Encapsulating composition

Patent metadata

Field	Value
Publication number	US-11041089-B2
Application number	US-201716467402-A
Country	US
Kind code	B2
Filing date	Dec 11, 2017
Priority date	Dec 9, 2016
Publication date	Jun 22, 2021
Grant date	Jun 22, 2021

Abstract

The present application relates to an encapsulating composition, a method for preparing the same and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, is possible to realize a top emission type organic electronic device, is applicable to an inkjet method, can provide a thin display and can control moisture content to prevent damage to the element.

First claim

The invention claimed is:

1. An encapsulating composition for encapsulating an organic electronic device (OED) comprising:
an epoxy compound, and
a compound having an oxetane group in a range of 45 parts by weight to 145 parts by weight relative to 100 parts by weight of the epoxy compound,
wherein the compound having an oxetane group has a weight average molecular weight in a range of 150 to 1,000 g/mol and a boiling point in a range of 90 to 270° C.,
wherein the encapsulating composition is a solventless composition and a composition configured for inkjet process,
wherein the encapsulating composition has a viscosity in a range of 1 to 46 cPs as measured by Brookfield's DV-3 at a temperature of 25° C., a torque of 90% and a shear rate of 100 rpm, and
wherein the composition has a moisture content of 1000 ppm or less according to a Karl Fischer coultometric titration method for 100 mg of the composition.

2. The encapsulating composition according to claim 1 , wherein after curing, the amount of volatile organic compounds measured after maintaining 50 mg of the cured product at 110° C. for 30 minutes using Purge & Trap-gas chromatography/mass spectrometry, is less than 100 ppm.

3. The encapsulating composition according to claim 1 , wherein the epoxy compound has at least bifunctionality or more.

4. The encapsulating composition according to claim 1 , wherein the epoxy compound comprises a compound having a cyclic structure in its molecular structure and/or a linear or branched aliphatic compound.

5. The encapsulating composition according to claim 4 , wherein the compound having a cyclic structure in its molecular structure has ring constituent atoms in the molecular structure in a range of 3 to 10.

6. The encapsulating composition according to claim 4 , wherein the linear or branched aliphatic compound is comprised in a range of 20 parts by weight or more and less than 205 parts by weight relative to 100 parts by weight of the compound having a cyclic structure.

7. The encapsulating composition according to claim 1 , further comprising a surfactant.

8. The encapsulating composition according to claim 7 , wherein the surfactant comprises a polar functional group.

9. The encapsulating composition according to claim 7 , wherein the surfactant comprises a fluorine-based compound.

10. The encapsulating composition according to claim 7 , wherein the surfactant is comprised in an amount of 0.01 parts by weight to 10 parts by weight relative to 100 parts by weight of the epoxy compound.

11. The encapsulating composition according to claim 1 , further comprising a photoinitiator.

12. The encapsulating composition according to claim 11 , wherein the photoinitiator is comprised in an amount of 1 to 15 parts by weight relative to 100 parts by weight of the epoxy compound.

13. A method for preparing the encapsulating composition of claim 1 , comprising steps of:
removing moisture from a solventless encapsulating composition without any photoinitiator; and
mixing a photoinitiator with the encapsulating composition.

14. The method according to claim 13 , wherein the moisture removal step comprises heating and cooling the encapsulating composition or mixing an inert gas therewith.

15. The method according to claim 13 , wherein the moisture removal step proceeds at a constant pressure.

16. The method according to claim 15 , wherein the moisture removal step proceeds in a state where the pressure is constantly maintained at any one pressure of 0.5 to 2 atm.

17. The method according to claim 15 , wherein the constant pressure has an error range of −0.5 to 0.5 atm.

18. An organic electronic device comprising a substrate; an organic electronic element formed on the substrate; and an organic layer sealing the entire surface of the organic electronic element and comprising the encapsulating composition according to claim 1 .

19. A method for manufacturing an organic electronic device comprising a step of forming an organic layer on a substrate in which an organic electronic element is formed on its upper part, so that the encapsulating composition of claim 1 seals the entire surface of the organic electronic element.

Assignees

• Lg Chemical Ltd

Inventors

• Woo Yu Jin
• Kim Joon Hyung
• Choi Kook Hyun
• Yu Mi Lim

Classifications

• H10K50/844

  Encapsulations · CPC title

• C09D11/101 Primary

  Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing · CPC title

• C09D11/30 Primary

  Inkjet printing inks · CPC title

• C09D163/00 Primary

  Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins · CPC title

• H10K59/874

  including getter material or desiccant · CPC title