Modular printed circuit board separation tool

US11051436B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11051436-B2
Application numberUS-201916728732-A
CountryUS
Kind codeB2
Filing dateDec 27, 2019
Priority dateDec 27, 2019
Publication dateJun 29, 2021
Grant dateJun 29, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Particular embodiments described herein provide for an electronic device that can be configured to enable a modular printed circuit board separation tool. The separation tool can include a main body and a plurality of separation blades that extend from the main body. Each of the plurality of separation blades can be tapered and configured to fit between connections of a testing housing and a power and signal supply housing and when pressure is applied to the main body, the separation blades slide between the connections of the testing housing and the power and signal supply housing and separate the testing housing and the power and signal supply housing.

First claim

Opening claim text (preview).

What is claimed is: 1. A separation tool for separating a testing housing from a power and signal supply housing, the separation tool comprising: a main body, wherein the main body is modular and includes a plurality of blade segments and a plurality of blank segments; and a plurality of separation blades that extend from the plurality of blade segments, wherein the separation blades are configured to fit between connections of the testing housing and the power and signal supply housing. 2. The separation tool of claim 1 , wherein each of the plurality of separation blades are tapered. 3. The separation tool of claim 1 , wherein the plurality of separation blades can be removed from the main body. 4. The separation tool of claim 1 , wherein the separation tool includes a second separate main body and a second plurality of separation blades that extend from the second separate main body. 5. The separation tool of claim 1 , wherein the connections of the testing housing and the power and signal supply housing include power supply blades coupled with power receiving slots. 6. A method comprising: coupling a testing housing to a power and signal supply housing, wherein connections of the testing housing and the power and signal supply housing include power supply blades coupled with power receiving slots; and separating the testing housing from the power and signal supply housing using a separation tool, wherein the separation tool includes: a main body; and a plurality of separation blades that extend from the main body, wherein the separation blades are configured to fit between the connections of the testing housing and the power and signal supply housing. 7. The method of claim 6 , wherein the testing housing includes one or more testing components and the power and signal supply housing supplies power and signals to the testing components. 8. The method of claim 6 , wherein each of the plurality of separation blades are tapered. 9. The method of claim 6 , wherein the plurality of separation blades can be removed from the main body. 10. The method of claim 6 , wherein the separation tool includes a second separate main body and a second plurality of separation blades that extend from the second separate main body. 11. The method of claim 6 , wherein the main body is modular and includes a plurality of blade segments and a plurality of blank segments. 12. The method of claim 6 , further comprising: recoupling the power and signal supply housing to a second testing housing. 13. A modular system for testing components, the modular system comprising: a testing housing, wherein the testing housing includes one or more testing components; a power and signal supply housing, wherein the power and signal supply housing is configured to couple to the testing housing and supply power and signals to the one or more testing components; and a separation tool, wherein the separation tool is configured to separate the testing housing from the power and signal supply housing, wherein the separation tool includes: a main body; and a plurality of separation blades that extend from the main body, wherein the separation blades are configured to fit between connections of the testing housing and the power and signal supply housing, wherein the one or more testing components can be removed and replaced with a different testing component and the power and signal supply housing can be recoupled to a new testing housing with the different testing component. 14. The modular system for testing components of claim 13 , wherein each of the plurality of separation blades are tapered. 15. The modular system for testing components of claim 13 , wherein the plurality of separation blades can be removed from the main body. 16. The modular system for testing components of claim 15 , wherein the main body is modular and includes a plurality of blade segments and a plurality of blank segments.

Assignees

Inventors

Classifications

  • using handtools (for mounting on a circuit board H05K13/0447) · CPC title

  • Holes or slots in insulating substrate not used for electrical connections · CPC title

  • for testing or measuring purposes · CPC title

  • H01R43/26Primary

    for engaging or disengaging the two parts of a coupling device (structural association with two-part coupling device H01R13/629) · CPC title

  • Printed circuits being in the same plane · CPC title

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What does patent US11051436B2 cover?
Particular embodiments described herein provide for an electronic device that can be configured to enable a modular printed circuit board separation tool. The separation tool can include a main body and a plurality of separation blades that extend from the main body. Each of the plurality of separation blades can be tapered and configured to fit between connections of a testing housing and a po…
Who is the assignee on this patent?
Intel Corp
What technology area does this patent fall under?
Primary CPC classification H05K13/0007. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 29 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).