Film surface sound receiving type sound sensor module

Patent metadata

Field	Value
Publication number	US-11044563-B2
Application number	US-201716473410-A
Country	US
Kind code	B2
Filing date	Nov 10, 2017
Priority date	Feb 8, 2017
Publication date	Jun 22, 2021
Grant date	Jun 22, 2021

Abstract

A base member with wiring and a microphone are provided. In the base member with wiring, an insulation adhesive layer, which is elastically deformable, is provided on one surface of a film, which has flexibility, and a conductor pattern is formed on the insulation adhesive layer. The microphone is mounted on the base member with wiring. A terminal of the microphone is in touch with the conductor pattern in face-to-face manner, and a part, on which the terminal is not formed, of a surface of the microphone and a part, on which the conductor pattern is not formed, of a surface of the insulation adhesive layer are bonded and mechanically coupled with each other.

First claim

What is claimed is:

1. A sound sensor module for receiving sound through a film, the sound sensor module comprising:
a base member comprising:
an elastically-deformable insulation adhesive layer and;
a conductor pattern on one surface of the insulation adhesive layer, wherein the film on the other surface of the insulation adhesive layer has flexibility; and

a microphone having a terminal and a sound hole, wherein the microphone is attached to the one surface of the insulation adhesive layer with the terminal being in touch with the conductor pattern in face-to-face manner and with the sound hole covered by the one surface of the insulation adhesive layer.

2. The sound sensor module according to claim 1 , wherein
the insulation adhesive layer is made of an insulation adhesive having an ultraviolet curing property, and
the insulation adhesive layer has a part cured by ultraviolet light, to which the microphone is attached.

3. The sound sensor module according to claim 2 , wherein a whole of the insulation adhesive layer is a layer cured by ultraviolet light.

4. The sound sensor module according to claim 1 , wherein the base member has a flexible cover film covering the one surface of the insulation adhesive layer and a part of the conductive pattern, except for an area to which the microphone is attached.

5. The sound sensor module according to claim 2 , wherein the base member has a flexible cover film covering the one surface of the insulation adhesive layer and a part of the conductive pattern, except for an area to which the microphone is attached.

6. The sound sensor module according to claim 3 , wherein the base member has a flexible cover film covering the one surface of the insulation adhesive layer and a part of the conductive pattern, except for an area to which the microphone is attached.

Assignees

• Japan Aviation Electronics Ind Ltd

Inventors

• Nakajima Shinichiro
• Mitsui Ryosuke
• Sato Junya
• Tanaka Atsushi
• Mishina Noriyuki

Classifications

• Y02P70/50

  Manufacturing or production processes characterised by the final manufactured product · CPC title

• H05K3/305

  Affixing by adhesive · CPC title

• H04R2201/023

  Transducers incorporated in garment, rucksacks or the like · CPC title

• H04R1/04

  Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) · CPC title

• H05K1/189 Primary

  characterised by the use of flexible or folded printed circuits · CPC title