Oscillating heat pipe integrated thermal management system for power electronics

Patent metadata

Field	Value
Publication number	US-11051428-B2
Application number	US-201916670043-A
Country	US
Kind code	B2
Filing date	Oct 31, 2019
Priority date	Oct 31, 2019
Publication date	Jun 29, 2021
Grant date	Jun 29, 2021

Abstract

Disclosed is a thermal management system for removing heat from a power electronic heat source, the system comprising: a base plate having a plurality of fluid passages there through and extending between and inlet side of the base plate and an outlet side of the base plate; and a plurality of heat transfer pipe segments respectively attached to one or more of the plurality of fluid passages at the inlet side of the base plate and the outlet side of the base plate, the plurality of heat transfer pipe segments arranged adjacent one another, the plurality of heat transfer pipe segments containing a two-phase working fluid, and the plurality of heat transfer pipe segments forming a continuous flow path through and back into the base plate for the two-phase working fluid.

First claim

What is claimed is:

1. A thermal management system for removing heat from a power electronic heat source, the system comprising:
a base plate having a plurality of fluid passages there through and extending between an inlet side of the base plate and an outlet side of the base plate; and
a plurality of heat transfer pipe segments respectively attached to one or more of the plurality of fluid passages at the inlet side of the base plate and the outlet side of the base plate, the plurality of heat transfer pipe segments arranged adjacent one another,
the plurality of heat transfer pipe segments containing a two-phase working fluid, and
the plurality of heat transfer pipe segments forming a continuous flow path through and back into the base plate for the two-phase working fluid;
wherein the plurality of heat transfer pipe segments form respective serpentine channels extending perpendicularly to the fluid passges.

2. The system of claim 1 , wherein the plurality of heat transfer pipe segments extend perpendicularly to the base plate.

3. The system of claim 1 , wherein each of the plurality of heat transfer pipe segments forms a closed-loop.

4. The system of claim 1 , wherein at least two of the plurality of heat transfer pipe segments are fluidly connected to form a closed-loop.

5. The system of claim 1 , wherein all of the plurality of heat transfer pipe segments are fluidly connected to form a closed-loop.

6. The system of claim 1 , wherein the two-phase working fluid is one of water, alcohol, methanol, or ammonia.

7. The system of claim 1 , wherein the plurality of heat transfer pipe segments have a diameter of between 1-4 mm.

8. The system of claim 1 , wherein the base plate is copper or aluminum, or titanium, or alloys.

9. The system of claim 1 , comprising a plurality of plate fins extending between the plurality of heat transfer pipe segments.

10. The system of claim 1 , comprising a porous media extending between the plurality of heat transfer pipe segments.

11. The system of claim 1 , wherein when transferring heat, the two-phase working fluid defines alternating liquid slugs and vapor bubbles that oscillate inside the plurality of heat transfer pipe segments, thereby forming oscillating heat pipes (OHP).

12. The system of claim 11 , wherein when transferring heat, one zone of the plurality of heat transfer pipe segments closest the base plate defines an evaporation zone of the oscillating heat pipe and another zone of the plurality of heat transfer pipe segments further from the base plate defines a condensation zone for the oscillating heat pipe.

13. An assembly including a power electronics heat source and the system of claim 1 connected to the power electronics heat source.

14. The assembly of claim 13 , wherein the power electronic heat source includes at least one electronic device connected to the base plate.

15. The assembly of claim 13 , comprising a plurality of electronic devices arranged in a grid pattern on the base plate.

16. The assembly of claim 14 , wherein the at least one electronic device includes an IGBT chip or a MOSFET chip.

Assignees

• Hamilton Sundstrand Corp
• Hamilton Sunstrand Corp

Inventors

• Wang Jinliang
• Dwari Suman

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• F28F13/10

  by imparting a pulsating motion to the flow, e.g. by sonic vibration · CPC title

• F28D15/043 Primary

  forming loops, e.g. capillary pumped loops · CPC title

• H05K7/20336 Primary

  Heat pipes, e.g. wicks or capillary pumps · CPC title