Bioresorbable silicon electronics for transient implants
US-10925543-B2 · Feb 23, 2021 · US
US11045646B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11045646-B2 |
| Application number | US-201716304582-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 26, 2017 |
| Priority date | Jun 27, 2016 |
| Publication date | Jun 29, 2021 |
| Grant date | Jun 29, 2021 |
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A nerve cuff electrode device comprising a cuff body having a smart memory polymer layer with a rigid configuration at room temperature and a softened configuration at about 37 C. The smart memory polymer layer has a trained curved region with a radius of curvature of about 3000 microns or less. A plurality of thin film electrodes located on the smart memory polymer layer. The thin film electrodes include discrete titanium nitride electrode sites that are located in the trained curved region. An exposed surface of each of the discrete titanium nitride electrode sites has a charge injection capacity of about 0.1 mC/cm2 or greater. Methods or manufacturing and using the device are also disclosed.
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What is claimed is: 1. A method of manufacturing a nerve cuff electrode device, comprising: providing a thin film electrode; forming a smart memory polymer layer on the thin film electrode, including polymerizing monomers of a smart memory polymer on the thin film electrode, wherein the smart memory polymer layer has a rigid configuration at room temperature and a softened configuration at 37° C. and a trained curved region with a radius of curvature of 3000 microns or less; forming discrete titanium nitride electrode sites on the thin film electrode on the smart memory polymer layer including: depositing a titanium nitride layer on the thin film electrode, wherein the titanium nitride layer has a charge injection capacity of 0.1 mC/cm 2 or greater and wherein the depositing of the titanium nitride layer includes magnetron sputtering for 15 to 75 minutes. 2. The method of claim 1 , wherein the magnetron sputtering includes magnetron sputtering oxygen with an O 2 concentration in a range from 1×10 −6 to 20 percent. 3. The method of claim 1 , wherein an exposed surface of each of the discrete titanium nitride electrode sites has a charge injection capacity of 2 mC/cm 2 or greater. 4. The method of claim 1 , further including patterning the titanium nitride layer to form the discrete titanium nitride electrode sites, wherein each of the discrete titanium nitride electrode sites has a geometric area of 2 mm 2 or less. 5. The method of claim 1 , further including patterning the titanium nitride layer to form the discrete titanium nitride electrode sites such that each of the discrete titanium nitride electrode sites is located in the trained curved region of the smart memory polymer layer. 6. The method of claim 1 , wherein the monomers of the smart memory polymer layer include a stoichiometric combination of Tris[2-(3-mercaptopropionyloxy)ethyl] isocyanurate and 1,3,5-Triallyl-1,3,5-triazine-2,4,6(1H,3H,5H)-trione combined with 31 mol % Tricyclo[5.2.1.0 2 ′ 6 ] decanedimethanol diacrylate monomers. 7. The method of claim 1 , wherein the magnetron sputtering includes magnetron sputtering oxygen with an O 2 concentration in a range from 5 to 10 percent. 8. The method of claim 1 , wherein the magnetron sputtering includes magnetron sputtering oxygen with an O 2 concentration in a range from 5 to 10 percent. 9. The method of claim 1 , wherein the magnetron sputtering includes magnetron sputtering oxygen with an O 2 concentration in a range from 10 to 20 percent. 10. The method of claim 1 , wherein the discrete titanium nitride electrode sites have a thickness in a range from 5 nm to 200 nm. 11. The method of claim 2 , wherein the titanium nitride layer is a titanium oxynitride layer.
characterised by the manufacture of electrodes · CPC title
Cuff electrodes · CPC title
Nerve · CPC title
specially for flexible printed circuits, e.g. using folded portions · CPC title
Manufacturing circuit on or in base · CPC title
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