the substrate surface comprises a glass material. 32. The method of claim 1 wherein the substrate surface comprises a metal material. 33. The method of claim 1 wherein the substrate surface comprises a composite material. 34. The method of claim 1 wherein the substrate surface comprises a ceramic material. 35. The method of claim 1 wherein the substrate surface comprises a crystalline material. 36. The method of claim 1 wherein the substrate surface comprises an amorphous material. 37. The method of claim 1 wherein the substrate surface comprises a porous material. 38. The method of claim 1 wherein the substrate surface comprises a fibrous material. 39. The method of claim 1 wherein the one or more layers have a shape of a contact pad or touch pad. 40. The method of claim 1 , further comprising forming an electronic device that comprises the substrate surface, wherein the one or more layers comprise electrically interconnected, solidified metallic particle material. 41. The method of claim 40 , wherein the electronic device comprises at least one of a LED device, a MEMS device, a capacitance touch sensor, and a Wheatstone bridge. 42. The method of claim 1 wherein the substrate surface is a flexible substrate surface. 43. The method of claim 1 wherein the core-shell particles each comprise a liquid metallic core within an outer oxide shell. 44. The method of claim 1 wherein the carrier fluid is a cellulose solution.

Assignees

Inventors

Classifications

  • Direct sintering or melting · CPC title

  • Metallic particles coated with a non-metal (coated with lubricating or binding agents or with organic material B22F1/10) · CPC title

  • Microballoons or hollow filler particles · CPC title

  • Aspects linked to processes or compositions used in powder metallurgy · CPC title

  • B22F7/04Primary

    with one or more layers not made from powder, e.g. made from solid metal · CPC title

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What does patent US11059098B2 cover?
A method of direct printing or writing of a metallic material involves depositing, with a printing device or writing device, an ink comprising of at least undercooled liquid metallic particles dispersed in a carrier fluid. The ink is deposited on any substrate surface to deposit the undercooled liquid metal particles thereon as one or more layers that can form a desired pattern or layered struc…
Who is the assignee on this patent?
Univ Iowa State Res Found Inc, Safi Tech Inc, Iowa State Univ Research Foundation
What technology area does this patent fall under?
Primary CPC classification B22F7/04. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 13 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).