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US-12140831-B2 · Nov 12, 2024 · US
Thermal fill bonding method
US11052614B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11052614-B2 |
| Application number | US-202016835447-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 31, 2020 |
| Priority date | Aug 19, 2014 |
| Publication date | Jul 6, 2021 |
| Grant date | Jul 6, 2021 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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- CPC / IPC classifications
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- Citations and related patents
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Abstract
Official abstract text for this publication.
A Thermal Bonding Method and Apparatus to thermally bond sheets of fill in a cooling tower fill pack. The apparatus creates a hemispherical joint extending through two fill sheets to provide a substantial joint between said sheets.
First claim
Opening claim text (preview).
The invention claimed is: 1. A thermal bonding device comprising: a hemispherical bonding tip extending through an insulating bushing; a heater block to provide a temperature sufficient to heat the bonding tip to a melting point of a film fill sheet; a spring mechanism attached to the bonding tip to provide a resistance force; a sliding mechanism allowing the bonding tip to move vertically; and an air conduit having an outlet on a contact surface of said bonding tip to provide a pulse of air to a bond zone of the film fill sheet. 2. The device of claim 1 further comprising a weight to provide resistance to the bonding tip. 3. The device of claim 1 comprising a non-cylindrical insulating bushing shape.
Assignees
Inventors
Classifications
comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF · CPC title
- B32B27/06Primary
as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a layer of a particular substance B32B9/045; next to a bituminous or tarry layer B32B11/046; next to a water setting substance layer B32B13/12; next to a metal layer B32B15/08; next to a glass layer B32B17/10; next to a layer formed of natural mineral fibres or particles B32B19/045; next to a wood layer B32B21/08; next to a cellulosic plastic layer B32B23/08; next to a natural or synthetic rubber layer B32B25/08)} · CPC title
- B29C66/87Primary
Auxiliary operations or devices · CPC title
Joining a relatively small portion of the surface of said articles (B29C66/45 takes precedence) · CPC title
- B29C65/18Primary
using heated tools · CPC title
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Frequently asked questions
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- What does patent US11052614B2 cover?
- A Thermal Bonding Method and Apparatus to thermally bond sheets of fill in a cooling tower fill pack. The apparatus creates a hemispherical joint extending through two fill sheets to provide a substantial joint between said sheets.
- Who is the assignee on this patent?
- Evapco Inc
- What technology area does this patent fall under?
- Primary CPC classification B32B27/06. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jul 06 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).