Sensor package substrate and sensor module having the same

Patent metadata

Field	Value
Publication number	US-11053118-B2
Application number	US-201916587794-A
Country	US
Kind code	B2
Filing date	Sep 30, 2019
Priority date	Oct 3, 2018
Publication date	Jul 6, 2021
Grant date	Jul 6, 2021

Abstract

Disclosed herein is a sensor package substrate that includes a first mounting area for mounting a sensor chip. The sensor package substrate has a through hole formed at a position overlapping the first mounting area in a plan view so as to penetrate the sensor package substrate from one surface to the other surface. The through hole includes a first section having a first diameter and a second section having a second diameter smaller than the first diameter. A step part inside the through hole positioned at a boundary between the first and second sections constitutes a second mounting area for mounting an anti-dust filter.

First claim

What is claimed is:

1. A sensor package substrate comprising a first mounting area for mounting a sensor chip,
wherein the sensor package substrate has a through hole formed at a position overlapping the first mounting area in a plan view so as to penetrate the sensor package substrate from one surface to other surface,
wherein the through hole includes a first section having a first diameter and a second section having a second diameter smaller than the first diameter,
wherein a step part inside the through hole positioned at a boundary between the first and second sections constitutes a second mounting area for mounting an anti-dust filter,
wherein the sensor package substrate further comprises an electronic component embedded therein so as not to overlap the through hole,
wherein the first section of the through hole is opened to the one surface so that the one surface of the sensor package substrate has a first opening having the first diameter,
wherein the first mounting area is positioned on a side of the one surface, and
wherein the second section of the through hole is opened to the other surface so that the other surface of the sensor package substrate has a second opening having the second diameter.

2. The sensor package substrate as claimed in claim 1 , wherein at least one of the first and second sections of the through hole has a tapered shape in which a diameter thereof is continuously changed in a depth direction.

3. The sensor package substrate as claimed in claim 1 , wherein the first section of the through hole is opened to the other surface, and
wherein the first mounting area is positioned on the side of the one surface.

4. The sensor package substrate as claimed in claim 1 , wherein the through hole further includes a third section having a third diameter larger than the second diameter, and wherein the second section is positioned between the first and second sections.

5. The sensor package substrate as claimed in claim 4 , wherein a step part inside the through hole positioned at the boundary between the second and third sections constitutes the first mounting area.

6. The sensor package substrate as claimed in claim 1 , wherein the through hole further includes a third section having a third diameter larger than the first diameter, wherein the first section is positioned between the second and third sections, and
wherein a step part inside the through hole positioned at the boundary between the first and third sections constitutes the first mounting area.

7. The sensor package substrate as claimed in claim 1 ,
wherein the first mounting area and the electronic component overlaps each other in a plan view.

8. The sensor package substrate as claimed in claim 1 , wherein the electronic component comprises a semiconductor IC.

9. The sensor package substrate as claimed in claim 1 ,
wherein the sensor package substrate comprises a plurality of insulating layers and a plurality of wiring layers, and
wherein the through hole is formed so as to penetrate the plurality of insulating layers and the plurality of wiring layers.

10. The sensor package substrate as claimed in claim 9 , wherein a part of the wiring layers is exposed on an inner wall of the through hole.

11. A sensor module comprising:
a sensor package substrate having first and second mounting areas;
a sensor chip mounted on the first mounting area; and
an anti-dust filter mounted on the second mounting area, wherein the sensor package substrate has a through hole formed at a position overlapping the first mounting area in a plan view so as to penetrate the sensor package substrate from one surface to other surface,
wherein the through hole includes a first section having a first diameter and a second section having a second diameter smaller than the first diameter,
wherein a step part inside the through hole positioned at a boundary between the first and second sections constitutes the second mounting area,
wherein the sensor package substrate further has an electronic component embedded therein so as not to overlap the through hole,
wherein the first section of the through hole is opened to the one surface so that the one surface of the sensor package substrate has a first opening having the first diameter,
wherein the first mounting area is positioned on a side of the one surface, and
wherein the second section of the through hole is opened to the other surface so that the other surface of the sensor package substrate has a second opening having the second diameter.

12. The sensor module as claimed in claim 11 , wherein the sensor chip is a sensor that detects air vibration, air pressure, air temperature or air composition.

13. The sensor module as claimed in claim 11 , wherein the electronic component is embedded in the sensor package substrate so as not to overlap the anti-dust filter.

14. The sensor module as claimed in claim 13 , wherein the electronic component overlaps the sensor chip.

15. An apparatus comprising:
a first insulating layer having a first through hole penetrating therethrough;
a second insulating layer having a second through hole penetrating therethrough; and
a plurality of wiring layers located on or embedded in the first and second insulating layers,
wherein the first and second insulating layers are stacked to each other so that the first and second through holes overlap each other,
wherein the first and second insulating layers have a same outer shape as each other,
wherein the first through hole is greater in diameter than the second through hole so that a part of a surface of the second insulating layer is exposed in a ring shaped at a boundary between the first and second through holes, and
wherein the plurality of wiring layers are removed at a position overlapping the first and second through holes so as not to clog the first and second through holes.

16. The apparatus as claimed in claim 15 , wherein the first and second insulating layers are stacked to each other so as to form a single multilayer circuit substrate.

17. The apparatus as claimed in claim 16 ,
wherein the first insulating layer has a first surface,
wherein the second insulating layer has a second surface, wherein the first and second insulating layers are stacked to each other such that the first and second surfaces are in contact with each other, and
wherein the first surface is completely covered with the second surface.

18. The apparatus as claimed in claim 15 , further comprising an electronic component embedded in the first or second insulating layer so as not to overlap the first and second through holes.

Assignees

• Tdk Corp

Inventors

• Tsuyutani Kazutoshi
• Suzuki Yoshihiro

Classifications

• H10W70/681

  comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage · CPC title

• H10W70/099

  Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/874

  On different surfaces · CPC title