Bubble-jetting chip, localized ablation device and localized ablation method, and injection device and injection method

Patent metadata

Field	Value
Publication number	US-11053472-B2
Application number	US-201515512618-A
Country	US
Kind code	B2
Filing date	Sep 29, 2015
Priority date	Sep 30, 2014
Publication date	Jul 6, 2021
Grant date	Jul 6, 2021

Abstract

The present invention enables fabrication and mass production of a bubble-jetting chip that includes a desired number of bubble jetting portions of the same size having bubble-jetting outlets of the same size.Mass production is enabled by fabricating a bubble-jetting chip comprising a substrate and a bubble-jetting portion formed on the substrate, the bubble-jetting portion comprising: an electrode that is formed of a conductive material; an insulating portion that is formed of an insulating photosensitive resin, is provided so as to sandwich the electrode, and includes an extended section that extends beyond the tip of the electrode; and a space that is formed between the extended section of the insulating portion and the tip of the electrode.

First claim

What is claimed is:

1. A bubble-jetting chip, comprising:
a substrate with two or more bubble jetting portions and two or more assist channels formed on the substrate;
the bubble-jetting portions comprising:
an electrode that is formed of a conductive material;
an insulating portion formed of an insulating photosensitive resin that sandwiches the electrode and includes an extended section that extends beyond the tip of the electrode;
a bubble-jetting outlet that is formed at the tip of the extended section; and a space that is formed between the extended section of the insulating portion and the tip of the electrode wherein the insulating portion is continuously formed from the section that sandwiches the electrode to the bubble-jetting outlet, the electrode is either formed on an energizing portion which is formed on the substrate or the electrode is formed on the substrate, and
wherein at least one of the assist channel is formed in the insulation portion and is parallel with at least one of the adjacent bubble jetting portions.

2. The bubble-jetting chip according to claim 1 , wherein the extended section is tapered.

3. The bubble-jetting chip according to claim 2 , wherein the photosensitive resin is a negative photoresist.

4. The bubble-jetting chip according to claim 1 , wherein the photosensitive resin is a negative photoresist.

5. The bubble-jetting chip according to claim 4 , wherein an injection solution channel is formed around the bubble-jetting portion.

6. The bubble jetting chip according to claim 1 , wherein the electrode is formed on the energizing portion which is formed on the substrate.

7. The bubble-jetting chip according to claim 1 , wherein a counter electrode that constitutes an electrode pair with the electrode of the bubble-jetting portion is formed on the substrate.

8. The bubble jetting chip according to claim 1 , wherein an injection solution channel is formed around the bubble-jetting portion.

9. The bubble jetting chip according to claim 1 , wherein the substrate forms a part of the bubble-jetting outlet.

10. A localized ablation device, comprising the bubble-jetting chip according to claim 1 .

11. An injection device, comprising the bubble-jetting chip according to claim 1 .

12. A localized ablation device, comprising the bubble-jetting chip according to claim 4 .

13. An injection device, comprising the bubble-jetting chip according to claim 4 .

14. A localized ablation method, comprising:
injecting a solution so that a counter electrode has continuity with the electrode of the localized ablation device according to claim 10 ;
applying high-frequency pulses to the electrode of the localized ablation device and the counter electrode to cause bubbles to be ejected from the tip of the bubble-jetting portion; and
processing a process target with the bubbles.

15. An injection method, comprising:
injecting a solution so that a counter electrode has continuity with the electrode of the injection device according to claim 11 ;
delivering a solution containing an injection material to the front of the bubble-jetting portion;
applying high-frequency pulses to the electrode of the injection device and the counter electrode to cause the ejection of bubbles onto which the solution containing the injection material is adsorbed; and
introducing the injection material into a process target while localized ablation is performed on the process target with the bubbles.

Assignees

• Japan Science & Tech Agency

Inventors

• Yamanishi Yoko
• Hamano Yohei
• Kambayashi Takuya

Classifications

• B05B17/0607

  generated by electrical means, e.g. piezoelectric transducers · CPC title

• A61B18/14

  Probes or electrodes therefor · CPC title

• C12M35/04 Primary

  Mechanical means, e.g. sonic waves, stretching forces, pressure or shear stimuli · CPC title

• C12N15/89

  using microinjection · CPC title

• C12N13/00

  Treatment of microorganisms or enzymes with electrical or wave energy, e.g. magnetism, sonic waves · CPC title