Non-contact magnetostrictive sensor alignment

US11035744B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11035744-B2
Application numberUS-202016929515-A
CountryUS
Kind codeB2
Filing dateJul 15, 2020
Priority dateMay 26, 2017
Publication dateJun 15, 2021
Grant dateJun 15, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A sensor system for positioning, orienting, and/or aligning a sensor assembly to a target object are provided. In some embodiments, the sensor system can include a sensor assembly and a control and processing module coupled to the sensor assembly. The control and processing module can be configured to process signals generate by the sensor assembly. The sensor system can include a mounting assembly configured to receive the sensor assembly and to position the sensor assembly relative to a surface of a target object. The mounting assembly can include a retaining element configured to translate along a first axis.

First claim

Opening claim text (preview).

What is claimed is: 1. A sensor system, comprising: a sensor assembly; a control and processing module coupled to the sensor assembly and configured to process signals generated by the sensor assembly; and a mounting assembly configured to receive the sensor assembly and to position the sensor assembly relative to a surface of a target, the mounting assembly including a retaining element configured to translate along a first axis. 2. The sensor system of claim 1 , wherein the mounting assembly includes an extension arm coupled to the sensor assembly and a rigid support coupled to the extension arm. 3. The sensor system of claim 1 , wherein the sensor assembly further comprises a proximity sensor configured to determine a size of a gap formed between the proximity sensor and the target. 4. The sensor system of claim 3 , wherein the control and processing module processes the raw stress signals and generates a corrected stress signal based on the determined size of the gap. 5. The sensor system of claim 1 , wherein the sensor assembly includes a housing and a sensor head disposed within the housing. 6. The sensor system of claim 5 , wherein the housing includes a proximal end and a distal end. 7. The sensor system of claim 6 , wherein the proximal end of the housing is formed from one of stainless steel and aluminum and/or the distal end of the housing is formed from one of a ceramic and a polymer. 8. The sensor system of claim 5 , wherein the sensor head includes a drive element and at least one detection element. 9. The sensor system of claim 8 , wherein the control and processing module provides an alternating current input drive signal to the drive element to cause a magnetic flux to be generated in a central arm of the sensor assembly. 10. The sensor system of claim 9 , wherein the control and processing module receives raw stress signals generated by the at least one detection element based on the at least one detection element detecting the magnetic flux generated in the central arm of the sensor assembly. 11. The sensor system of claim 10 , wherein the at least one detection element generates the raw stress signals after the magnetic flux has passed through a gap formed between the at least one detection element and the target. 12. The sensor system of claim 11 , wherein a magnitude of the raw stress signals correspond to a stress state of the target and/or a size of the gap. 13. The sensor system of claim 1 , wherein the sensor assembly can be adjusted with respect to a pitch axis of the sensor assembly, a yaw axis of the sensor assembly, and/or a roll axis of the sensor assembly, via the mounting assembly. 14. The sensor system of claim 1 , wherein the mounting assembly further includes an adjustment assembly coupled to the retaining element and a frame assembly coupled to the adjustment assembly, the frame assembly including a first member coupled to the adjustment assembly, a second member pivotally coupled to the first member about a second axis extending transverse to the first axis, and a third member pivotally coupled to the second member about a third axis extending transverse to the first and second axes. 15. The sensor system of claim 14 , wherein pivotal movement of the first member relative to the second member is configured to cause rotation of the retaining element about the second axis, and further wherein pivotal movement of the second member relative to the third member is configured to cause rotation of the retaining element about the third axis. 16. The sensor system of claim 14 , wherein the adjustment assembly includes a movable member configured to couple the adjustment assembly with the retaining element and a frame to which the movable member is coupled. 17. The sensor system of claim 16 , wherein the movable member and the frame are configured to couple a rotatable adjuster configured to slidably position the moveable member. 18. The sensor system of claim 17 , wherein the rotatable adjuster is configured to be adjustable to cause the sensor assembly to move proximally or distally with respect to an axis that is parallel to a surface of the target. 19. The sensor system of claim 1 , wherein the retaining element is formed as a clamp configured to releasably engage the sensor assembly received within a central bore of the retaining element. 20. The sensor system of claim 19 , wherein the retaining element includes first and second pairs of arms extending from the clamp at an opening of the clamp.

Assignees

Inventors

Classifications

  • G01D11/30Primary

    Supports specially adapted for an instrument; Supports specially adapted for a set of instruments · CPC title

  • by mounting means · CPC title

  • Housings for sensors · CPC title

  • G01L1/125Primary

    by using magnetostrictive means (magnetostrictive sensors H10N35/101) · CPC title

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Frequently asked questions

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What does patent US11035744B2 cover?
A sensor system for positioning, orienting, and/or aligning a sensor assembly to a target object are provided. In some embodiments, the sensor system can include a sensor assembly and a control and processing module coupled to the sensor assembly. The control and processing module can be configured to process signals generate by the sensor assembly. The sensor system can include a mounting asse…
Who is the assignee on this patent?
Baker Hughes A Ge Co Llc
What technology area does this patent fall under?
Primary CPC classification G01D11/30. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jun 15 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).