Switch and method of manufacturing switch

Patent metadata

Field	Value
Publication number	US-11037741-B2
Application number	US-202016778049-A
Country	US
Kind code	B2
Filing date	Jan 31, 2020
Priority date	Feb 12, 2019
Publication date	Jun 15, 2021
Grant date	Jun 15, 2021

Abstract

A switch includes a housing, a switching mechanism housed in the housing and configured to switch a state of connection between at least two terminals exposed out of the housing by using a common contact and two switching contacts, and an electronic component that is disposed in the housing and electrically connects the terminals to each other. The switching mechanism includes a first metal plate that is connected to a first contact, which is one of the common contact and the two switching contacts, and includes a first exposed part to which a first electrode of the electronic component is soldered by laser irradiation, and a second metal plate that is connected to a second contact, which is another one of the common contact and the two switching contacts, and includes a second exposed part to which a second electrode of the electronic component is soldered by laser irradiation.

First claim

What is claimed is:

1. A switch, comprising:
a housing;
a switching mechanism that is housed in the housing and configured to switch a state of connection between at least two terminals exposed out of the housing by using a common contact and two switching contacts; and
an electronic component that is disposed in the housing and electrically connects the at least two terminals to each other, wherein
the switching mechanism includes
a first metal plate that is connected to a first contact, which is one of the common contact and the two switching contacts, and includes a first exposed part to which a first electrode of the electronic component is soldered by laser irradiation, and
a second metal plate that is connected to a second contact, which is another one of the common contact and the two switching contacts, and includes a second exposed part to which a second electrode of the electronic component is soldered by laser irradiation;

the first exposed part includes a first electrode mounting part on which the first electrode is placed, a first soldering part on which solder is placed, and a first peripheral part disposed along an edge of the first soldering part;
the second exposed part includes a second electrode mounting part on which the second electrode is placed, a second soldering part on which solder is placed, and a second peripheral part disposed along an edge of the second soldering part; and
each of the first peripheral part and the second peripheral part has a U-shape.

2. The switch as claimed in claim 1 , wherein the first peripheral part includes a curved part.

3. The switch as claimed in claim 1 , wherein the first peripheral part includes a corner.

4. The switch as claimed in claim 1 , wherein the first exposed part and the second exposed part are arranged symmetrically with respect to the electronic component.

5. The switch as claimed in claim 1 , wherein the first exposed part of the first metal plate and a remaining part of the first metal plate are formed of different materials.

6. The switch as claimed in claim 1 , wherein the second exposed part of the second metal plate and a remaining part of the second metal plate are formed of different materials.

7. The switch as claimed in claim 1 , wherein
the first exposed part of the first metal plate and a remaining part of the first metal plate are formed monolithically with a same material.

8. The switch as claimed in claim 1 , wherein the second exposed part of the second metal plate and a remaining part of the second metal plate are formed monolithically with a same material.

9. The switch as claimed in claim 1 , wherein the electronic component is a resistor.

10. The switch as claimed, in claim 1 , wherein
the housing includes a case and a holding part that holds the first metal plate and the second metal plate; and
the holding part is formed of a material with a heat distortion temperature lower than a reflow temperature.

11. A method of manufacturing a switch that includes
a housing,
a switching mechanism that is housed in the housing and configured to switch a state of connection between at least two terminals exposed out of the housing by using a common contact and two switching contacts, and
an electronic component that is disposed in the housing, and electrically connects the at least two terminals to each other,
the switching mechanism including
a first metal plate that is connected to a first contact, which is one of the common contact and the two switching contacts, and includes a first exposed part, and
a second metal plate that is connected to a second contact, which is another one of the common contact and the two switching contacts, and includes a second exposed part;

the first exposed part including a first electrode mounting part, a first soldering part, and a first peripheral part disposed along an edge of the first soldering part;
the second exposed part including a second electrode mounting part, a second soldering part, and a second peripheral part disposed along an edge of the second soldering part; and
each of the first peripheral part and the second peripheral part having a U-shape, the method comprising:
applying solder to the first soldering part, placing a first electrode of the electronic component on the first electrode mounting part, and soldering the first electrode of the electronic component by laser irradiation to the first exposed part; and
applying solder to the second soldering part, placing a second electrode of the electronic component on the second electrode mounting part, and soldering the second electrode of the electronic component by laser irradiation to the second exposed part.

12. A switch, comprising:
a housing;
a switching mechanism that is housed, in the housing and configured to switch a state of connection between at least two terminals exposed out of the housing by using a common contact and two switching contacts; and
an electronic component that is disposed in the housing and electrically connects the at least two terminals to each other, wherein
the switching mechanism includes
a first metal plate that is connected to a first contact, which is one of the common contact and the two switching contacts, and includes a first exposed part to which a first electrode of the electronic component is soldered by laser irradiation, and
a second metal plate that is connected to a second contact, which is another one of the common contact and the two switching contacts, and includes a second exposed part to which a second electrode of the electronic component is soldered by laser, irradiation;

the first exposed part includes a first electrode mounting part on which the first electrode is placed;
the second exposed part includes a second electrode mounting part on which the second electrode is placed;
the first exposed part further includes a first protruding part that protrudes from the first electrode mounting part in a direction away from the second electrode mounting part;
the second exposed part further includes a second protruding part that protrudes, from the second electrode mounting part in a direction away from the first electrode mounting part;
the first metal plate further includes a first connecting part that connects the first exposed part to a remaining part of the first metal plate, the first connecting part being disposed closer to the second exposed part than the first protruding part; and
the second metal plate further includes a second connecting part that connects the second exposed part to a remaining part of the second metal plate, the second connecting part being disposed closer to the first exposed part than the second protruding part.

Assignees

• Alps Alpine Co Ltd

Inventors

• Umezu Takahiro
• Tanaka Takaki
• Natsuizaka Keiko

Classifications

• H01H1/365

  Bridging contacts · CPC title

• H01H2229/048

  Insertion moulding · CPC title

• H01H2229/04

  Solder problems · CPC title

• H01H11/06

  Fixing of contacts to carrier {; Fixing of contacts to insulating carrier} · CPC title

• H01H2011/0087

  Welding switch parts by use of a laser beam · CPC title