Method of making a low mass foam electrical structure

Patent metadata

Field	Value
Publication number	US-11056760-B2
Application number	US-201816149672-A
Country	US
Kind code	B2
Filing date	Oct 2, 2018
Priority date	Dec 10, 2010
Publication date	Jul 6, 2021
Grant date	Jul 6, 2021

Abstract

A method of making an electrical structure having a foam housing is set forth. The foam housing includes an interior surface forming a conductive cavity adapted to carry energized waveforms therethrough. An electrical component of the electrical structure is integrally formed with the interior surface as the foam housing of the structure is assembled. The method includes the steps of depositing a plating material into a mold, pouring a foam polymer into the mold and removing the plated foam structure from the mold without etching the section from the mold. The method further includes steps of forming a metallic form into a planar structure, filling the open pores of the foam with a material such as photo-resist, machining a cavity from the foam, electroplating the cavity in the foam then removing the photo-resist material.

First claim

We claim:

1. A method of manufacturing a low mass radio frequency (RF) transmission line structure comprising the steps of:
forming first and second housings of open cell metallic foam;
filling the open cell metallic foam with a filling material;
machining a first cavity in a first surface of the first housing and machining a second cavity in a first surface of the second housing;
plating the first and second cavities;
removing the filling material from the open cell metallic foam forming the first and second housings;
locating a printed circuit board comprising an electrical component between the first and second housings; and
coupling the first surface of the first housing to the first surface of the second housing so that the first and second cavities are aligned and form the RF transmission line structure.

2. The method of claim 1 wherein the filling material is a photo resist.

3. The method of claim 2 wherein the filling material is an epoxy-based negative photo resist.

4. The method of claim 1 wherein the filling material is a machining wax.

5. The method of claim 1 wherein the filling material is a polyester.

Assignees

• Northrop Grumman Systems Corp

Inventors

• Mass Steven J
• Long Anthony L
• Siddiqui Mansoor K
• Grgas Marijan D
• Akerling Gershon

Classifications

• H01P3/121 Primary

  integrated in a substrate · CPC title

• H01P3/06

  Coaxial lines · CPC title

• H01P3/08

  Microstrips; Strip lines · CPC title

• H01B3/30

  plastics; resins; waxes · CPC title

• H01P11/001

  Manufacturing waveguides or transmission lines of the waveguide type · CPC title