Sensing device of pressure and temperature in mold

US11041767B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11041767-B2
Application numberUS-201916654072-A
CountryUS
Kind codeB2
Filing dateOct 16, 2019
Priority dateNov 30, 2018
Publication dateJun 22, 2021
Grant dateJun 22, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A sensing device of pressure and temperature in a mold comprises: a housing communicating with a mold cavity, and including a channel and an accommodating space; a base on a bottom surface of the housing, and including a mesa on a top; a strut in the accommodating space, and a front end thereof extended into the channel and exposed to the mold cavity; a strain structure between the mesa and a back end of the strut, and located on the mesa; a strain gage on the strain structure to measure a deformation amount of the strain structure the mold cavity and transforming the deformation amount into deformation amount information; a temperature-sensing element in the strut to measure a temperature of the strut, and transforming the temperature into strut temperature information; and a processing unit to obtain the deformation amount information and the strut temperature information.

First claim

Opening claim text (preview).

What is claimed is: 1. A sensing device of pressure and temperature in a mold, a structure of the sensing device comprising: a housing, disposed in the mold and exposing a top surface to a mold cavity of the mold, wherein the top surface comprises a hollowly disposed channel and is in communication with an accommodating space in the housing, and a bottom surface of the housing comprises an open end in communication with the accommodating space; a base, disposed on the bottom surface of the housing to close the accommodating space, and comprising a mesa on a top, wherein a through hole is disposed in a center of the base; a strut, disposed in the accommodating space, wherein a front end of the strut is extended into the channel and exposed to the mold cavity, so that after the front end transfers pressure of the mold cavity, the strut performs an axial displacement in the channel; a strain structure, disposed between the mesa and the strut and configured to transform the pressure transferred by the displacement of the strut into a deformation amount of the strain structure; at least one strain gage, disposed on the strain structure and configured to measure the deformation amount of the strain structure and transform the deformation amount into deformation amount information; at least one temperature-sensing element, disposed in the strut and configured to measure a real-time temperature of the strut and transform the temperature into strut temperature information; and a processing unit, electrically connected to the strain gage and the temperature-sensing element respectively to obtain the deformation amount information and the strut temperature information. 2. The sensing device of pressure and temperature in a mold according to claim 1 , wherein the top surface of the housing is flush with a mold cavity surface, and an end surface of the front end of the strut remains flat with the top surface when the strut is not under pressure during an initial installation. 3. The sensing device of pressure and temperature in a mold according to claim 2 , wherein the strut further comprises a strut body connected to the front end and a back end platform connected to the strut body and back to the front end, the back end platform is located in the accommodating space and abutted against the strain structure, a diameter of the back end platform is greater than a diameter of the channel, and an elastic part is sleeved on the strut body, so that two ends of the elastic part are respectively connected to an end surface of the channel through the back end platform and the accommodating space, to jointly limit a moving range of the elastic part. 4. The sensing device of pressure and temperature in a mold according to claim 3 , wherein the strain structure comprises a platen section, a base plate section and a pair of elastic support beams respectively connected to the platen section and the base plate section at two ends, the base plate section is located on the mesa, the platen section is adjacent to an back end of the strut, the pair of support beams is disposed parallel to a moving direction of the strut, and a beam body of the pair of support beams, after taking the pressure exerted by the platen section, respectively bends and deforms in a direction back to or facing another support beam, and the at least one strain gage is disposed in a beam body of one of the pair of support beams. 5. The sensing device of pressure and temperature in a mold according to claim 4 , wherein the support beams are made of materials such as metal, ceramic or plastic, the support beams may resist a temperature of a mold process in the accommodating space, and a deformation amount of the support beams does not cause a permanent deformation. 6. The sensing device of pressure and temperature in a mold according to claim 4 , wherein that the base plate section is located on the mesa is: a hollow locating slot is formed in a central position of the base plate section, and a bump matching the locating slot is disposed on the corresponding mesa. 7. The sensing device of pressure and temperature in a mold according to claim 2 , wherein the strain structure comprises a platen section, a base plate section and a pair of elastic support beams respectively connected to the platen section and the base plate section at two ends, the base plate section is located on the mesa, the platen section is adjacent to an back end of the strut, the pair of support beams is disposed parallel to a moving direction of the strut, and a beam body of the pair of support beams, after taking the pressure exerted by the platen section, respectively bends and deforms in a direction back to or facing another support beam, and the at least one strain gage is disposed in a beam body of one of the pair of support beams. 8. The sensing device of pressure and temperature in a mold according to claim 7 , wherein the support beams are made of materials such as metal, ceramic or plastic, the support beams may resist a temperature of a mold process in the accommodating space, and a deformation amount of the support beams does not cause a permanent deformation. 9. The sensing device of pressure and temperature in a mold according to claim 7 , wherein that the base plate section is located on the mesa is: a hollow locating slot is formed in a central position of the base plate section, and a bump matching the locating slot is disposed on the corresponding mesa. 10. The sensing device of pressure and temperature in a mold according to claim 1 , wherein the temperature-sensing elements are disposed on the strut and the strain structure, and are respectively configured to measure the strut temperature information and strain structure temperature information of the strain structure, and return the strut temperature information and the strain structure temperature information to the processing unit. 11. The sensing device of pressure and temperature in a mold according to claim 10 , wherein the strain structure comprises a platen section, a base plate section and a pair of elastic support beams respectively connected to the platen section and the base plate section at two ends, the base plate section is located on the mesa, the platen section is adjacent to an back end of the strut, the pair of support beams is disposed parallel to a moving direction of the strut, and a beam body of the pair of support beams, after taking the pressure exerted by the platen section, respectively bends and deforms in a direction back to or facing another support beam, and the at least one strain gage is disposed in a beam body of one of the pair of support beams. 12. The sensing device of pressure and temperature in a mold according to claim 11 , wherein the support beams are made of materials such as metal, ceramic or plastic, the support beams may resist a temperature of a mold process in the accommodating space, and a deformation amount of the support beams does not cause a permanent deformation. 13. The sensing device of pressure and temperature in a mold according to claim 11 , wherein that the base plate section is located on the mesa is: a hollow locating slot is formed in a central position of the base plate section, and a bump matching the locating slot is disposed on the corresponding mesa. 14. The sensing device of pressure and temperature in a mold according to claim 10 , wherein through holes are disposed in a center of the platen section of the strain structure, a center of the base plate section and a center of the base, so that transmission lines of power and signals of the strain gages and the temperature-sensing elements penetrate outside

Assignees

Inventors

Classifications

  • using variations in ohmic resistance · CPC title

  • Supports; Fastening devices; Arrangements for mounting thermometers in particular locations · CPC title

  • for measuring temperature of moving fluids or granular materials capable of flow · CPC title

  • for detecting or indicating knocks in internal-combustion engines; Units comprising pressure-sensitive members combined with ignitors for firing internal-combustion engines · CPC title

  • of metallic strain gauges fixed to an element other than the pressure transmitting diaphragm · CPC title

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What does patent US11041767B2 cover?
A sensing device of pressure and temperature in a mold comprises: a housing communicating with a mold cavity, and including a channel and an accommodating space; a base on a bottom surface of the housing, and including a mesa on a top; a strut in the accommodating space, and a front end thereof extended into the channel and exposed to the mold cavity; a strain structure between the mesa and a b…
Who is the assignee on this patent?
Metal Ind Research&Development Centre, Metal Ind Res & Dev Ct
What technology area does this patent fall under?
Primary CPC classification G01L1/2243. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jun 22 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).