Integrated magnetic device with variable inductance and method for making such a device

Patent metadata

Field	Value
Publication number	US-11037717-B2
Application number	US-201815988097-A
Country	US
Kind code	B2
Filing date	May 24, 2018
Priority date	May 29, 2017
Publication date	Jun 15, 2021
Grant date	Jun 15, 2021

Abstract

Method for producing an integrated magnetic device with variable inductance, comprising:
a) making of a piezoelectric element on a first substrate; b) making of a first electrically conductive element on a face of the piezoelectric element, and fastening of the ends of the piezoelectric element to a second substrate such that the piezoelectric element is arranged facing a cavity formed between the second substrate and the piezoelectric element, the first electrically conductive element being arranged in and/or against the second substrate or against the piezoelectric element; c) removing of the first substrate; d) making of a second electrically conductive element on another face of the piezoelectric element; and further comprising the making of an electrical and/or magnetic coupling of the first and second electrically conductive elements, and the making of a magnetic element arranged against and/or in the piezoelectric element and between the electrically conductive elements.

First claim

The invention claimed is:

1. An integrated magnetic device with variable inductance, the device comprising:
a substrate;
a piezoelectric element comprising opposite first and second faces, of which the ends are fastened to the substrate and of which the first face is arranged on the side of the substrate, the piezoelectric element including an absence of release holes through the piezoelectric element;
a first cavity arranged between a portion of the substrate and the piezoelectric element;
a first electrically conductive element arranged on the side of the first face of the piezoelectric element, and a second electrically conductive element arranged on the side of the second face of the piezoelectric element, the first and second electrically conductive elements being electrically and/or magnetically coupled to one another;
a first magnetic element arranged against the first face of the piezoelectric element and between the piezoelectric element and the first electrically conductive element, and a second magnetic element arranged against the second face of the piezoelectric element and between the piezoelectric element and the second electrically conductive element.

2. The device according to claim 1 , wherein the first and/or the second electrically conductive element comprises an electrically conductive track forming meanders.

3. The device according to claim 1 , wherein the first electrically conductive element is arranged at least partially against the first face of the piezoelectric element and in the first cavity, and wherein the second electrically conductive element is arranged at least partially against the second face of the piezoelectric element.

4. The device according to claim 1 , wherein the first electrically conductive element is arranged in and/or against the substrate such that the first face of the piezoelectric element is arranged facing the first electrically conductive element and spaced from the first electrically conductive element by the first cavity, and wherein the second electrically conductive element is arranged in and/or against another substrate such that the second face of the piezoelectric element is arranged facing the second electrically conductive element and spaced from the second electrically conductive element by a second cavity formed between the piezoelectric element and a portion of said other substrate.

5. The device according to claim 1 , wherein each one of the first and second magnetic elements comprises a stack of at least one portion of ferromagnetic material and of at least one portion of antiferromagnetic material.

6. The device according to claim 1 , further comprising:
at least one electrically conductive via electrically connecting the first and second electrically conductive elements to one another in series or at least one portion of magnetic material passing through the piezoelectric element and magnetically coupling the first and second electrically conductive elements to one another.

7. The device according to claim 1 , further comprising:
at least one electrically conductive via electrically connecting the first and second electrically conductive elements to one another in series, and
at least one portion of magnetic material passing through the piezoelectric element and magnetically coupling the first and second electrically conductive elements to one another.

Assignees

• Commissariat Energie Atomique

Inventors

• Viala Bernard
• Achard Herve

Classifications

• H01F10/3218

  Exchange coupling of magnetic films via an antiferromagnetic interface (H01F10/3268 takes precedence) · CPC title

• H01F27/022

  Encapsulation · CPC title

• H01F21/08 Primary

  by varying the permeability of the core, e.g. by varying magnetic bias · CPC title

• H01F41/32

  for applying conductive, insulating or magnetic material on a magnetic film {, specially adapted for a thin magnetic film} · CPC title

• H02N2/0075

  Electrical details, e.g. drive or control circuits or methods · CPC title