Resin powder, method for its production, composite, molded product, method for producing ceramic molded product, metal laminated plate, printed circuit board and prepreg

US11041053B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11041053-B2
Application numberUS-201916709049-A
CountryUS
Kind codeB2
Filing dateDec 10, 2019
Priority dateAug 1, 2014
Publication dateJun 22, 2021
Grant dateJun 22, 2021

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A resin powder having a high bulk density and an average particle size of at most 50 μm from resin particles containing a fluorocopolymer as the main component and having a melting point of 260 to 320° C., where the fluorocopolymer contains a unit containing a carbonyl group-containing group, a unit based on tetrafluoroethylene, and a unit based on a perfluoro(alkyl vinyl ether) or a unit based on hexafluoropropylene. A method of producing the resin powder by subjecting resin particles (A) having an average particle size of at least 100 μm to mechanical pulverization treatment. The resin particles (A) is made of a material (X) having a fluorocopolymer (X1) as the main component, which has a unit (1) based on a monomer containing at least one functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and a unit (2) based on tetrafluoroethylene.

First claim

Opening claim text (preview).

What is claimed is: 1. A resin powder having an average particle size of from 0.02 to 50 μm, consisting essentially of a fluorocopolymer having a melting point of from 260 to 320° C., said fluorocopolymer comprising a unit based on 5-norbornene-2,3-dicarboxylic acid anhydride, a unit based on tetrafluoroethylene and a unit based on CF 2 ═CFO(CF 2 ) 3 F, wherein a proportion of the unit based on 5-norbornene-2,3-dicarboxylic acid anhydride to the total of all units constituting the fluorocopolymer is from 0.05 to 1 mol %, a proportion of the unit based on tetrafluoroethylene to the total of all units constituting the fluorocopolymer is from 96 to 98.95 mol %, and a proportion of the unit based on CF 2 ═CFO(CF 2 ) 3 F to the total of all units constituting the fluorocopolymer is from 1 to 9.95 mol %. 2. The resin powder according to claim 1 , wherein the average particle size is from 0.02 to 10 μm, and a densely packed bulk density is from 0.05 to 0.8 g/ml. 3. The resin powder according to claim 1 , wherein the average particle size is more than 10 μm and at most 50 μm, and a densely packed bulk density is from 0.25 to 0.95 g/ml. 4. The resin powder according to claim 1 , which is used for forming a ceramic molded product, a metal laminated plate, a printed circuit board or a prepreg. 5. The resin powder according to claim 1 , wherein the average particle size is from 0.02 to 35 μm. 6. The resin powder according to claim 1 , wherein the average particle size is from 0.02 to 10 μm.

Assignees

Inventors

Classifications

  • using carbon fibres · CPC title

  • Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs · CPC title

  • Polyamide fibres · CPC title

  • Shaping of the substrate, e.g. by moulding · CPC title

  • Tetrafluoroethene · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11041053B2 cover?
A resin powder having a high bulk density and an average particle size of at most 50 μm from resin particles containing a fluorocopolymer as the main component and having a melting point of 260 to 320° C., where the fluorocopolymer contains a unit containing a carbonyl group-containing group, a unit based on tetrafluoroethylene, and a unit based on a perfluoro(alkyl vinyl ether) or a unit based…
Who is the assignee on this patent?
Agc Inc
What technology area does this patent fall under?
Primary CPC classification C08J3/12. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jun 22 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).