Shape memory polymer proppants, methods of making shape memory polymer proppants for application in hydraulic fracturing treatments

US11041115B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11041115-B2
Application numberUS-201916709038-A
CountryUS
Kind codeB2
Filing dateDec 10, 2019
Priority dateNov 5, 2014
Publication dateJun 22, 2021
Grant dateJun 22, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure provides for shape memory proppants, methods for making shape memory proppants, and methods of using shape memory proppants, and the like. The strong expandable proppants of the present disclosure may be used in maintaining fracture openings.

First claim

Opening claim text (preview).

We claim at least the following: 1. A composition, comprising: a shape memory polymer proppant, wherein the proppant has an activated state and a programmed state, wherein in the programmed state the proppant has a programmed state diameter, wherein in the activated state the proppant has an activated state diameter, wherein the activated state diameter is equal to or greater than the programmed state diameter, wherein the proppant in the programmed state will convert to the proppant in the activated state when an activation condition is applied to the proppant in the programmed state, wherein the activation condition is selected from the group consisting of: an activation temperature, a moisture, a light, a pH, a magnetic field, an ultrasonic current, electricity current, and a combination thereof. 2. The composition of claim 1 , wherein the polymer is a thermoplastic shape memory polymer, a thermosetting shape memory polymer, or a combination thereof. 3. The composition of claim 2 , wherein the thermoplastic shape memory polymer is selected from the group consisting of: polyether ether ketone (PEEK), polypropylene (PP), polystyrene, polyurethane, polynorbornene, polyester, polyether, polyethylene terephthalate (PET), polyethyleneoxide (PEO), poly(1,4-butadiene), poly(vinyl acetate), polyamide-6 (nylon-6), poly(tetrahydrofuran), poly(2-methyl-2-oxazoline), poly(ethylene adipate), MDI/1,4-butanediol, poly(ε-caprolactone), poly vinyl chloride, polyethylene/polyamide blend, and a combination thereof. 4. The composition of claim 2 , wherein the thermosetting shape memory polymer is selected from the group consisting of: an epoxy family and a phenolic family. 5. The composition of claim 1 , wherein the polymer is a blend, a composite, or an interpenetration network of a thermoplastic shape memory polymer and a thermosetting shape memory polymer. 6. The composition of claim 2 , wherein the shape memory polymer proppant has a core surrounded by the polymer material, wherein the polymer material is a thermoplastic shape memory polymer, a thermosetting shape memory polymer, or a combination thereof, and wherein the core is selected from a group consisting of: sand, bauxite, and ceramic. 7. The composition of claim 1 , further comprising a mixture comprising sand, ceramic, or a combination thereof to be mixed with the shape memory polymer proppant. 8. The composition of claim 1 , wherein the programmed state diameter is about 100 μm to 1 mm, and wherein the activated state diameter is about 100 μm to 1 mm, and wherein the activated state diameter is equal to or greater than the programmed state diameter. 9. A composition, comprising: a shape memory polymer proppant, wherein the proppant has an activated state and a programmed state, wherein in the programmed state the proppant has a programmed state diameter, wherein in the activated state the proppant has an activated state diameter, wherein the activated state diameter is equal to or greater than the programmed state diameter, wherein the proppant in the programmed state will convert to the proppant in the activated state when an activation condition is applied to the proppant in the programmed state, wherein the activation condition is selected from the group consisting of: an activation temperature, a moisture, a light, a pH, a magnetic field, an ultrasonic current, electricity current, and a combination thereof; and wherein the polymer is a blend, a composite, or an interpenetration network of a thermoplastic shape memory polymer and a thermosetting shape memory polymer. 10. A composition, consisting essentially of: a shape memory polymer proppant, wherein the proppant has an activated state and a programmed state, wherein in the programmed state the proppant has a programmed state diameter, wherein in the activated state the proppant has an activated state diameter, wherein the activated state diameter is equal to or greater than the programmed state diameter, wherein the proppant in the programmed state will convert to the proppant in the activated state when an activation condition is applied to the proppant in the programmed state, wherein the activation condition is selected from the group consisting of: an activation temperature, a moisture, a light, a pH, a magnetic field, an ultrasonic current, electricity current, and a combination thereof.

Assignees

Inventors

Classifications

  • C09K8/80Primary

    Compositions for reinforcing fractures, e.g. compositions of proppants used to keep the fractures open · CPC title

  • Coated proppants · CPC title

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Frequently asked questions

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What does patent US11041115B2 cover?
The present disclosure provides for shape memory proppants, methods for making shape memory proppants, and methods of using shape memory proppants, and the like. The strong expandable proppants of the present disclosure may be used in maintaining fracture openings.
Who is the assignee on this patent?
Univ Louisiana State, Board Of Supervisors Of Louisiana State Univ
What technology area does this patent fall under?
Primary CPC classification C09K8/80. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jun 22 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).