Precursor supply unit, substrate processing system, and method of fabricating semiconductor device using the same

Patent metadata

Field	Value
Publication number	US-11047045-B2
Application number	US-201816030323-A
Country	US
Kind code	B2
Filing date	Jul 9, 2018
Priority date	Aug 18, 2017
Publication date	Jun 29, 2021
Grant date	Jun 29, 2021

Abstract

Provided are a precursor supply unit, a substrate processing system, and a method of fabricating a semiconductor device using the same. The precursor supply unit may include an outer container, an inner container provided in the outer container and used to store a precursor source, a gas injection line having an injection port, which is provided below the inner container and in the outer container and is used to provide a carrier gas into the outer container, and a gas exhaust line having an exhaust port, which is provided below the inner container and in the outer container and is used to exhaust the carrier gas in the outer container and a precursor produced from the precursor source.

First claim

What is claimed is:

1. A precursor supply unit, comprising:
an outer container;
an inner container provided in the outer container and capable of storing a precursor source;
a gas injection line having an injection port, the gas injection line provided below the inner container and in the outer container; and
a gas exhaust line having an exhaust port, the gas exhaust line provided below the inner container and in the outer container and a precursor produced from the precursor source,
wherein the inner container comprises a supporting membrane supporting the precursor source and having pores that are permeable to the carrier gas and the precursor, and
wherein the supporting membrane provides a precursor passage space defined by a first internal space between an inner bottom of the outer container and a bottom surface of the supporting membrane.

2. The precursor supply unit of claim 1 , wherein the supporting membrane comprises porous alumina, porous titania, or porous zirconia.

3. The precursor supply unit of claim 1 , wherein the injection port and the exhaust port are disposed between the supporting membrane and an inner bottom of the outer container.

4. The precursor supply unit of claim 3 , wherein the injection port is disposed adjacent to the inner bottom of the outer container, and
the exhaust port is placed adjacent to the supporting membrane.

5. The precursor supply unit of claim 1 , wherein the supporting membrane is provided to separate a source consumption space, which is defined in the inner container and on the precursor source, from the precursor passage space.

6. The precursor supply unit of claim 5 , wherein the inner container comprises an upper cover covering the precursor source on the supporting membrane, and
the source consumption space is a second internal space that is defined between a top surface of the precursor source and an inner top surface of the upper cover.

7. The precursor supply unit of claim 1 , further comprising an outer heater that is provided outside the outer container.

8. The precursor supply unit of claim 7 , further comprising an inner heater that is provided in the outer container.

9. The precursor supply unit of claim 8 , wherein the inner heater comprises an upper heating element that is provided on a top surface of the supporting membrane.

10. The precursor supply unit of claim 9 , wherein the inner heater further comprises a lower heating element that is provided on the bottom surface of the supporting membrane.

11. A substrate processing system, comprising:
a chamber comprising a susceptor, which is configured to receive a substrate;
a precursor supply unit supplying a precursor onto the substrate; and
a carrier gas supply unit supplying a carrier gas, which is used to deliver the precursor in the chamber, into the precursor supplying unit,
wherein the precursor supply unit comprises:
an outer container;
an inner container provided in the outer container and capable of storing a precursor source;
a gas injection line having an injection port, the gas injection line provided below the inner container and in the outer container; and
a gas exhaust line having an exhaust port, which is provided below the inner container and in the outer container,
wherein the inner container comprises a supporting membrane supporting the precursor source and having pores that are permeable to the carrier gas and the precursor, and
wherein the supporting membrane provides a precursor passage space defined by a first internal space between an inner bottom of the outer container and a bottom surface of the supporting membrane.

12. The substrate processing system of claim 11 , further comprising:
a first gas line connecting the precursor supply unit to the chamber; and
a first valve connected to the first gas line to control flow rates of the precursor and the carrier gas,
wherein the gas exhaust line is connected to the first valve.

13. The substrate processing system of claim 12 , wherein the first valve is provided at a side of the outer container, and
the gas exhaust line is interposed between a side surface of the inner container and a side surface of the outer container and is extended from the first valve to a bottom surface of the supporting membrane.

14. The substrate processing system of claim 11 , further comprising:
a second gas line connecting the carrier gas supply unit to the precursor supplying line; and
a second valve connected to the second gas line and used to control a flow rate of the carrier gas,
wherein the gas injection line is connected to the second valve.

15. The substrate processing system of claim 14 , wherein the second valve is provided at an opposite side of the outer container, and
the gas injection line is interposed between an opposite side surface of the inner container and an opposite side surface of the outer container and is extended from the second valve to an inner bottom surface of the outer container.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Soyoung
• Lee Hyunjae
• Kim Ik Soo
• Lee Jang-Hee

Classifications

• H10P14/6939

  characterised by the metal · CPC title

• H10P14/6339

  deposition by cyclic CVD, e.g. ALD, ALE or pulsed CVD · CPC title

• B01B1/005

  Evaporation for physical or chemical purposes; Evaporation apparatus therefor, e.g. evaporation of liquids for gas phase reactions · CPC title

• C23C16/4485

  by evaporation without using carrier gas in contact with the source material (C23C16/4486 takes precedence) · CPC title

• C23C16/45561

  Gas plumbing upstream of the reaction chamber · CPC title