Method for manufacturing light emitting module with concave surface light guide plate

Patent metadata

Field	Value
Publication number	US-11056615-B2
Application number	US-201916585810-A
Country	US
Kind code	B2
Filing date	Sep 27, 2019
Priority date	Sep 28, 2018
Publication date	Jul 6, 2021
Grant date	Jul 6, 2021

Abstract

In order to obtain a light emitting module with a less unevenness of luminance, provided is a method for manufacturing a light emitting module comprising: preparing a light emitter and a light-transmissive light guide plate, the light emitter comprising a light emitting element, the light guide plate having a first main surface serving as a light emitting surface from which light is emitted outside and a second main surface located opposite to the first main surface and having a concave portion, the concave portion comprising a side surface and a bottom surface that is smaller than an opening of the concave portion in a cross-sectional view; fixing the light emitter to the bottom surface of the concave portion via a bonding member; and forming a wiring at an electrode of the light emitting element.

First claim

What is claimed is:

1. A method for manufacturing a light emitting module, comprising:
preparing a light emitter and a light-transmissive light guide plate, the light emitter comprising a light emitting element, the light guide plate having a first main surface serving as a light emitting surface from which light is emitted outside and a second main surface located opposite to the first main surface and having a concave portion, the concave portion comprising a side surface and a bottom surface that is smaller than an opening of the concave portion in a cross-sectional view;
fixing the light emitter to the bottom surface of the concave portion via a bonding member; and
forming a wiring at an electrode of the light emitting element,
wherein the side surface comprises a curved surface that is convex toward an outside of the concave portion.

2. The method for manufacturing the light emitting module according to claim 1 , wherein the side surface further comprises a vertical surface.

3. The method for manufacturing the light emitting module according to claim 1 ,
wherein the light emitter comprises the light emitting element and a light-transmissive member covering a main light emitting surface of the light emitting element, and
wherein the main light emitting surface of the light emitting element is arranged substantially on the same plane as the second main surface of the light guide plate to fix the light emitter to the light guide plate.

4. The method for manufacturing the light emitting module according to claim 3 ,
wherein an inner shape of the opening of the concave portion is set larger than an outer shape of the light-transmissive member, and
wherein the bonding member is filled into a gap between an inner periphery of the concave portion and an outer periphery of the light-transmissive member by disposing the light-transmissive member in the concave portion.

5. The method for manufacturing the light emitting module according to claim 4 , wherein the light-transmissive member comprises a wavelength conversion member.

6. The method for manufacturing the light emitting module according to claim 3 , wherein the light-transmissive member comprises a wavelength conversion member.

7. The method for manufacturing the light emitting module according to claim 6 , wherein the bonding member comprises a wavelength conversion member.

8. The method for manufacturing the light emitting module according to claim 1 , wherein the bonding member comprises a wavelength conversion member.

9. A method for manufacturing a light emitting module, comprising:
preparing a light emitter and a light-transmissive light guide plate, the light emitter comprising a light emitting element, the light guide plate having a first main surface serving as a light emitting surface from which light is emitted outside and a second main surface located opposite to the first main surface and having a concave portion, the concave portion comprising a side surface and a bottom surface that is smaller than an opening of the concave portion in a cross-sectional view;
fixing the light emitter to the bottom surface of the concave portion via a bonding member; and
forming a wiring at an electrode of the light emitting element,
wherein the side surface comprises a plane that is inclined from the bottom surface toward the opening.

10. The method for manufacturing the light emitting module according to claim 9 , wherein the side surface further comprises a vertical surface.

11. The method for manufacturing the light emitting module according to claim 9 ,
wherein the light emitter comprises the light emitting element and a light-transmissive member covering a main light emitting surface of the light emitting element, and
wherein the main light emitting surface of the light emitting element is arranged substantially on the same plane as the second main surface of the light guide plate to fix the light emitter to the light guide plate.

12. The method for manufacturing the light emitting module according to claim 9 ,
wherein the light emitter comprises the light emitting element and a light-transmissive member covering a main light emitting surface of the light emitting element,
wherein the main light emitting surface of the light emitting element is arranged substantially on the same plane as the second main surface of the light guide plate to fix the light emitter to the light guide plate,
wherein an inner shape of the opening of the concave portion is set larger than an outer shape of the light-transmissive member, and
wherein the bonding member is filled into a gap between an inner periphery of the concave portion and an outer periphery of the light-transmissive member by disposing the light-transmissive member in the concave portion.

13. The method for manufacturing the light emitting module according to claim 9 ,
wherein the light emitter comprises the light emitting element and a light-transmissive member covering a main light emitting surface of the light emitting element,
wherein the main light emitting surface of the light emitting element is arranged substantially on the same plane as the second main surface of the light guide plate to fix the light emitter to the light guide plate, and
wherein the light-transmissive member comprises a wavelength conversion member.

14. The method for manufacturing the light emitting module according to claim 9 , wherein the bonding member comprises a wavelength conversion member.

15. The method for manufacturing the light emitting module according to claim 9 ,
wherein the light emitter comprises the light emitting element and a light-transmissive member covering a main light emitting surface of the light emitting element,
wherein the main light emitting surface of the light emitting element is arranged substantially on the same plane as the second main surface of the light guide plate to fix the light emitter to the light guide plate,
wherein the light-transmissive member comprises a wavelength conversion member, and
wherein the bonding member comprises a wavelength conversion member.

16. A method for manufacturing a light emitting module, comprising:
preparing a light emitter and a light-transmissive light guide plate, the light emitter comprising a light emitting element, the light guide plate having a first main surface serving as a light emitting surface from which light is emitted outside and a second main surface located opposite to the first main surface and having a concave portion, the concave portion comprising a side surface and a bottom surface that is smaller than an opening of the concave portion in a cross-sectional view;
fixing the light emitter to the bottom surface of the concave portion via a bonding member; and
forming a wiring at an electrode of the light emitting element,
wherein the light emitter comprises the light emitting element and a light-transmissive member covering a main light emitting surface of the light emitting element, and
wherein the main light emitting surface of the light emitting element is arranged substantially on the same plane as the second main surface of the light guide plate to fix the light emitter to the light guide plate.

17. The method for manufacturing the light emitting module according to claim 16 ,
wherein an inner shape of the opening of the concave portion is set larger than an outer shape of the light-transmissive member, and
wherein the bonding member is filled into a gap between an inner periphery of the concave portion and an outer periphery of the light-transmissive member by dispos

Assignees

• Nichia Corp

Inventors

• Kasai Daisuke
• Miki Akira
• Hashimoto Toru
• Daikoku Shinichi

Classifications

• H10H20/0361

  of wavelength conversion means · CPC title

• H10H20/8514

  characterised by their shape, e.g. plate or foil · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/0363

  of optical field-shaping means · CPC title

• H10H20/821 Primary

  of the light-emitting regions, e.g. non-planar junctions · CPC title