Adhesive bondline spacer clip

US11052612B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11052612-B2
Application numberUS-201916379895-A
CountryUS
Kind codeB2
Filing dateApr 10, 2019
Priority dateApr 13, 2018
Publication dateJul 6, 2021
Grant dateJul 6, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A spacer clip for ensuring a minimum adhesive bond line thickness (T) during an attachment event with an adhesive, the spacer clip including: a spacer element having a thickness (t) defining the minimum bond line thickness, adapted to be arranged interleaved between a first vehicle part and a second vehicle part, a hold portion generally parallel with the spacer element and attached to the spacer element with an interconnecting portion. The spacer clip is mountable on the first vehicle part. The hold portion is adapted to be arranged on an opposite side of the first vehicle part compared to the spacer element. The spacer element and the hold portion are adapted to maintain a pressure on the first vehicle part such that the spacer clip can be mounted on the first vehicle part prior to the attachment event.

First claim

Opening claim text (preview).

The invention claimed is: 1. A spacer clip for ensuring a minimum adhesive bond line thickness (T) during an attachment event for attaching a first vehicle part with a second vehicle part with an adhesive, the spacer clip comprising: a spacer element having a thickness (t) defining the minimum bond line thickness, the spacer element is adapted to be arranged interleaved between the first vehicle part and the second vehicle part when attaching the first vehicle part with the second vehicle part, a hold portion generally parallel with the spacer element, the hold portion is attached to the spacer element with an interconnecting portion, wherein the spacer clip is mountable on the first vehicle part, wherein the hold portion is adapted to be arranged on an opposite side of the first vehicle part compared to the spacer element during the attachment event, wherein, the spacer element and the hold portion are adapted to maintain a pressure on the first vehicle part such that the spacer clip can be mounted on the first vehicle part prior to the attachment event and maintain mounted on the vehicle part during the attachment event, wherein the spacer clip comprises at least one weakening groove such that the spacer clip may be separated in two pieces at the weakening grooves. 2. The spacer clip according to claim 1 , wherein the spacer element is generally planar. 3. The spacer clip according to claim 1 , wherein the spacer element has a uniform thickness (t) corresponding to the minimum bond line thickness. 4. The spacer clip according to claim 1 , wherein the interconnecting portion comprises a resilient material such that when the spacer element and the hold portion are forced further apart from each other from a neutral position, the interconnecting portion attempts to bring the spacer element and the hold portion back to the neutral position. 5. The spacer clip according to claim 1 , wherein the spacer clip comprises a plastic material. 6. The spacer clip according to claim 1 , wherein the spacer clip is generally U-shaped. 7. The spacer clip according to claim 1 , wherein the spacer element, the hold portion and the interconnecting portion are made in a single piece. 8. The spacer clip according to claim 1 , wherein a width (L 3 ) of the spacer element is larger than the thickness of the spacer element.

Assignees

Inventors

Classifications

  • for positioning only · CPC title

  • B60J1/005Primary

    using positioning means during mounting · CPC title

  • said distance pieces being non-integral with the parts to be joined, e.g. particles · CPC title

  • by gluing (gluing of plastics material B29C65/48) · CPC title

  • Connections by glue bonding (in general F16B11/00; processes C09J5/00) · CPC title

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Frequently asked questions

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What does patent US11052612B2 cover?
A spacer clip for ensuring a minimum adhesive bond line thickness (T) during an attachment event with an adhesive, the spacer clip including: a spacer element having a thickness (t) defining the minimum bond line thickness, adapted to be arranged interleaved between a first vehicle part and a second vehicle part, a hold portion generally parallel with the spacer element and attached to the spac…
Who is the assignee on this patent?
Volvo Car Corp
What technology area does this patent fall under?
Primary CPC classification B60J1/005. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 06 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).