Spinel particles, method for producing same and composition and molded article including spinel particles

US11040887B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11040887-B2
Application numberUS-201616310942-A
CountryUS
Kind codeB2
Filing dateJun 23, 2016
Priority dateJun 23, 2016
Publication dateJun 22, 2021
Grant dateJun 22, 2021

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Abstract

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Alumina is generally used as an inorganic filler, while spinel, which is known to be lower in thermal conductivity than alumina, is used in applications such as gems, fluorescence emitters, catalyst carriers, adsorbents, photocatalysts and heat-resistant insulating materials, but not expected to be used as a thermally conductive inorganic filler. Thus, an object of the invention is to provide spinel particles having excellent thermal conductive properties. The invention relates to a spinel particle including magnesium, aluminum and oxygen atoms and molybdenum and having a [111] plane crystallite diameter of 220 nm or more.

First claim

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The invention claimed is: 1. A spinel particle comprising magnesium, aluminum, and oxygen atoms and molybdenum and having a [111] plane crystallite diameter of 220 nm or more, wherein the molybdenum content in terms of molybdenum oxide based on the spinel particle is 0.3 to 5.0% by mass, and the spinel particle has an average particle diameter of 0.2 to 100 μm. 2. The spinel particle according to claim 1 , which has a [311] plane crystallite diameter of 100 nm or more. 3. The spinel particle according to claim 1 , which has a ratio of the crystalline peak intensity of the [111] plane to the crystalline peak intensity of the [311] plane ([111] plane/[311] plane) of 0.3 or more. 4. A method for producing the spinel particle according to claim 1 , comprising: a firing step in which a magnesium compound and an aluminum compound are subjected to solid solution formation and crystallization in the presence of molybdenum so that a spinel particle crystal is grown; and a cooling step in which the spinel particle crystal grown in the firing step is crystallized. 5. The production method according to claim 4 , wherein the aluminum compound contains molybdenum. 6. The production method according to claim 4 , wherein the aluminum compound is aluminum oxide. 7. The production method according to claim 4 , wherein the aluminum compound has a molar ratio of molybdenum element to aluminum element (molybdenum element/aluminum element) of 0.00001 to 0.05. 8. The production method according to claim 4 , wherein the aluminum compound has an average particle diameter of 0.1 to 1,000 μm. 9. A composition comprising the spinel particle according to claim 1 and a resin. 10. The composition according to claim 9 , further comprising a curing agent. 11. The composition according to claim 9 , which is a thermally conductive material. 12. A molded article comprising a product obtained by molding the composition according to claim 9 . 13. The spinel particle according to claim 2 , which has a ratio of the crystalline peak intensity of the [111] plane to the crystalline peak intensity of the [311] plane ([111] plane/[311] plane) of 0.3 or more. 14. A method for producing the spinel particle according to claim 2 , comprising: a firing step in which a magnesium compound and an aluminum compound are subjected to solid solution formation and crystallization in the presence of molybdenum so that a spinel particle crystal is grown; and a cooling step in which the spinel particle crystal grown in the firing step is crystallized. 15. The production method according to claim 5 , wherein the aluminum compound is aluminum oxide. 16. The production method according to claim 5 , wherein the aluminum compound has a molar ratio of molybdenum element to aluminum element (molybdenum element/aluminum element) of 0.00001 to 0.05. 17. A composition comprising the spinel particle according to claim 2 and a resin.

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What does patent US11040887B2 cover?
Alumina is generally used as an inorganic filler, while spinel, which is known to be lower in thermal conductivity than alumina, is used in applications such as gems, fluorescence emitters, catalyst carriers, adsorbents, photocatalysts and heat-resistant insulating materials, but not expected to be used as a thermally conductive inorganic filler. Thus, an object of the invention is to provide s…
Who is the assignee on this patent?
Dainippon Ink & Chemicals
What technology area does this patent fall under?
Primary CPC classification C30B29/22. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jun 22 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).