Ceramic electronic component and method for manufacturing ceramic electronic component

Patent metadata

Field	Value
Publication number	US-11037729-B2
Application number	US-201916296541-A
Country	US
Kind code	B2
Filing date	Mar 8, 2019
Priority date	Nov 2, 2016
Publication date	Jun 15, 2021
Grant date	Jun 15, 2021

Abstract

A ceramic electronic component that includes a plurality of ceramic layers which are stacked together, and an internal conductor layer disposed between two adjacent ceramic layers among the plurality of ceramic layers, and in which a ceramic layer that is adjacent to the internal conductor layer includes a plurality of pores.

First claim

The invention claimed is:

1. A ceramic electronic component comprising: a plurality of ceramic layers which are stacked together; and an internal conductor layer disposed between two adjacent ceramic layers among the plurality of ceramic layers, wherein a ceramic layer among the plurality of ceramic layers that is adjacent to the internal conductor layer contains a plurality of pores, wherein each of the plurality of pores are each inside a shell layer, and wherein a resin is present inside the plurality of pores.

2. The ceramic electronic component according to claim 1 , wherein the shell layer is formed of an inorganic substance.

3. The ceramic electronic component according to claim 2 , wherein the inorganic substance contains at least SiO 2 .

4. The ceramic electronic component according to claim 2 , wherein the inorganic substance is at least one selected from the group consisting of SiO 2 , Al 2 O 3 , ZrO 2 , TiO 2 , and MgO.

5. The ceramic electronic component according to claim 2 , wherein the shell layer has a thickness of 0.03 μm to 0.5 μm.

6. The ceramic electronic component according to claim 1 , wherein the ceramic layer among the plurality of ceramic layers that is adjacent to the internal conductor layer has a porosity of 10% to 45%.

7. The ceramic electronic component according to claim 6 , wherein the porosity is 30% to 40%.

8. The ceramic electronic component according to claim 1 , wherein the ceramic layer contains a glass component.

9. The ceramic electronic component according to claim 8 , wherein the glass component does not contain boron.

10. The ceramic electronic component according to claim 8 , wherein the glass component has a softening point of 800° C. to 950° C.

11. The ceramic electronic component according to claim 8 , wherein the glass component has a softening point of 830° C. to 930° C.

12. The ceramic electronic component according to claim 8 , wherein the glass component contains, as main components thereof, 47% to 67% by weight of SiO 2 , 21% to 41% by weight of BaO, and 10% to 18% by weight of Al 2 O 3 .

13. A method for manufacturing a ceramic electronic component, the method comprising: mixing a ceramic powder, a pore-forming agent, a binder, a plasticizer, and a solvent to form a slurry, wherein the pore-forming agent has a core-shell structure including a core portion made of a resin bead which is not dissolved in the solvent and a shell layer which covers the circumference of the core portion and is formed of an inorganic substance; producing a green sheet from the slurry; forming an internal conductor layer having a conductive pattern on the green sheet; obtaining a green multilayer body by stacking and pressure-bonding a plurality of green sheets including the green sheet having the internal conductor layer formed thereon; and firing the green multilayer body so as to produce a plurality of ceramic layers which are stacked together, and the internal conductor layer is between two adjacent ceramic layers among the plurality of ceramic layers, wherein a ceramic layer among the plurality of ceramic layers that is adjacent to the internal conductor layer contains a plurality of pores, wherein each of the plurality of pores are each inside the shell layer, and wherein a resin is present inside the plurality of pores.

14. The method for manufacturing a ceramic electronic component according to claim 13 , wherein the inorganic substance is at least one selected from the group consisting of SiO 2 , Al 2 O 3 , ZrO 2 , TiO 2 , and MgO.

15. The method for manufacturing a ceramic electronic component according to claim 13 , wherein the shell layer has a thickness of 0.03 μm to 0.5 μm.

16. The method for manufacturing a ceramic electronic component according to claim 13 , wherein the resin bead contains at least one selected from acrylic resins, divinylbenzene resins, and polyimide resins.

17. The method for manufacturing a ceramic electronic component according to claim 13 , wherein the ceramic powder contains a glass component.

18. The method for manufacturing a ceramic electronic component according to claim 17 , wherein the glass component has a softening point of 800° C. to 950° C.

Assignees

• Murata Manufacturing Co

Inventors

• Fujita Seiji

Classifications

• B32B18/00 Primary

  Layered products essentially comprising ceramics, e.g. refractory products · CPC title

• C04B2235/3244

  Zirconium oxides, zirconates, hafnium oxides, hafnates, or oxide-forming salts thereof · CPC title

• C04B2237/62

  Forming laminates or joined articles comprising holes, channels or other types of openings · CPC title

• C04B35/62897

  Coatings characterised by their thickness · CPC title

• C04B35/62685

  characterised by the order of addition of constituents or additives · CPC title