Strain gauge with mechanically decoupled temperature sensor

Patent metadata

Field	Value
Publication number	US-11054319-B2
Application number	US-202017018276-A
Country	US
Kind code	B2
Filing date	Sep 11, 2020
Priority date	Feb 19, 2018
Publication date	Jul 6, 2021
Grant date	Jul 6, 2021

Abstract

A semiconductor device includes a strain gauge on a substrate, the strain gauge configured to measure a stress of the substrate; and a temperature sensor disposed within the substrate, the temperature sensor being decoupled from the stress of the substrate.

First claim

What is claimed is:

1. A method of forming a semiconductor device, the method comprising:
forming a strain gauge on a substrate, the strain gauge configured to measure a stress of the substrate; and
forming a temperature sensor in an opening of the substrate, the temperature sensor being attached to the substrate by a spring.

2. The method of claim 1 , wherein the spring decouples the temperature sensor from the stress of the substrate.

3. The method of claim 2 , wherein the spring thermally couples the temperature sensor with the substrate.

4. The method of claim 2 , wherein the spring is a silicon spring.

5. The method of claim 4 , wherein the silicon spring comprises a first electrically conductive feature that electrically couples the temperature sensor to a second electrically conductive feature of the substrate.

6. The method of claim 1 , wherein forming the strain gauge and forming the temperature sensor comprise:
forming the strain gauge and the temperature sensor in a first portion and a second portion of the substrate, respectively; and
after forming the strain gauge and the temperature sensor, patterning the substrate, wherein after the patterning, a third portion of the substrate around the second portion is removed to form the opening, a fourth portion of the substrate between the first portion and the second portion form the spring, and the second portion of the substrate comprising the temperature sensor is attached to the first portion of the substrate comprising the strain gauge by the spring.

7. The method of claim 1 , wherein forming the strain gauge comprises forming a sensing bridge that includes a first piezoresistor, a second piezoresistor, a third piezoresistor, and a fourth piezoresistor, wherein the first piezoresistor and the second piezoresistor are formed to have a positive correlation with the stress of the substrate, and wherein the third piezoresistor and the fourth piezoresistor are formed to have a negative correlation with the stress of the substrate.

8. The method of claim 7 , wherein a first longitudinal axis of the first piezoresistor and a second longitudinal axis of the second piezoresistor are formed to extend parallel to a direction of the stress of the substrate, and a third longitudinal axis of the third piezoresistor and a fourth longitudinal axis of the fourth piezoresistor are formed to extends perpendicular to the direction of the stress of the substrate.

9. The method of claim 7 , wherein longitudinal axes of the first piezoresistor, the second piezoresistor, the third piezoresistor, and the fourth piezoresistor are formed to extend parallel to each other.

10. The method of claim 7 , wherein the first piezoresistor, the second piezoresistor, the third piezoresistor, and the fourth piezoresistor are formed of a piezoresistive material.

11. The method of claim 7 , wherein the first piezoresistor, the second piezoresistor, the third piezoresistor, and the fourth piezoresistor are formed as four monocrystalline piezoresistors, four polycrystalline piezoresistors, or two monocrystalline piezoresistors and two polycrystalline piezoresistors.

12. The method of claim 1 , wherein forming the strain gauge comprises forming a capacitor, wherein a capacitance of the capacitor is configured to change in response to a change in the stress of the substrate.

13. A method of forming a semiconductor device, the method comprising:
forming an opening in a substrate;
forming a temperature sensor in the opening of the substrate; and
forming a spring comprising a semiconductor material of the substrate, wherein the temperature sensor is attached to the substrate by the spring.

14. The method of claim 13 , wherein the temperature sensor is suspended in the opening by the spring and is decoupled from a stress in the substrate.

15. The method of claim 13 , wherein forming the temperature sensor comprises forming a thermal bridge that includes a first resistor, a second resistor, a third resistor, and a fourth resistor, and wherein the first resistor, the second resistor, the third resistor, the fourth resistor are electrically connected in a Wheatstone bridge configuration, wherein the first resistor and the second resistor are formed to have positive correlations with temperature, and the third resistor and the fourth resistor are formed to have negative correlations with temperature.

16. The method of claim 15 , wherein longitudinal axes of the first resistor, the second resistor, the third resistor, and the fourth resistor are orientated in a same direction.

17. The method of claim 15 , wherein the first resistor and the second resistor are formed as polycrystalline semiconductor resistors, and the third resistor and the fourth resistor are formed as monocrystalline semiconductor resistors.

18. A method of forming a semiconductor device, the method comprising:
etching a substrate to form first recesses, second recesses, and third recesses that extend into the substrate from a first side of the substrate, wherein after the etching, a first portion of the substrate is disposed between the first recesses and the second recesses, and a second portion of the substrate is disposed between the second recesses and the third recesses;
forming an epitaxial semiconductor material over the first side of the substrate and over the first recesses, the second recesses, and the third recesses;
performing a thermal anneal process after forming the epitaxial semiconductor material, wherein after the thermal anneal process, the first recesses merge to form a first recess, the second recesses merge to form a second recess, and the third recesses merge to form a third recess;
after performing the thermal anneal process, patterning the epitaxial semiconductor material to remove portions of the epitaxial semiconductor material, wherein after the patterning, a first portion of the epitaxial semiconductor material is disposed over the first portion of the substrate, a second portion of the epitaxial semiconductor material is disposed over the third recess, and a third portion of the epitaxial semiconductor material over the third recess forms a spring that attaches the second portion of the epitaxial semiconductor material to the substrate;
forming a strain gauge on the first portion of the epitaxial semiconductor material; and
forming a temperature sensor on the second portion of the epitaxial semiconductor material.

19. The method of claim 18 , further comprising, after forming the strain gauge and the temperature sensor, forming a fourth recess that extends into the substrate from a second side of the substrate opposite to the first side of the substrate.

20. The method of claim 18 , further comprising, after forming the strain gauge and the temperature sensor, attaching a cover to the first side of the substrate, wherein the strain gauge and the temperature sensor are disposed in an enclosed space between the cover and the first side of the substrate.

Assignees

• St Microelectronics Srl

Inventors

• Caltabiano Daniele

Classifications

• G01L9/0054

  integral with a semiconducting diaphragm · CPC title

• G01B7/22

  using change in capacitance · CPC title

• G01L9/0042 Primary

  Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms (details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively) · CPC title

• G01D5/16

  by varying resistance · CPC title

• G01L19/0092

  Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature (G01L9/025, G01L9/045, G01L9/065, G01L9/085, G01L9/105, G01L9/125, G01L19/02, G01L19/04 take precedence; measuring two or more variable G01D21/02; temperature sensors with pressure compensation G01K1/26) · CPC title