Hinge for micro and nanoelectromechanical systems with out-of-plane displacement and reduced non-linearity

Patent metadata

Field	Value
Publication number	US-11041992-B2
Application number	US-201916721578-A
Country	US
Kind code	B2
Filing date	Dec 19, 2019
Priority date	Dec 20, 2018
Publication date	Jun 22, 2021
Grant date	Jun 22, 2021

Abstract

A hinge between a first part and a second part of a microelectromechanical system including a first element and a second element free to move relative to each other in an out-of-plane direction is disclosed. The hinge includes a first rigid part; a second part fixed to a first face of the first part by one end and anchored to the second element by a second end, the second part deforming in bending in the out-of-plane direction; and a third part fired to a first face of the first part by a second end, and anchored to the first element by a second end, the third part deforming in bending in the out-of-plane direction. In an undeformed state, the second part and the third part each includes one face located in the same plane orthogonal to the out-of-plane direction.

First claim

The invention claimed is:

1. A microelectromechanical system comprising:
a first element and a second element, said first element and said second element being free to move relative to each other in an out-of-plane direction; and
at least two hinges, each hinge anchored to the first element and to the second element, each hinge comprising:
a first rigid part;
a second part fixed to a first face of the first rigid part by a first end thereof and that is intended to be anchored to the first element or to the second element by a second end thereof, the first and second ends of the second part being considered along a second direction, said second part being configured to be deformable in bending in a first direction; and
a third part fixed to the first face of the first rigid part by a first end thereof, and that is intended to be anchored to the second element or to the first element by a second end thereof, the first and second ends of the third part being considered along the second direction, the third part being configured to deform in bending in the first direction,

wherein in an undeformed state, the second part and the third part are located in a same plane orthogonal to the first direction,
wherein the at least two hinges are oriented such that the first direction is the out-of-plane direction, and the second direction and a third orthogonal to the first direction and to the second direction are in-plane directions, and
wherein a thickness of the first rigid part in the first direction is greater than a thickness of the second part in the first direction and a thickness of the third part in the first direction.

2. The microelectromechanical system according to claim 1 , wherein the second and third parts are configured to have deformations with similar or identical amplitudes in the second direction, when the hinge is deformed in the first direction.

3. The microelectromechanical system according to claim 1 , wherein each hinge comprises in second parts and n third parts, where in and n are positive integers, and m and n may be equal or different.

4. The microelectromechanical system according to claim 3 , wherein dimensions in the first direction of the in second parts and the n third parts are similar or equal, and wherein an equivalent dimension of the in second parts in a third direction orthogonal to the first direction and to the second direction is similar to or equal to the equivalent dimension of the n third parts in the third direction.

5. The microelectromechanical system according to claim 1 , wherein the first rigid part comprises a beam, a largest dimension of which extends along a third direction orthogonal to the first direction and to the second direction.

6. The microelectromechanical system according to claim 5 , wherein dimensions of the first part in the first direction, in the second, and in the third direction are between several μm and several hundred μm.

7. The microelectromechanical system according to claim 1 , wherein a dimension of the second part in the first direction is less than its dimensions of the second part in other directions.

8. The microelectromechanical system according to claim 1 , wherein dimensions of the second and third parts in the first direction are between about a hundred nm and several microns, dimensions of the second and third parts in the second direction are between several μm and several hundred μm, and equivalent dimensions of the second and third parts in a third direction orthogonal to the first direction and to the second direction are between several μm and several hundred μm.

9. The microelectromechanical system according to claim 1 , wherein each hinge comprises one second part and two third parts arranged on each side of the second part.

10. The microelectromechanical system according to claim 1 , wherein the second and third parts are each fixed to the first face of the first rigid part in distinct zones.

11. The microelectromechanical system according to claim 1 , wherein the first element is a fixed part of the system.

12. The microelectromechanical system according to claim 1 , wherein the at least two hinges are arranged symmetrically about a median plane of the second element, said median plane extending in the out-of-plane direction.

13. The microelectromechanical system according to claim 1 , comprising at least four hinges and wherein the first parts of each hinge are beams, axes of the beams being orthogonal in pairs.

14. The microelectromechanical system according to claim 1 , comprising at least one actuator for moving the second element at least in the out-of-plane direction.

15. The microelectromechanical system according to claim 1 , forming a microphone.

16. A microelectromechanical system comprising:
a substrate;
a first element and a second element, said first element and said second element being free to move relative to each other in an out-of-plane direction, the first element being anchored to the substrate; and
a hinge anchored to the first element and to the second element, the hinge comprising:
a first rigid part;
a second part fixed to a first face of the first rigid part by a first end thereof and that is intended to be anchored to the first element or to the second element by a second end thereof, the first and second ends of the second part being considered along a second direction, said second part being configured to be deformable in bending in a first direction; and
a third part fixed to the first face of the first rigid part by a first end thereof, and that is intended to be anchored to the second element or to the first element by a second end thereof, the first and second ends of the third part being considered along the second direction, the third part being configured to deform in bending in the first direction,

wherein in an undeformed state, the second part and the third part are located in a same plane orthogonal to the first direction,
wherein the hinge is oriented such that the first direction is the out-of-plane direction, and the second direction and a third orthogonal to the first direction and to the second direction are in-plane directions, and
wherein a thickness of the first rigid part in the first direction is greater than a thickness of the second part in the first direction and a thickness of the third part in the first direction.

17. The microelectromechanical system according to claim 1 , wherein wherein in the undeformed state, lower faces of the first rigid part, the second part, and the third part are located in a same plane orthogonal to the first direction.

18. The microelectromechanical system according to claim 16 , wherein wherein in the undeformed state, lower faces of the first rigid part, the second part, and the third part are located in a same plane orthogonal to the first direction.

Assignees

• Commissariat Energie Atomique

Inventors

• Dagher Samer
• Joet Loic

Classifications

• G01P15/18

  in two or more dimensions · CPC title

• B81B2203/0163

  Spring holders · CPC title

• G02B26/085

  the reflecting means being moved or deformed by electromagnetic means · CPC title

• H04R19/04

  Microphones (H04R19/01 takes precedence) · CPC title

• G02B6/3518 Primary

  the reflective optical element being an intrinsic part of a MEMS device, i.e. fabricated together with the MEMS device (MEMS devices in general B81B; manufacture of MEM devices in general B81C; micromechanical devices controlling the direction of light G02B26/0833) · CPC title