Thermal management with variable conductance heat pipe

Patent metadata

Field	Value
Publication number	US-11051431-B2
Application number	US-201816022924-A
Country	US
Kind code	B2
Filing date	Jun 29, 2018
Priority date	Jun 29, 2018
Publication date	Jun 29, 2021
Grant date	Jun 29, 2021

Abstract

Photonic and electronic integrated circuits can be cooled using variable conductance heat pipes containing a non-condensable gas in addition to a phase-changing working fluid. To package the heat pipe with a subassembly including the integrated circuits in a standard housing providing a heat sink contact area, the heat pipe is oriented, in some embodiments, with its axis between evaporator and condenser ends substantially perpendicular to the direction along which the integrated circuit subassembly is separated from the heat sink contact area, and a portion of the exterior surface of the heat pipe is thermally insulated, with a suitable thermal insulation structure, from the heat sink contact area.

First claim

What is claimed is:

1. A thermally managed optical package comprising:
an optical subassembly comprising a photonic integrated circuit;
a housing surrounding the optical subassembly, the housing comprising a heat sink contact area; and
a heat pipe subassembly disposed between the optical subassembly and the heat sink contact area, the heat pipe subassembly comprising:
a variable conductance heat pipe having first and second ends and an axis between the first and second ends that is oriented substantially parallel with the heat sink contact area, the heat pipe containing a working fluid and a non-condensable gas, an evaporator region of the heat pipe at the first end being in thermal contact with the photonic integrated circuit, and a condenser region of the heat pipe at the second end being in thermal contact with the heat sink contact area, the heat pipe cooling the photonic integrated circuit at least by evaporation of the working fluid in the evaporator region and condensation of the working fluid in the condenser region, and the non-condensable gas partially blocking, to a varying extent, the working fluid from reaching the condenser region so as to adjust a thermal conductance of the heat pipe; and
a thermal insulation structure insulating an exterior surface portion of the heat pipe from the heat sink contact area in a region excluding the condenser region,
wherein the variable conductance heat pipe and the thermal insulation structure are sandwiched between the optical subassembly and the heat sink contact area of the housing.

2. The optical package of claim 1 , wherein the first and second ends are separated along a direction substantially perpendicular to a direction along which the optical subassembly is separated from the heat sink contact area.

3. The optical package of claim 1 , wherein the evaporator region is located at a first exterior surface portion of the heat pipe and the condenser region is located at a second exterior surface portion of the heat pipe that is opposite to the first exterior surface portion in a direction along which the optical subassembly is separated from the heat sink contact area, the second exterior surface portion comprising, in addition to the condenser region, the exterior surface portion insulated by the thermal insulation structure from the heat sink contact area.

4. The optical package of claim 3 , wherein the heat pipe subassembly further comprises a thermally conductive adapter plate in mechanical contact with an exterior surface of the first exterior surface portion in the evaporator region.

5. The optical package of claim 4 , further comprising a deformable thermal interface material layer disposed between and in mechanical contact with the photonic integrated circuit and the adapter plate.

6. The optical package of claim 1 , wherein the optical subassembly further comprises an electronic integrated circuit.

7. The optical package of claim 6 , wherein the evaporator region is further in thermal contact with the electronic integrated circuit.

8. The optical package of claim 1 , wherein the heat pipe has a thermal conductance that varies by a factor of at least two for temperatures of the condenser region within the range from 0° C. to 70° C.

9. The optical package of claim 1 , wherein the heat pipe subassembly is configured to maintain a temperature of the evaporator region within the range from 20° C. to 85° C. for temperatures of the condenser region within the range from 0° C. to 70° C.

10. A heat pipe subassembly for cooling an optical subassembly, the heat pipe subassembly comprising:
a variable conductance heat pipe having first and second ends, the heat pipe comprising:
a wall defining an axis between the first and second ends, first and second exterior surface portions on opposite respective sides of the axis, and an interior surface defining a cavity;
a wick structure lining the interior surface of the wall of the heat pipe; and
a phase-changing working fluid and a non-condensable gas contained within the cavity, wherein the phase-changing working fluid is operatively cooling the optical subassembly by evaporation in an evaporator region at the first end and condensation in a condenser region at the second end, and the non-condensable gas is operatively adjusting a thermal conductance of the heat pipe by at least partially blocking, to a varying extent, the working fluid from reaching the condenser region;

a thermally conductive adapter plate adhered to the first exterior surface portion in the evaporator region; and
a thermal insulation structure operatively insulating the heat pipe from a heat sink contact area in a region excluding the condenser region, the thermal insulation structure covering the second exterior surface portion across a region extending from the first end up to, but not including, the condenser region,
wherein the thermally conductive adapter plate, the variable conductance heat pipe, and the thermal insulation structure are sandwiched between the optical subassembly and the heat sink contact area.

11. The heat pipe subassembly of claim 10 , wherein the thermally conductive adapter plate is a metal plate soldered to the heat pipe.

12. The heat pipe subassembly of claim 10 , wherein the heat pipe has a thermal conductance that varies by a factor of at least two for temperatures of the condenser region within the range from 0° C. to 70° C.

13. The heat pipe subassembly of claim 10 , wherein the heat pipe subassembly is configured to maintain a temperature of the evaporator region within the range from 20° C. to 85° C. for temperatures of the condenser region within the range from 0° C. to 70° C.

14. The heat pipe subassembly of claim 10 , wherein the axis of the variable conductance heat pipe is oriented substantially parallel with the heat sink contact area.

15. A thermally managed optical package comprising:
an optical subassembly;
a housing surrounding the optical subassembly, the housing comprising a heat sink contact area; and
a heat pipe subassembly comprising a variable conductance heat pipe having first and second ends and an axis between the first and second ends that is oriented substantially parallel with the heat sink contact area, the heat pipe containing a working fluid and a non-condensable gas, an evaporator region of the heat pipe at the first end being in thermal contact with the optical subassembly, and a condenser region of the heat pipe at the second end being in thermal contact with the heat sink contact area, the heat pipe subassembly further comprising a thermal insulation structure operatively insulating the heat pipe from a heat sink contact area in a region excluding the condenser region, the heat pipe and the thermal insulating structure being sandwiched between the optical subassembly and the heat sink contact area of the housing,
wherein the heat pipe subassembly is configured, for temperatures of the condenser region between a lower first temperature and an upper second temperature, to adjust the thermal conductance of the heat pipe to maintain a temperature of the evaporator region within a temperature range between a lower third temperature and a higher fourth temperature, the third temperature being higher than the first temperature by at least 15° C. and a difference between the fourth temperature and the third temperature being smaller than a difference between the second temperature and the first temperature.

16. The optical package of claim 15 , wherein a difference between the fourth and third temperatures is smaller than a difference between the second and first temperatu

Assignees

• Juniper Networks Inc

Inventors

• Marcoccia Roberto
• Koch Brian Robert
• Schmidt Theodore J
• Wyland Christopher Paul
• Guzzon Robert S
• Fish Gregory Alan

Classifications

• H05K7/20336 Primary

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• H05K7/20663 Primary

  Liquid coolant with phase change, e.g. heat pipes · CPC title

• G02B6/4269

  with heat sinks or radiation fins · CPC title

• H05K7/20836

  Thermal management, e.g. server temperature control · CPC title

• G02B6/4268 Primary

  Cooling (of instruments G12B15/00; of electric apparatus H05K7/20; of semiconductor devices H10W76/47) · CPC title