Adhesive occlusion systems
US-2018338767-A1 · Nov 29, 2018 · US
US11039840B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11039840-B2 |
| Application number | US-201816216864-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 11, 2018 |
| Priority date | Dec 11, 2017 |
| Publication date | Jun 22, 2021 |
| Grant date | Jun 22, 2021 |
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An implant detachment system is described which utilizes a catheter utilizing an LC or tank circuit with an inductor and capacitor. The catheter electrically interacts with an implant delivered through the catheter to detach the implant.
Opening claim text (preview).
What is claimed is: 1. An implant delivery system comprising: a voltage source; a catheter; an LC circuit located on the catheter and connected to the voltage source, the LC circuit having a capacitor and an inductive coil; a pusher distally connected to an implant, the implant and pusher configured to be delivered through the catheter; a detachment junction between the pusher and the implant; the voltage source operable to provide current through the LC circuit so as to induce a current through the detachment junction of the pusher sufficient to detach the implant from the pusher. 2. The implant delivery system of claim 1 , wherein the capacitor comprises an inner tubular marker band and an outer tubular marker band. 3. The implant delivery system of claim 2 , wherein the inductive coil is placed under the inner tubular marker band, over the outer tubular marker band, or in between the inner tubular marker band and the outer tubular marker band. 4. The implant delivery system of claim 1 , wherein the voltage source is part of a user interface. 5. The implant delivery system of claim 4 , wherein the user interface can calculate a resonant frequency of the LC circuit. 6. The implant delivery system of claim 5 , wherein the user interface is capable of driving the LC circuit at its resonant frequency. 7. The implant delivery system of claim 1 , wherein the voltage source is an AC voltage source. 8. The implant delivery system of claim 1 , further comprising one or more wires spanning the catheter and linking the voltage source to the LC circuit. 9. The implant delivery system of claim 1 , wherein the current flowing through the LC circuit of the catheter induces the current through the detachment junction of the pusher without the pusher and the catheter physically touching. 10. The implant delivery system of claim 1 , wherein the implant is an embolic coil. 11. An implant delivery system comprising: a voltage source; a catheter having a distally located LC circuit constituted by an inner tubular element, outer tubular element, and a coil; a pusher distally connected to an implant, the implant and pusher configured to be delivered through the catheter; a detachment junction between the pusher and the implant; the voltage source operable to provide current through the LC circuit so as to induce a current through the detachment junction of the pusher to detach the implant from the pusher. 12. The implant delivery system of claim 11 , wherein the detachment junction includes a heater coil and a tether spanning the length of the heater coil. 13. The implant delivery system of claim 12 , wherein the current flowing through the LC circuit of the catheter induces current to flow through the heater coil, thereby severing the tether and detaching the implant from the pusher. 14. The implant delivery system of claim 11 , wherein the implant is an embolic coil. 15. The implant delivery system of claim 14 , wherein the embolic coil includes a plurality of embolic coil segments. 16. The implant delivery system of claim 15 , further comprising a plurality of detachment junctions where a detachment junction is placed between each set of the embolic coil segments. 17. The implant delivery system of claim 11 , wherein the catheter's inner tubular element and outer tubular element comprise a capacitor, and the catheter's coil comprises an inductor coil.
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