Device for dynamic fluid pinning

US11051567B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11051567-B2
Application numberUS-201816146877-A
CountryUS
Kind codeB2
Filing dateSep 28, 2018
Priority dateSep 28, 2017
Publication dateJul 6, 2021
Grant dateJul 6, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure provides microstructured hydrophobic surfaces and devices for gripping wet deformable surfaces. The surfaces and devices disclosed herein utilize a split contact Wenzel-Cassie mechanism to develop multi-level Wenzel-Cassie structures. The Wenzel-Cassie structures are separated with a spatial period corresponding to at least one wrinkle eigenmode of a wet deformable surface to which the microstructure or device is designed to contact, allowing grip of the deformable surface without slippage. Microstructures of the present invention are specifically designed to prevent the formation of Shallamach waves when a shear force is applied to a deformable surface. The multi-level Wenzel-Cassie states of the present disclosure develop temporally, and accordingly are characterized by hierarchical fluid pinning, both in the instance of slippage, and more importantly in the instance of localization. This temporal aspect to the multi-level Wenzel-Cassie state delays or prevents the transition from a wrinkled eigenmode state in a deformable surface to a buckled state in a deformable surface.

First claim

Opening claim text (preview).

What is claimed is: 1. A device comprising a microstructured surface having at least two hierarchical levels that are self-similar, including a first level and a second level, each of the first and second levels include microfeatures wherein the first level microfeatures have a width of 10 to 500 microns, a height of 10 to 500 microns, and a pitch between adjacent microfeatures of 10 to 500 microns, the second level microfeatures have a width of 100 to 10,000 microns, a height of 100 to 10,000 microns, and a pitch between adjacent microfeatures of 100 to 10,000 microns, the first level being disposed about the second level, the at least two hierarchical levels produce Wenzel-Cassie fluid pinning states when placed in contact with a wet surface, and the at least two hierarchical levels produce split contact Wenzel-Cassie wetting states. 2. The device of claim 1 , wherein the at least two hierarchical levels produce frustrated wetting states. 3. The device of claim 2 , wherein the at least two hierarchical levels produce frustrated contact surfaces. 4. The device of claim 1 , wherein the at least two hierarchical levels produce metastable wetting states on at least one hierarchical level. 5. The device of claim 1 , wherein the at least two hierarchical levels possess a periodicity capable of accommodating a wrinkle eigenmode of a target deformable surface. 6. The device of claim 2 , wherein the at least two hierarchical levels inhibit the evolution of a buckled state in a target deformable surface when a shear force is applied to said device. 7. The device of claim 3 , wherein the at least two hierarchical levels inhibit translation of the device when in contact with a deformable surface when a shear force is applied to said device. 8. The device of claim 1 , wherein the microstructured surface further comprises a smooth chemical surface with the same hydrophilicity, hydrophobicity, oleophobicity or oleophilicity of at least one of the at least two hierarchical levels. 9. The device of claim 1 , wherein the microstructured surface comprises at least three hierarchical levels. 10. The device of claim 9 , wherein third hierarchical level is 1-20 microns in width. 11. The device of claim 9 , wherein the third hierarchical level is 1-20 microns in height. 12. The device of claim 9 , wherein the third hierarchical level includes a pitch of 1-20 microns. 13. The device of claim 1 , wherein the micro structured surface, when in contact with a wet contact surface, forms an interface, the interface comprising a solid contact surface, a hydrophobic liquid contact surface, and a hydrophilic liquid contact surface. 14. The device of claim 1 , wherein the micro structured surface, when in contact with another wet surface forms an interface, the interface comprising a solid contact surface, a gas contact surface, and a hydrophilic liquid contact surface. 15. The device of claim 1 , wherein the at least two hierarchical levels are multi-periodic, and wherein at least one period matches one or more wrinkle eigenmodes of a target deformable surface. 16. The device of claim 13 , wherein at least two contact surfaces are frustrated. 17. The device of claim 13 , wherein Shallamach motion in a target contact surface is inhibited. 18. The device of claim 1 , wherein at least one Wenzel-Cassie wetting state transitions to a Wenzel wetting state when at least 1 mN of shear force is applied to said device. 19. The device of claim 1 , wherein at least one Wenzel-Cassie wetting state transitions to a Cassie-Baxter wetting state when at least 1 mN of shear force is applied to said device. 20. The device of claim 1 , wherein the microstructured surface has a contact hysteresis of at least 10 degrees.

Assignees

Inventors

Classifications

  • Tips, pillars · CPC title

  • Microfluidics not provided for in B81B2201/051 - B81B2201/054 · CPC title

  • Processes for functionalising a surface, e.g. provide the surface with specific mechanical, chemical or biological properties · CPC title

  • of static structures · CPC title

  • characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)} · CPC title

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What does patent US11051567B2 cover?
The present disclosure provides microstructured hydrophobic surfaces and devices for gripping wet deformable surfaces. The surfaces and devices disclosed herein utilize a split contact Wenzel-Cassie mechanism to develop multi-level Wenzel-Cassie structures. The Wenzel-Cassie structures are separated with a spatial period corresponding to at least one wrinkle eigenmode of a wet deformable surfac…
Who is the assignee on this patent?
Bvw Holding Ag
What technology area does this patent fall under?
Primary CPC classification B81C1/00206. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 06 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).