Adjustable clearance for computing devices

Patent metadata

Field	Value
Publication number	US-11036264-B2
Application number	US-201716649178-A
Country	US
Kind code	B2
Filing date	Dec 15, 2017
Priority date	Dec 15, 2017
Publication date	Jun 15, 2021
Grant date	Jun 15, 2021

Abstract

Examples disclosed herein provide a computing device. One example computing device includes a heat generating component disposed within the computing device, and shape memory material (SMM) that adjusts a clearance below a bottom surface of the computing device according to a temperature of the heat generating component.

First claim

What is claimed is:

1. A computing device comprising:
a display member, and
a base member rotatably connected to the display member, wherein the base member comprises:
a heat generating component disposed with the base member;
a flexible material; and
shape memory material (SMM) that is to extend into the flexible material to adjust a clearance below a bottom surface of the base member according to a temperature of the heat generating component; wherein the flexible material is to accommodate the SMM and stretch when the SMM is extended into the flexible material.

2. The computing device of claim 1 , wherein when the temperature of the heat generating component is to exceed a threshold value, the SMM is to extend to increase the clearance below the bottom surface of the base member.

3. The computing device of claim 2 , wherein when the temperature of the heat generating component is to fall back below the threshold value, the SMM is to compress to decrease the clearance below the bottom surface of the base member.

4. The computing device of claim 1 , comprising a higher thermal conductivity component coupled to the heat generating component and the SMM.

5. The computing device of claim 4 , wherein heat generated by the heat generating component is to transfer to the SMM via the higher thermal conductivity component, wherein the adjustment of the SMM corresponds to the heat transferred to the SMM.

6. The computing device of claim 1 , wherein the base member comprises:
a vent along the bottom surface of the base member, and
a fan disposed within the base member to channel air to flow within the base member via the vent.

7. The computing device of claim 1 , wherein the flexible material is rubber.

8. A computing device comprising:
a heat generating component disposed within the computing device;
shape memory material (SMM);
a flexible material; and
a higher thermal conductivity component coupled to the heat generating component and the SMM, wherein the SMM is to extend into the flexible material to adjust a clearance below a bottom surface of the computing device according to a temperature of the heat generating component wherein the flexible material is to accommodate the SMM and stretch when the SMM is extended.

9. The computing device of claim 8 , wherein heat generated by the heat generating component is to transfer to the SMM via the higher thermal conductivity component, wherein the adjustment of the SMM corresponds to the heat transferred to the SMM.

10. The computing device of claim 8 , wherein when the temperature of the heat generating component is to exceed a threshold value, the SMM is to extend to increase the clearance below the bottom surface of the computing device.

11. The computing device of claim 10 , wherein when the temperature of the heat generating component is to fall back below the threshold value, the SMM is to compress to decrease the clearance below the bottom surface of the computing device.

12. The computing device of claim 8 , wherein the flexible material is rubber.

13. A computing device comprising: a display member; and
a base member rotatably connected to the display member, wherein the base member comprises:
a heat generating component disposed within the base member;
a flexible material; and
shape memory material (SMM) that extends into the flexible material to adjust a clearance below a bottom surface of the base member according to a temperature of the heat generating component; wherein the flexible material is to accommodate the SMM and stretch when the SMM is extended.

14. The computing device of claim 13 , wherein when the temperature of the heat generating component is to exceed a threshold value, the SMM is to extend to increase the clearance below the bottom surface of the base member.

15. The computing device of claim 14 , wherein when the temperature of the heat generating component is to fall back below the threshold value, the SMM is to compress to decrease the clearance below the bottom surface of the base member.

16. The computing device of claim 13 , wherein the flexible material is rubber.

Assignees

• Hewlett Packard Development Co

Inventors

• Zhang Baosheng
• Kanas Derek
• Park Chan
• Elsey Andrew

Classifications

• G06F1/203 Primary

  for portable computers, e.g. for laptops · CPC title

• G06F1/1616 Primary

  with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position · CPC title

• G06F1/206

  comprising thermal management · CPC title

• G06F1/1656

  Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203) · CPC title

• H05K5/0213

  Venting apertures; Constructional details thereof · CPC title