Chip-to-chip optical interconnect

Patent metadata

Field	Value
Publication number	US-11041999-B2
Application number	US-201916688144-A
Country	US
Kind code	B2
Filing date	Nov 19, 2019
Priority date	Nov 21, 2018
Publication date	Jun 22, 2021
Grant date	Jun 22, 2021

Abstract

An optical interconnect circuit for transmitting data between two or more electronic chips. In an example embodiment, the optical interconnect circuit comprises two or more photonic chips, each of which is vertically stacked with the corresponding electronic chip such that compact optical modulators and/or photodetectors of the photonic chip are in close proximity to the data sources/sinks of the corresponding electronic chip. Multi-core optical fibers and vertical coupling structures are used to provide multiple optical connections between different photonic chips. Advantageously, the provided capability to place optical modulators close to the data sources and to place photodetectors close to the data sinks can be used to reduce the amount of required electrical wiring. Optical-waveguide connections to the multi-core fibers can be used to allow for high density of optical conduits without spatially constraining the placement of data sources and/or data sinks on the electronic chips.

First claim

What is claimed is:

1. An apparatus comprising:
a photonic chip having first and second opposing major surfaces and comprising a plurality of electro-optic elements; and
an electronic chip having a major surface that has a plurality of electrical contacts thereon;
wherein said major surface of the electronic chip faces the first major surface of the photonic chip such that the electronic chip and the electro-optic elements are electrically connected;
wherein the photonic chip further comprises a plurality of first vertical optical coupling structures at the second major surface thereof, each of said first vertical optical coupling structures being connected by way of at least a first optical planar waveguide to a respective electro-optic element of the plurality of electro-optic elements;
wherein the first vertical optical coupling structures are capable of, at least one of receiving light externally incident on the second major surface and outputting light from the second major surface;
wherein the photonic chip further comprises a second vertical optical coupling structure and an optical splitter having an optical input connected to receive light from said second vertical optical coupling structure;
wherein the optical splitter comprises a plurality of optical outputs, each of said optical outputs being connected by way of a respective second optical planar waveguide to a respective electro-optic element of the plurality of electro-optic elements; and
wherein each optical output of at least a subset of the optical outputs is connected by way of the respective second optical planar waveguide to a respective pair of the electro-optic elements.

2. The apparatus of claim 1 , wherein the first vertical optical coupling structures are arranged to receive the light from or output the light to different respective cores of a multi-core optical fiber in response to an end of the multi-core fiber facing the second major surface and being aligned with the first vertical optical coupling structures.

3. The apparatus of claim 1 , further comprising a light source connected to apply light to the second vertical optical coupling structure via an optical fiber having an end adjacent to and facing the second major surface.

4. The apparatus of claim 1 , wherein the plurality of electro-optic elements comprises one or more optical modulators.

5. The apparatus of claim 1 , wherein the plurality of electro-optic elements comprises one or more photodetectors.

6. The apparatus of claim 1 , further comprising one or more optical fibers, each of the one or more optical fibers having an end adjacent to and facing the second major surface, each of the one or more optical fibers being optically end-coupled to one or more adjacent ones of the first vertical optical coupling structures.

7. The apparatus of claim 6 , wherein at least some of the one or more optical fibers are not polarization-maintaining optical fibers.

8. The apparatus of claim 1 , wherein at least some of the electro-optic elements form one or more nested optical modulators coupled to transmit light with in-phase and quadrature modulation to corresponding one or more of the first vertical optical coupling structures.

9. The apparatus of claim 1 , further comprising:
a first chip stack that includes the photonic chip and the electronic chip;
a second chip stack that includes a respective photonic chip and a respective electronic chip bonded together; and
one or more fibers that optically connect the first and second chip stacks.

10. The apparatus of claim 9 , further comprising a circuit carrier on which the first and second chip stacks are mounted.

11. The apparatus of claim 9 , wherein the first and second chip stacks are mounted on different respective circuit carriers.

12. The apparatus of claim 1 , wherein the electrical contacts of the electronic chip are vertically facing corresponding electro-optic elements of the photonic chip.

13. The apparatus of claim 1 , wherein at least some of the electro-optic elements are electro-absorption modulators.

14. An apparatus comprising:
a photonic chip having first and second opposing major surfaces and comprising a plurality of electro-optic elements; and
an electronic chip having a major surface that has a plurality of electrical contacts thereon;
wherein said major surface of the electronic chip faces the first major surface of the photonic chip such that the electronic chip and the electro-optic elements are electrically connected;
wherein the photonic chip further comprises a plurality of first vertical optical coupling structures at the second major surface thereof, each of said first vertical optical coupling structures being connected by way of at least a first optical planar waveguide to a respective electro-optic element of the plurality of electro-optic elements;
wherein the first vertical optical coupling structures are capable of, at least one of receiving light externally incident on the second major surface and outputting light from the second major surface;
wherein the photonic chip further comprises a second vertical optical coupling structure and an optical splitter having an optical input connected to receive light from said second vertical optical coupling structure;
wherein the optical splitter comprises a plurality of optical outputs, each of said optical outputs being connected by way of a respective second optical planar waveguide to a respective electro-optic element of the plurality of electro-optic elements;
wherein the second vertical optical coupling structure is configured to receive light incident on the second major surface from a facing end of an optical fiber; and
wherein the optical fiber is polarization maintaining.

Assignees

• Nokia Solutions & Networks Oy

Inventors

• Winzer Peter
• Neilson David
• Dong Po

Classifications

• G02B6/12004

  Combinations of two or more optical elements · CPC title

• G02B6/02042

  Multicore optical fibres · CPC title

• G02B6/4202 Primary

  for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles · CPC title

• G02B6/4216

  incorporating polarisation-maintaining fibres (polarisation-maintaining fibres per se G02B6/105) · CPC title

• G02B6/34

  utilising prism or grating {(G02B6/293 takes precedence)} · CPC title