Cleaning composition for semiconductor substrate

Patent metadata

Field	Value
Publication number	US-11053457-B2
Application number	US-201916595899-A
Country	US
Kind code	B2
Filing date	Oct 8, 2019
Priority date	Apr 13, 2017
Publication date	Jul 6, 2021
Grant date	Jul 6, 2021

Abstract

A composition for cleaning a semiconductor substrate contains: a novolak resin; an organic acid not being a polymeric compound; and a solvent. A solid content concentration of the composition is no greater than 20% by mass. The organic acid is preferably a carboxylic acid. The carboxylic acid is preferably a monocarboxylic acid, polycarboxylic acid or a combination thereof. The molecular weight of the organic acid is preferably from 50 to 500. The content of the organic acid with respect to 10 parts by mass of the novolak resin is preferably from 0.001 parts by mass to 10 parts by mass. The solvent includes preferably an ether solvent, an alcohol solvent, or a combination thereof. The proportion of the ether solvent, the alcohol solvent, or the combination thereof in the solvent is preferably no less than 50% by mass.

First claim

The invention claimed is:

1. A composition for cleaning a semiconductor substrate, comprising:
a novolak resin;
an organic acid not being a polymeric compound; and
a solvent, wherein a solid content concentration of the composition is no greater than 20% by mass, and
the organic acid comprises at least one selected from the group consisting of
acetic acid, propionic acid, butanoic acid, pentanoic acid, hexanoic acid, cyclohexanecarboxylic acid, cyclohexyl acetic acid, 1-adamantanecarboxylic acid, benzoic acid, phenylacetic acid,
difluoroacetic acid, trifluoroacetic acid, pentafluoropropanoic acid, heptafluorobutanoic acid, fluorophenyl acetic acid, difluorobenzoic acid,
10-hydroxydecanoic acid, 5-oxohexanoic acid, 3-methoxycyclohexanecarboxylic acid, camphorcarboxylic acid, dinitrobenzoic acid, nitrophenylacetic acid, lactic acid, glycolic acid, glyceric acid, salicylic acid, anisic acid, gallic acid, furan carboxylic acid,
(meth)acrylic acid, crotonic acid, cinnamic acid, sorbic acid,
oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, dodecanedicarboxylic acid, propanetricarboxylic acid, butanetetracarboxylic acid, cyclohexanehexacarboxylic acid, 1,4-naphthalenedicarboxylic acid, isophthalic acid, terephthalic acid,
difluoromalonic acid, tetrafluorophthalic acid, hexafluoroglutaric acid,
tartaric acid, citric acid, malic acid, tartronic acid, diglycolic acid, iminodiacetic acid,
maleic acid, fumaric acid, and aconitic acid.

2. The composition according to claim 1 , wherein the organic acid comprises at least one selected from the group consisting of
oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, dodecanedicarboxylic acid, propanetricarboxylic acid, butanetetracarboxylic acid, cyclohexanehexacarboxylic acid, 1,4-naphthalenedicarboxylic acid, isophthalic acid, terephthalic acid,
difluoromalonic acid, tetrafluorophthalic acid, hexafluoroglutaric acid,
tartaric acid, citric acid, malic acid, tartronic acid, diglycolic acid, iminodiacetic acid,
maleic acid, fumaric acid, and aconitic acid.

3. The composition according to claim 2 , wherein the organic acid comprises at least one selected from the group consisting of malonic acid, succinic acid, glutaric acid, adipic acid, dodecanedicarboxylic acid, propanetricarboxylic acid, butanetetracarboxylic acid, hexafluoroglutaric acid, cyclohexanehexacarboxylic acid, 1,4-naphthalenedicarboxylic acid, isophthalic acid, terephthalic acid, citric acid, malic acid, and aconitic acid.

4. The composition according to claim 1 , wherein a content of the organic acid with respect to 10 parts by mass of the novolak resin is no less than 0.01 parts by mass and no greater than 5 parts by mass.

5. The composition according to claim 1 , wherein a content of the organic acid with respect to 10 parts by mass of the novolak resin is no less than 0.001 parts by mass and no greater than 10 parts by mass.

6. The composition according to claim 1 , wherein the solvent comprises an ether solvent, an alcohol solvent, or a combination thereof.

7. The composition according to claim 6 , wherein a proportion of the ether solvent, the alcohol solvent, or the combination thereof in the solvent is no less than 50% by mass.

8. The composition according to claim 6 , wherein the solvent comprises alkylene glycol monoalkyl ether.

9. The composition according to claim 1 , wherein a proportion of the novolak resin in a solid content is no less than 70% by mass.

10. The composition according to claim 1 , wherein the novolak resin is one of
novolak resin (A-1) having a molecular weight of 50,000,
novolak resin (A-2) having a molecular weight of 3,000,
novolak resin (A-3) having a molecular weight of 10,000,
novolak resin (A-4) having a molecular weight of 10,000,
novolak resin (A-5) having a molecular weight of 10,000,
novolak resin (A-6) having a molecular weight of 8,000,
novolak resin (A-7) having a molecular weight of 10,000, and
novolak resin (A-8) having a molecular weight of 5,000

11. The composition according to claim 10 , wherein the novolak resin is one of the novolak resin (A-1), the novolak resin (A-6), and the novolak resin (A-7).

12. The composition according to claim 10 , wherein the novolak resin is the novolak resin (A-1).

13. The composition according to claim 10 , wherein the novolak resin is the novolak resin (A-6).

14. The composition according to claim 10 , wherein the novolak resin is the novolak resin (A-7).

15. The composition according to claim 10 , wherein the organic acid comprises at least one selected from the group consisting of tartaric acid, citric acid, malic acid, tartronic acid, diglycolic acid, and iminodiacetic acid.

16. The composition according to claim 11 , wherein the organic acid comprises at least one selected from the group consisting of acetic acid, propionic acid, sorbic acid, oxalic acid, malic acid, aconitic acid, and citric acid.

17. The composition according to claim 10 , wherein the organic acid comprises malic acid.

18. The composition according to claim 11 , wherein the organic acid comprises malic acid.

19. The composition according to claim 17 , wherein a proportion of the novolak resin in a solid content is 70%-99.99% by mass.

20. The composition according to claim 18 , wherein a proportion of the novolak resin in a solid content is 95%-99.0% by mass.

Assignees

• Jsr Corp

Inventors

• Aoki Shun
• Chung Kan-Go
• Matsuki Tomohiro
• Sakai Tatsuya
• Mochida Kenji
• Matsumura Yuushi

Classifications

• H10P70/20 Primary

  Cleaning during device manufacture · CPC title

• C11D7/265

  Carboxylic acids or salts thereof · CPC title

• C11D3/43

  Solvents · CPC title

• C11D1/008

  Polymeric surface-active agents · CPC title

• C11D7/5022

  containing oxygen · CPC title