Cooling electronic devices in a data center

Patent metadata

Field	Value
Publication number	US-11044835-B2
Application number	US-201916706247-A
Country	US
Kind code	B2
Filing date	Dec 6, 2019
Priority date	Mar 27, 2019
Publication date	Jun 22, 2021
Grant date	Jun 22, 2021

Abstract

A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; a vapor chamber mounted on and in conductive thermal contact with the at least one heat generating processor device, the vapor chamber including a housing that defines an inner volume and encloses a working fluid; and a liquid cold plate assembly that includes a top portion mounted to at least one of the vapor chamber or the motherboard assembly and including a heat transfer member that includes an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member and formed on a top surface of the housing of the vapor chamber.

First claim

What is claimed is:

1. A server tray package, comprising:
a motherboard assembly that comprises a plurality of data center electronic devices, the plurality of data center electronic devices comprising at least one heat generating processor device;
a vapor chamber mounted on and in conductive thermal contact with the at least one heat generating processor device, the vapor chamber comprising a housing that defines an inner volume and encloses a working fluid; and
a liquid cold plate assembly that comprises a top portion mounted to at least one of the vapor chamber or the motherboard assembly and comprising a heat transfer member that comprises an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member and formed on a top surface of the housing of the vapor chamber,
wherein the vapor chamber comprises a heat transfer layer positioned on top of the housing and within the cooling liquid flow path.

2. The server tray package of claim 1 , further comprising a thermal interface material positioned between a bottom surface of the vapor chamber and at least a portion of the plurality of data center electronic devices.

3. The server tray package of claim 1 , wherein the liquid cold plate assembly further comprises a plurality of heat transfer surfaces enclosed within the cooling liquid flow path and mounted to the top surface of the housing of the vapor chamber.

4. The server tray package of claim 1 , wherein the vapor chamber comprises a plurality of fluidly independent chambers within the housing, each of the fluidly independent chambers enclosing at least a portion of the heat transfer fluid.

5. The server tray package of claim 4 , wherein the portions of the heat transfer fluid vary in at least one of composition or amount.

6. The server tray package of claim 4 , wherein at least one of the fluidly independent chambers comprises a first volume, and at least another of the fluidly independent chambers comprises a second volume greater than the first volume.

7. The server tray package of claim 6 , wherein the second volume is positioned in vertical alignment above the heat generating processor device.

8. The server tray package of claim 1 , wherein the vapor chamber comprises a plurality of fins positioned in a bottom half of the inner volume.

9. The server tray package of claim 1 , wherein the vapor chamber comprises a plurality of wicking structures positioned in a top half of the inner volume.

10. A method for cooling heat generating devices in a data center, comprising:
circulating a flow of a cooling liquid to a server tray package that comprises:
a motherboard assembly that comprises a plurality of data center electronic devices, the plurality of data center electronic devices comprising at least one heat generating processor device;
a liquid cold plate assembly that comprises a top portion; and
a vapor chamber that forms a base portion of the liquid cold plate assembly, the top portion mounted to at least one of the vapor chamber or the motherboard assembly;

circulating a flow of a cooling liquid into an inlet port of the heat transfer member;
receiving heat from the plurality of data center electronic devices into a heat transfer fluid enclosed within a housing of the vapor chamber to vaporize at least a portion of the heat transfer fluid;
transferring heat from the vaporized heat transfer fluid, to a plurality of wicking structures positioned in a top half of the inner volume, and into the cooling liquid circulating through a cooling liquid flow path;
transferring heat from the plurality of wicking structures through a heat transfer layer positioned on a top surface of the housing and within the cooling liquid flow path and to the cooling liquid circulating through the cooling liquid flow path;
circulating the flow of the cooling liquid from the inlet port through the cooling liquid flow path defined through the heat transfer member and formed on the top surface of the housing of the vapor chamber to transfer heat from the vaporized portion of the heat transfer fluid into the cooling liquid; and
circulating the heated flow of the cooling liquid from the cooling liquid flow path to an outlet port of the heat transfer member.

11. The method of claim 10 , further comprising transferring the heat from the plurality of data center electronic devices through a thermal interface material positioned between the plurality of data center electronic devices and a bottom surface of the housing of the vapor chamber.

12. The method of claim 10 , wherein circulating the flow of the cooling liquid through the cooling liquid flow path defined through the heat transfer member comprises circulating the cooling liquid through a plurality of flow channels defined by a plurality of heat transfer surfaces enclosed within the cooling liquid flow path and formed on the top surface of the vapor chamber.

13. The method of claim 10 , wherein receiving heat from the plurality of data center electronic devices into the heat transfer fluid enclosed within the housing of the vapor chamber to vaporize at least the portion of the heat transfer fluid comprises:
receiving heat from the plurality of data center electronic devices into a plurality of portions of the heat transfer fluid enclosed within respective fluidly independent chambers within the housing of the vapor chamber.

14. The method of claim 13 , wherein the portions of the heat transfer fluid vary in at least one of composition or amount.

15. The method of claim 13 , wherein at least one of the fluidly independent chambers comprises a first volume, and at least another of the fluidly independent chambers comprises a second volume greater than the first volume.

16. The method of claim 15 , further comprising:
receiving heat from the heat generating processor device into the portion of the heat transfer fluid enclosed within the second volume in the another of the fluidly independent chambers; and
receiving heat from one or more memory devices into the portion of the heat transfer fluid enclosed within the first volume in the at least one of the fluidly independent chambers.

17. The method of claim 10 , further comprising transferring heat from the plurality of data center electronic devices, to a plurality of fins positioned in a bottom half of the inner volume, and into the heat transfer fluid.

18. The server tray package of claim 7 , wherein the vapor chamber comprises a plurality of fins positioned in a bottom half of the inner volume.

19. The server tray package of claim 18 , wherein the vapor chamber comprises a plurality of wicking structures positioned in a top half of the inner volume.

20. The method of claim 11 , wherein circulating the flow of the cooling liquid through the cooling liquid flow path defined through the heat transfer member comprises circulating the cooling liquid through a plurality of flow channels defined by a plurality of heat transfer surfaces enclosed within the cooling liquid flow path and formed on the top surface of the vapor chamber.

21. The method of claim 20 , wherein receiving heat from the plurality of data center electronic devices into the heat transfer fluid enclosed within the housing of the vapor chamber to vaporize at least the portion of the heat transfer fluid comprises:
receiving heat from the plurality of data center electronic devices into a plurality of portions of the heat transfer fluid enclosed within respective fluidly indepe

Assignees

• Google Llc

Inventors

• Chiu Jerry
• Imwalle Gregory P
• Samadiani Emad

Classifications

• H05K7/20772

  within server blades for removing heat from heat source · CPC title

• H05K7/20809 Primary

  within server blades for removing heat from heat source · CPC title

• H05K7/20509

  Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures · CPC title

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title

• H05K7/20818

  within cabinets for removing heat from server blades · CPC title