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Method of manufacturing a complex product by an additive process
US11053603B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11053603-B2 |
| Application number | US-201916250206-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 17, 2019 |
| Priority date | Aug 11, 2015 |
| Publication date | Jul 6, 2021 |
| Grant date | Jul 6, 2021 |
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- Title
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Abstract
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A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method of producing a complex product, the method comprising the steps of: designing a three dimensional preform of the complex product to form a model preform by computer aided design software at using a PC controller producing a computer aided design (CAD) model of said model preform, electronically slicing said computer aided design (CAD) model into data files producing a digital image of said model preform, providing a photoresist/photo-curable composition, creating a three dimensional preform of the complex product using said model preform by projecting said digital image of said model preform into said photoresist/photo-curable composition, depositing diamond nanoparticles on said created three dimensional preform by electrophoretic deposition, depositing copper nanoparticles on said created three dimensional preform by electroplating, and removing the created three dimensional preform producing the complex product from the deposited diamond nanoparticles material and deposited copper nanoparticles material. 2. The method of producing a complex product of claim 1 wherein said step of projecting said digital image of said model preform into said photoresist/photo-curable composition comprises using a light beam for projecting said digital image of said model preform into said photoresist/photo-curable composition. 3. The method of producing a complex product of claim 2 wherein said step of using a light beam for projecting said digital image of said model preform into said photoresist/photo-curable composition comprises using an ultraviolet light beam for projecting said digital image of said model preform into said photoresist/photo-curable composition. 4. The method of producing a complex product of claim 2 wherein said step of using a light beam for projecting said digital image of said model preform into said photoresist/photo-curable composition comprises using a lcos chip for using a light beam for projecting said digital image of said model preform into said photoresist/photo-curable composition. 5. The method of producing a complex product of claim 1 wherein said model preform is a polymer model preform. 6. The method of producing a complex product of claim 5 wherein said step of removing the created three dimensional preform producing the complex product from the deposited material comprises using sintering for removing the created three dimensional polymer preform producing the complex product from the deposited material.
Assignees
Inventors
Classifications
- C25D13/12Primary
characterised by the article coated · CPC title
Heat sinks · CPC title
Heat sinks · CPC title
Combined electrolytic and electrophoretic processes {with charged materials} · CPC title
Processes of additive manufacturing · CPC title
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- What does patent US11053603B2 cover?
- A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electroni…
- Who is the assignee on this patent?
- L Livermore Nat Security Llc
- What technology area does this patent fall under?
- Primary CPC classification C25D13/12. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jul 06 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).